Heat Sinks

Results: 2
Series
-pushPIN™
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Push PinThermal Tape, Adhesive (Included)
Length
0.748" (19.00mm)0.984" (25.00mm)
Width
0.748" (19.00mm)0.984" (25.00mm)
Fin Height
0.374" (9.50mm)0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow
12.18°C/W @ 100 LFM24.00°C/W @ 200 LFM
Material Finish
Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
2,611
In Stock
1 : ¥26.93000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.590" (15.00mm)
-
12.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
1,727
In Stock
1 : ¥59.35000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.374" (9.50mm)
-
24.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.