Headers, Receptacles, Female Sockets

Results: 2
Manufacturer
Preci-DipSullins Connector Solutions
Series
310SFH11
Packaging
BulkTray
Connector Type
HeaderSocket
Number of Positions
340
Number of Rows
12
Row Spacing - Mating
0.100" (2.54mm)-
Insulation Height
0.165" (4.20mm)0.335" (8.51mm)
Contact Length - Post
0.125" (3.18mm)0.126" (3.20mm)
Operating Temperature
-55°C ~ 125°C-40°C ~ 105°C
Contact Finish - Post
GoldTin
Features
-Polarizing Key
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Contact Type
Style
Number of Positions
Number of Positions Loaded
Pitch - Mating
Number of Rows
Row Spacing - Mating
Mounting Type
Termination
Fastening Type
Contact Finish - Mating
Contact Finish Thickness - Mating
Insulation Color
Insulation Height
Contact Length - Post
Operating Temperature
Material Flammability Rating
Contact Finish - Post
Mated Stacking Heights
Ingress Protection
Features
Current Rating (Amps)
Voltage Rating
11,318
In Stock
1 : ¥16.09000
Tray
Tray
Active
Header
Female Socket
Board to Board
40
All
0.100" (2.54mm)
2
0.100" (2.54mm)
Through Hole
Solder
Push-Pull
Gold
Flash
Black
0.335" (8.51mm)
0.126" (3.20mm)
-40°C ~ 105°C
UL94 V-0
Gold
-
-
Polarizing Key
3A
-
3xx-8x-103-41-001101
310-87-103-41-001101
CONN SOCKET 3POS 0.1 GOLD PCB
Preci-Dip
3,487
In Stock
1 : ¥3.69000
Bulk
Bulk
Active
Socket
Female Socket
Board to Board
3
All
0.100" (2.54mm)
1
-
Through Hole
Solder
Push-Pull
Gold
Flash
Black
0.165" (4.20mm)
0.125" (3.18mm)
-55°C ~ 125°C
UL94 V-0
Tin
-
-
-
3A
-
Showing
of 2

Headers, Receptacles, Female Sockets


This type of header (receptacle) contains female sockets within a plastic housing and is meant to be mated with a rectangular cable connector or a male pin header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.