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Manufacturer
AMDCologne ChipEfinix, Inc.IntelLattice Semiconductor CorporationMicrochip TechnologyMicrosemi CorporationTexas Instruments
Series
-*ACEX-1K®ACT™ 1ACT™ 2ACT™ 3APEX-20K®APEX-20KC®APEX-20KE®Arria 10 GTArria 10 GXArria GX
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)TrayTube
Product Status
ActiveDiscontinued at Digi-KeyLast Time BuyNot For New DesignsObsolete
DigiKey Programmable
Not VerifiedVerified
Number of LABs/CLBs
2632424863647280848896100
Number of Logic Elements/Cells
128208238256260336384432466480504512
Total RAM Bits
204825603200460853256144627281929421103681228812800
Number of I/O
101217182123252627282933
Number of Gates
120015002000250030004000450050006000750080009000
Voltage - Supply
0.698V ~ 0.742V0.698V ~ 0.876V0.77V ~ 0.97V0.82V ~ 0.88V0.82V0.825V ~ 0.876V0.86V ~ 1.15V0.87V ~ 0.93V0.87V ~ 0.97V0.87V ~ 0.98V0.873V ~ 0.927V0.880V ~ 0.979V
Mounting Type
-Surface MountThrough Hole
Operating Temperature
-55°C ~ 100°C (TJ)-55°C ~ 125°C (TC)-55°C ~ 125°C (TJ)-55°C ~ 125°C-40°C ~ 100°C (TA)-40°C ~ 100°C (TJ)-40°C ~ 100°C-40°C ~ 105°C (TJ)-40°C ~ 125°C (TA)-40°C ~ 125°C (TJ)-40°C ~ 135°C (TJ)-40°C ~ 85°C (TA)
Grade
-Automotive
Qualification
-AEC-Q100
Package / Case
16-XFBGA, WLCSP20-UFBGA, WLCSP25-UFBGA, WLCSP25-WLCSP25-XFBGA, WLCSP30-UFBGA, WLCSP32-UFQFN Exposed Pad32-VFQFN Exposed Pad36-UFBGA, WLCSP36-VFBGA36-WFBGA, CSPBGA36-XFBGA, WLCSP
Supplier Device Package
16-WLCSP (1.4x1.48)20-WLCSP (1.71x2.06)25-WLCSP (1.7x1.7)25-WLCSP30-WLCSP (2.54x2.12)32-QFN (5x5)36-UCBGA (2.5x2.5)36-UCFBGA (2.5x2.5)36-UCSP (3x3)36-VBGA (3.47x3.4)36-WLCSP (2.1x2.1)36-WLCSP (2.54x2.59)
Stocking Options
Environmental Options
Media
Marketplace Product
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