Tflex™ CR910 Thermal Interface Material
The Laird Thermal Materials two-part dispensable gap filler provides low thermal resistance and high reliability
Laird Tflex™ CR910 is at the forefront of thermal performance of liquid gap filler. It is a two-part dispensable gap filler that provides low thermal resistance and high reliability. This dispensable gap filler minimizes stress on the component during assembly while providing the reliability of a traditional thermal pad.
- Thermal conductivity of 9.2 W/mK
- Dispensable and compliant
- Easily reworkable
- Ideal for large and small gaps
- Meets RoHS and REACH requirements
- Datacenters
- Automotive central compute units
- High-speed microprocessors
- High-speed workstations

