Bipolar Transistor Arrays

Results: 3
Manufacturer
Nexperia USA Inc.onsemi
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Transistor Type
1 NPN, 1 PNP2 NPN (Dual)
Voltage - Collector Emitter Breakdown (Max)
45V65V
Vce Saturation (Max) @ Ib, Ic
300mV @ 5mA, 100mA600mV @ 5mA, 100mA
Power - Max
300mW380mW
Operating Temperature
-55°C ~ 150°C (TJ)150°C (TJ)
Supplier Device Package
6-TSSOPSC-88/SC70-6/SOT-363
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Transistor Type
Current - Collector (Ic) (Max)
Voltage - Collector Emitter Breakdown (Max)
Vce Saturation (Max) @ Ib, Ic
Current - Collector Cutoff (Max)
DC Current Gain (hFE) (Min) @ Ic, Vce
Power - Max
Frequency - Transition
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SOT-363
BC847BDW1T1G
TRANS 2NPN 45V 0.1A SC88/SC70-6
onsemi
39,429
In Stock
1 : ¥1.81000
Cut Tape (CT)
3,000 : ¥0.30054
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
2 NPN (Dual)
100mA
45V
600mV @ 5mA, 100mA
15nA (ICBO)
200 @ 2mA, 5V
380mW
100MHz
-55°C ~ 150°C (TJ)
Surface Mount
6-TSSOP, SC-88, SOT-363
SC-88/SC70-6/SOT-363
SOT-363
BC846BDW1T1G
TRANS 2NPN 65V 0.1A SC88/SC70-6
onsemi
50,885
In Stock
1 : ¥1.81000
Cut Tape (CT)
3,000 : ¥0.30054
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
2 NPN (Dual)
100mA
65V
600mV @ 5mA, 100mA
15nA (ICBO)
200 @ 2mA, 5V
380mW
100MHz
-55°C ~ 150°C (TJ)
Surface Mount
6-TSSOP, SC-88, SOT-363
SC-88/SC70-6/SOT-363
SOT363
BC846BPN,115
TRANS NPN/PNP 65V 0.1A 6TSSOP
Nexperia USA Inc.
138,410
In Stock
1 : ¥2.22000
Cut Tape (CT)
3,000 : ¥0.37328
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 NPN, 1 PNP
100mA
65V
300mV @ 5mA, 100mA
15nA (ICBO)
200 @ 2mA, 5V
300mW
100MHz
150°C (TJ)
Surface Mount
6-TSSOP, SC-88, SOT-363
6-TSSOP
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of 3

Bipolar Transistor Arrays


Bipolar transistor arrays incorporate two or more discrete transistors in a shared package, either as electrically separate entities or with interconnections of some form between them being made inside the device package. Arrays in which the devices contained have closely matched or complementary characteristics, the co-packaged character minimizes temperature differences between devices during operation.