Socket Adapters

Showing

of 12

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Convert From (Adapter End)	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material

20-350001-10 SOCKET ADAPTER SOJ TO 20DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	220 : ¥105.71586 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOJ	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
24-350000-10-HT SOCKET ADAPTER SOIC TO 24DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	32 : ¥124.57688 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
08-350000-10-HT SOCKET ADAPTER SOIC TO 8DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	48 : ¥134.19708 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
14-350000-10-HT SOCKET ADAPTER SOIC TO 14DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	28 : ¥138.67071 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
20-350000-10-HT SOCKET ADAPTER SOIC TO 20DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	38 : ¥138.67105 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
16-350000-10-HT SOCKET ADAPTER SOIC TO 16DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	24 : ¥144.93250 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
10-350000-10-HT SOCKET ADAPTER SOIC TO 10DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	24 : ¥144.93250 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	10	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
12-350000-10-HT SOCKET ADAPTER SOIC TO 12DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	24 : ¥144.93250 Bulk	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	12	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
20-350001-11-RC SOCKET ADAPTER SOJ TO 20DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	220 : ¥163.02645 Tube	Correct-A-Chip® 350000	Tube	Active	SOJ	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
28-350002-11-RC SOCKET ADAPTER SOIC TO 28DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	154 : ¥190.55812 Tube	Correct-A-Chip® 350000	Tube	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
18-350000-10-HT SOCKET ADAPTER SOIC TO 18DIP 0.3 Aries Electronics	0 In Stock	Active	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
28-350002-11-RC-P SOCKET ADAPTER SOIC TO 28DIP 0.3 Aries Electronics	0 In Stock	Discontinued at Digi-Key	Correct-A-Chip® 350000	Bulk	Discontinued at Digi-Key	SOIC	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass

Showing

of 12

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Socket adapters allow the use of ICs and transistors of one package type to be used in place of another package type such as adapting an eight-pin DIP package to a JEDEC socket package. Popular surface mount and through-hole packages may be converted to DIP, JEDEC, PGA, PLCC, QFP, SOIC and SOWIC.