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Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | 3M | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | SOIC | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | - | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | - | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | - | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES), Glass Filled | |
Operating Temperature | -55°C ~ 150°C | |
Termination Post Length | 0.140" (3.56mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating (Amps) | 1 A | |
Contact Resistance | - | |
Base Product Number |
Quantity
All prices are in CNY
Bulk
| Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
|---|---|---|
| 1 | ¥436.41000 | ¥436.41 |
| 10 | ¥400.48500 | ¥4,004.85 |
| 30 | ¥385.08400 | ¥11,552.52 |
| 50 | ¥372.24800 | ¥18,612.40 |
| 100 | ¥351.71060 | ¥35,171.06 |
Manufacturers Standard Package
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