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Manufacturer
3MAces ConnectorsAdam TechAmphenol CONECAmphenol ICC (Commercial Products)Amphenol ICC (FCI)ATTEND TechnologyCarlisleITCinch Connectivity SolutionsCW IndustriesDigiEaton - Electronics Division
Series
-*123A1701712066532069232072622072632086102433000
Packaging
-BagBoxBulkCut Tape (CT)Digi-Reel®StripTape & Box (TB)Tape & Reel (TR)TrayTube
Product Status
ActiveDiscontinued at Digi-KeyLast Time BuyNot For New DesignsObsolete
Card Type
-AGP Pro 1.5VAGP Pro UniversalAGPAGP, UniversalAdvanced Mezzanine Card B+, MicroTCACPU - Slot 1ComputerbusFits Female EdgecardsISAM.2 (NGFF) Mini CardMCA
Gender
-FemaleMale
Number of Positions/Bay/Row
11; 11; 101; 10; 1; 1; 1; 1; 1; 1; 1; 11; 12; 1; 11; 12; 1; 1; 1; 11; 141; 18; 31; 1; 11; 1; 181; 1; 1; 101; 1; 1; 1; 11
Number of Positions
2 (Power)23 (Power)34 (Power)456 (4 Loaded)6 (Power)678 (4 + 4 Power)
Card Thickness
0.031" (0.79mm)0.031" (0.80mm)0.032" ~ 0.070" (0.81mm ~ 1.78mm)0.039" (1.00mm)0.047" (1.20mm)0.050" (1.27mm)0.051" ~ 0.067" (1.30mm ~ 1.70mm)0.051" ~ 0.071" (1.30mm ~ 1.80mm)0.054" ~ 0.070" (1.37mm ~ 1.78mm)0.054" ~ 0.071" (1.37mm ~ 1.80mm)0.054" ~ 0.072" (1.37mm ~ 1.82mm)0.055" (1.40mm)
Number of Rows
1248
Pitch
0.020" (0.50mm)0.024" (0.60mm)0.025" (0.64mm)0.026" (0.65mm)0.029" (0.75mm)0.030" (0.76mm)0.031" (0.80mm)0.039" (1.00mm)0.050" (1.27mm)0.059" (1.50mm)0.062" (1.57mm)0.079" (2.00mm)
Read Out
-DualSingle
Features
-Bi-Level - High DensityBi-Level - High Density, Board LockBi-Level - High Density, Card ExtenderBoard GuideBoard Guide, Board LockBoard Guide, Board Lock, Card ExtenderBoard Guide, Board Lock, Latch, Locking RampBoard Guide, Board Lock, LatchesBoard Guide, Board Lock, Locking RampBoard Guide, Board Lock, Pick and PlaceBoard Guide, Board Lock, Pick and Place, Solder Retention
Mounting Type
-Board Edge, Straddle MountBoard Edge, Surface MountBoard Edge, Through HoleBoard Edge, Through Hole, Right AngleFree Hanging (In-Line)Panel MountPanel Mount, Through HoleSurface MountSurface Mount, Right AngleSurface Mount, Through HoleThrough HoleThrough Hole, Right AngleWire Wrap
Termination
-CrimpIDCKinked Pin, SolderPress-FitPress-Fit, Wire WrapSolder Eyelet(s)SolderSolder, StaggeredSolder, Wire WrapWire Wrap
Contact Material
-Beryllium CopperBeryllium NickelBrassCopper AlloyCopperCopper, Nickel, Tin AlloyPhosphor Bronze - Tin PlatedPhosphor Bronze AlloyPhosphor BronzeSpinodal
Contact Finish
-Gold or Gold, GXT™Gold or Gold-PalladiumGoldGold, GXT™Gold-PalladiumTinTin-Lead
Contact Finish Thickness
1.00µin (0.025µm)2.00µin (0.051µm)3.00µin (0.076µm)3.94µin (0.10µm)5.00µin (0.127µm)5.11µin (0.130µm)8.00µin (0.203µm)10.0µin (0.25µm)11.8µin (0.30µm)15.0µin (0.38µm)16.0µin (0.41µm)20.0µin (0.51µm)29.5µin (0.75µm)30.0µin (0.76µm)
Contact Type
-Bifurcated Semi BellowsCantilever with Back-Up SpringCantileverCantilever, Make Before BreakFull Bellows with Back-Up SpringFull BellowsHairpin BellowsHairpin Bellows, Make Before BreakLoop BellowsSemi Bellows
Color
-BlackBlueBrownGrayGreen (Dark Green)GreenIvoryNaturalOrangeRedSilverWhiteYellow
Flange Feature
-Flush Mount, Floating Bobbin, 0.116" (2.95mm) DiaFlush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) DiaFlush Mount, Side Opening, Unthreaded, 0.128" (3.25mm) DiaFlush Mount, Side Opening, Unthreaded, 0.145" (3.68mm) DiaFlush Mount, Side Opening, Unthreaded, 0.146" (3.70mm) DiaFlush Mount, Top Opening, Threaded Insert, 4-40Flush Mount, Top Opening, Threaded Insert, M3Flush Mount, Top Opening, Threaded Insert, M3-0.5Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) DiaFlush Mount, Top Opening, Unthreaded, 0.126" (3.20mm) DiaFlush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
Operating Temperature
-65°C ~ 105°C-65°C ~ 125°C-65°C ~ 150°C-65°C ~ 200°C-65°C ~ 250°C-65°C ~ 85°C-55°C ~ 105°C-55°C ~ 125°C-55°C ~ 140°C-55°C ~ 185°C-55°C ~ 85°C-54°C ~ 85°C
Stocking Options
Environmental Options
Media
Marketplace Product
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