Prototype Boards Perforated

Results: 4
Proto Board Type
Breadboard, Din Rail MountBreadboard, General Purpose
Pitch
0.100" (2.54mm)0.100" (2.54mm), 0.200" (5.08mm)
Size / Dimension
3.42" L x 0.56" W (86.9mm x 14.3mm)3.42" L x 1.29" W (86.9mm x 32.8mm)3.42" L x 1.97" W (86.9mm x 50.0mm)6.15" L x 3.42" W (156.2mm x 86.9mm)
Stocking Options
Environmental Options
Media
Marketplace Product
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of 4
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Plating
Pitch
Circuit Pattern
Edge Contacts
Hole Diameter
Size / Dimension
Board Thickness
DMB-4769-CB
DMB-4769-CB
BREADBOARD DIN RAIL MOUNT PTH
Bud Industries
61
In Stock
640
Factory
1 : ¥11.90000
Bulk
Bulk
Active
Breadboard, Din Rail Mount
Plated Through Hole (PTH)
0.100" (2.54mm)
Pad Per Hole (Square)
-
0.051" (1.30mm)
3.42" L x 0.56" W (86.9mm x 14.3mm)
0.063" (1.60mm)
DMB-4770-CB
DMB-4770-CB
BREADBOARD DIN RAIL MOUNT PTH
Bud Industries
73
In Stock
138
Factory
1 : ¥32.02000
Bulk
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm), 0.200" (5.08mm)
Pad Per Hole (Square)
-
0.051" (1.30mm)
3.42" L x 1.29" W (86.9mm x 32.8mm)
0.063" (1.60mm)
DMB-4771-CB
DMB-4771-CB
BREADBOARD DIN RAIL MOUNT PTH
Bud Industries
70
In Stock
224
Factory
1 : ¥50.08000
Bulk
Bulk
Active
Breadboard, Din Rail Mount
Plated Through Hole (PTH)
0.100" (2.54mm), 0.200" (5.08mm)
Pad Per Hole (Square)
-
0.051" (1.30mm)
3.42" L x 1.97" W (86.9mm x 50.0mm)
0.063" (1.60mm)
DMB-4774-CB
DMB-4774-CB
BREADBOARD DIN RAIL MOUNT PTH
Bud Industries
28
In Stock
343
Factory
1 : ¥151.05000
Bulk
Bulk
Active
Breadboard, Din Rail Mount
Plated Through Hole (PTH)
0.100" (2.54mm)
Pad Per Hole (Square)
-
0.051" (1.30mm)
6.15" L x 3.42" W (156.2mm x 86.9mm)
0.063" (1.60mm)
Showing
of 4

Prototype Boards Perforated


Products in this category are used as a platform for circuit construction in hobby, experimental, and similar settings where adaptability is desired. Characterized by having a series of holes drilled through their thickness at regular intervals, they may also include a solderable conductive layer around these holes, which may or may not be interconnected, depending on the nature of a specific product. Often used for constructing circuits based on through-hole component packaging, similar products lacking perforation are more commonly used for circuit development using surface mounted components.