IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

20-7800-10 CONN SOCKET SIP 20POS TIN Aries Electronics	0 In Stock Check Lead Time	40 : ¥95.21825 Bulk	700	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Carrier, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
2-1437542-7 CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C
1-1437542-0 CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C
1-1437542-1 CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C
2-1437542-9 CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C
5-1437542-2 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C
2-1437542-2 CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors	0 In Stock	Obsolete	700	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy	-55°C ~ 125°C

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.