IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

SA1000300000G SA-7.43- 10P ; CLIP:TIN200U" PI Amphenol Anytek	0 In Stock Check Lead Time	5,600 : ¥2.31243 Bulk	SU	Bulk	Active	SIP	10	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SU1210000000G SU-2*6P BLACK ; 10.0MM CLIP PLA Amphenol Anytek	0 In Stock Check Lead Time	3,200 : ¥3.88030 Bulk	SU	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
SU1210200000G SU-2*6P RED ; 10.0MM CLIP PLATI Amphenol Anytek	0 In Stock Check Lead Time	3,200 : ¥6.70781 Bulk	SU	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.