Edgeboard Connectors

Results: 2
Manufacturer
Samtec Inc.TE Connectivity AMP Connectors
Series
-MEC5 - RA
Packaging
Cut Tape (CT)Tape & Reel (TR)
Card Type
M.2 (NGFF) Mini CardNon Specified - Dual Edge
Number of Positions/Bay/Row
80-
Number of Positions
67160
Card Thickness
0.062" (1.57mm)-
Features
Board GuideBoard Guide, Solder Retention
Contact Finish Thickness
10.0µin (0.25µm)30.0µin (0.76µm)
Operating Temperature
-55°C ~ 125°C-40°C ~ 80°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
1-2199119-6
1-2199119-6
CONN M.2 FMALE 67POS 0.020 GOLD
TE Connectivity AMP Connectors
7,708
In Stock
1 : ¥15.60000
Cut Tape (CT)
1,200 : ¥10.19968
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Active
M.2 (NGFF) Mini Card
Female
-
67
-
2
0.020" (0.50mm)
Dual
Board Guide
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
30.0µin (0.76µm)
-
Black
-
-40°C ~ 80°C
MEC5-080-01-L-RA-W2-TR
MEC5-080-01-L-RA-W2-TR
CONN EDGE DUAL FML 160POS 0.020
Samtec Inc.
1,832
In Stock
1 : ¥106.40000
Cut Tape (CT)
275 : ¥74.54567
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Active
Non Specified - Dual Edge
Female
80
160
0.062" (1.57mm)
2
0.020" (0.50mm)
Dual
Board Guide, Solder Retention
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
-
Black
-
-55°C ~ 125°C
Showing
of 2

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.