IC Sockets

Results: 3
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)32 (2 x 16)40 (2 x 20)
Contact Finish - Mating
TinTin-Lead
Features
Open FrameOpen Frame, No Center Bar
Contact Finish - Post
TinTin-Lead
Contact Finish Thickness - Post
60.0µin (1.52µm)-
Contact Material - Post
Brass, CopperNickel
Housing Material
Polybutylene Terephthalate (PBT), Glass FilledPolyester
Operating Temperature
-55°C ~ 125°C-40°C ~ 105°C
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1-2199298-3
1-2199298-3
CONN IC DIP SOCKET 14POS TIN
TE Connectivity AMP Connectors
2,133
In Stock
1 : ¥1.72000
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Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1-2199300-2
1-2199300-2
CONN IC DIP SOCKET 32POS TINLEAD
TE Connectivity AMP Connectors
1,365
In Stock
1 : ¥3.69000
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Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin-Lead
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame, No Center Bar
Solder
0.100" (2.54mm)
Tin-Lead
60.0µin (1.52µm)
Brass, Copper
Polyester
-55°C ~ 125°C
1-2199299-5
1-2199299-5
40P,DIP SKT,600 CL,LDR,PB FREE
TE Connectivity AMP Connectors
1,249
In Stock
1 : ¥7.88000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Nickel
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Showing
of 3

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.