Heat Sinks

Results: 2
Manufacturer
Advanced Thermal Solutions Inc.CUI Devices
Series
HSBpushPIN™
Packaging
BoxTray
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Adhesive (Not Included)Push Pin
Shape
Square, FinsSquare, Pin Fins
Length
0.394" (10.00mm)1.378" (35.00mm)
Width
0.394" (10.00mm)1.378" (35.00mm)
Fin Height
0.275" (7.00mm)0.790" (20.00mm)
Power Dissipation @ Temperature Rise
2.0W @ 75°C-
Thermal Resistance @ Forced Air Flow
13.13°C/W @ 100 LFM16.50°C/W @ 200 LFM
Thermal Resistance @ Natural
37.90°C/W-
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,611
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
285
In Stock
1 : ¥28.98000
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.790" (20.00mm)
-
13.13°C/W @ 100 LFM
-
Aluminum
Blue Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.