I/O Expanders

Results: 3
Manufacturer
Renesas Electronics CorporationTexas Instruments
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)Tube
Number of I/O
1624
Interface
I2C, SMBusParallel
Interrupt Output
NoYes
Features
-POR
Output Type
Open DrainPush-Pull
Current - Output Source/Sink
2.5mA10mA, 25mA
Voltage - Supply
1.65V ~ 5.5V4.5V ~ 5.5V
Operating Temperature
-40°C ~ 85°C0°C ~ 70°C
Mounting Type
Surface MountThrough Hole
Package / Case
24-TSSOP (0.173", 4.40mm Width)40-DIP (0.600", 15.24mm)44-LCC (J-Lead)
Supplier Device Package
24-TSSOP40-PDIP44-PLCC (16.58x16.58)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results
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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
DigiKey Programmable
Number of I/O
Interface
Interrupt Output
Features
Output Type
Current - Output Source/Sink
Clock Frequency
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
24-TSSOP
TCA9535PWR
IC XPND 400KHZ I2C SMBUS 24TSSOP
Texas Instruments
8,309
In Stock
1 : ¥11.49000
Cut Tape (CT)
2,000 : ¥4.89117
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Not Verified
16
I2C, SMBus
Yes
POR
Push-Pull
10mA, 25mA
400 kHz
1.65V ~ 5.5V
-40°C ~ 85°C
Surface Mount
24-TSSOP (0.173", 4.40mm Width)
24-TSSOP
761
In Stock
1 : ¥147.28000
Tube
-
Tube
Active
Not Verified
24
Parallel
No
-
Open Drain
2.5mA
-
4.5V ~ 5.5V
0°C ~ 70°C
Through Hole
40-DIP (0.600", 15.24mm)
40-PDIP
2,892
In Stock
1 : ¥155.81000
Tube
-
Tube
Active
Not Verified
24
Parallel
No
-
Open Drain
2.5mA
-
4.5V ~ 5.5V
0°C ~ 70°C
Surface Mount
44-LCC (J-Lead)
44-PLCC (16.58x16.58)
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of 3

I/O Expanders

Devices in this family are used in conjunction with microcontrollers, microprocessors, or similar devices for the purpose of increasing the number of signal connections available for connecting peripheral devices. The typical concept of operation involves the use of serial communications requiring only a few I/O lines on the host device to read/write the status of many input/output pins on the expander device. The technique exchanges speed of communication for increased connectivity, and is best suited for applications where fast response is not critical, such as in many human interface applications.