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TS391SNL50 | ||
|---|---|---|
DigiKey Part Number | TS391SNL50-ND | |
Manufacturer | ||
Manufacturer Product Number | TS391SNL50 | |
Description | THERMALLY STABLE SOLDER PASTE NO | |
Manufacturer Standard Lead Time | 3 Weeks | |
Customer Reference | ||
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) | |
Datasheet | Datasheet | |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | - | |
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 4 | |
Process | Lead Free | |
Form | Jar, 1.76 oz (50g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | |
Shipping Info | - | |
Base Product Number |
Quantity
All prices are in CNY
Bulk
| Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
|---|---|---|
| 1 | ¥154.40000 | ¥154.40 |
Manufacturers Standard Package
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