Heat Sinks

Results: 4
Packaging
BoxBulk
Type
Board LevelBoard Level, Vertical
Package Cooled
Bridge RectifiersTO-220TO-247
Attachment Method
Bolt OnBolt On and Board Mounts
Shape
Rectangular, FinsSquare, Fins
Length
0.641" (16.28mm)1.000" (25.40mm)
Width
0.642" (16.30mm)1.000" (25.40mm)
Fin Height
1.000" (25.40mm)1.500" (38.10mm)
Power Dissipation @ Temperature Rise
2.0W @ 40°C3.0W @ 50°C4.0W @ 70°C-
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 300 LFM4.00°C/W @ 500 LFM5.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
12.40°C/W14.00°C/W16.40°C/W
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Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
E3A-T220-25E
E3A-T220-25E
BLACK ANODIZED HEATSINK
Ohmite
422
In Stock
1 : ¥16.99000
Bulk
Bulk
Active
Board Level
Bridge Rectifiers
Bolt On
Square, Fins
1.000" (25.40mm)
1.000" (25.40mm)
-
1.000" (25.40mm)
-
-
12.40°C/W
Aluminum
Black Anodized
E2A-T247-38E
E2A-T247-38E
BLACK ANODIZED HEATSINK
Ohmite
131
In Stock
1 : ¥18.06000
Box
Box
Active
Board Level, Vertical
TO-247
Bolt On and Board Mounts
Rectangular, Fins
0.641" (16.28mm)
0.642" (16.30mm)
-
1.500" (38.10mm)
4.0W @ 70°C
4.00°C/W @ 300 LFM
14.00°C/W
Aluminum
Black Anodized
E2A-T220-38E_View-2
E2A-T220-38E
BLACK ANODIZED HEATSINK
Ohmite
343
In Stock
1 : ¥18.31000
Bulk
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
0.641" (16.28mm)
0.642" (16.30mm)
-
1.500" (38.10mm)
3.0W @ 50°C
5.00°C/W @ 200 LFM
14.00°C/W
Aluminum
Black Anodized
E2A-T220-25E
E2A-T220-25E
BLACK ANODIZED HEATSINK
Ohmite
0
In Stock
Check Lead Time
1 : ¥17.49000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
0.641" (16.28mm)
0.642" (16.30mm)
-
1.000" (25.40mm)
2.0W @ 40°C
4.00°C/W @ 500 LFM
16.40°C/W
Aluminum
Black Anodized
Showing
of 4

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.