Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension

28-35W000-10 SOCKET ADAPT SOIC-W TO 28DIP 0.3 Aries Electronics	14 In Stock	1 : ¥142.27000 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SMD to DIP	SOIC	28	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	2.800" L x 0.500" W (71.12mm x 12.70mm)
20-35W000-11-RC SOCKET ADAPT SOIC-W TO 20DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	1 : ¥184.71000 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SMD to DIP	SOIC	20	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	2.000" L x 0.500" W (50.80mm x 12.70mm)

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Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.