Diode Arrays

Results: 2
Manufacturer
onsemiRohm Semiconductor
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
30 V100 V
Current - Average Rectified (Io) (per Diode)
100mA215mA
Voltage - Forward (Vf) (Max) @ If
450 mV @ 10 mA1.25 V @ 150 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
500 nA @ 10 V1 µA @ 100 V
Operating Temperature - Junction
-65°C ~ 150°C150°C (Max)
Package / Case
SC-70, SOT-323SC-89, SOT-490
Supplier Device Package
EMD3FSC-70-3 (SOT323)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Diode Configuration
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io) (per Diode)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Operating Temperature - Junction
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
SC-70-3
SBAV99WT1G
DIODE ARRAY GP 100V 215MA SC70-3
onsemi
46,653
In Stock
1 : ¥1.81000
Cut Tape (CT)
3,000 : ¥0.30787
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 Pair Series Connection
Standard
100 V
215mA
1.25 V @ 150 mA
Fast Recovery =< 500ns, > 200mA (Io)
6 ns
1 µA @ 100 V
-65°C ~ 150°C
Automotive
AEC-Q101
Surface Mount
SC-70, SOT-323
SC-70-3 (SOT323)
EMD3F
RB548WMTL
DIODE ARR SCHOTT 30V 100MA EMD3F
Rohm Semiconductor
50
In Stock
1 : ¥2.30000
Cut Tape (CT)
3,000 : ¥0.38482
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 Pair Series Connection
Schottky
30 V
100mA
450 mV @ 10 mA
Small Signal =< 200mA (Io), Any Speed
-
500 nA @ 10 V
150°C (Max)
-
-
Surface Mount
SC-89, SOT-490
EMD3F
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Diode Arrays

Products within the diode and rectifier array family incorporate two or more discrete diodes within a single package. They are characterized in terms similar to those used for single discrete diodes, with the addition of a "Diode Configuration" attribute indicating the presence and character of any internal connections between the diodes in the device. Note that arrays with a full-bridge configuration are specifically excluded, and listed as a separate product family.