TC1-200G | ||
---|---|---|
DigiKey Part Number | TC1-200G-ND | |
Manufacturer | ||
Manufacturer Product Number | TC1-200G | |
Description | HEAT SINK COMPOUND - HIGH DENSIT | |
Manufacturer Standard Lead Time | 4 Weeks | |
Customer Reference | ||
Detailed Description | Thermal Silicone Compound 200 gram Jar | |
Datasheet | Datasheet |
Type | Description | Select All |
---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | - | |
Packaging | Bulk | |
Part Status | Active | |
Type | Silicone Compound | |
Size / Dimension | 200 gram Jar | |
Usable Temperature Range | - | |
Color | White | |
Thermal Conductivity | 0.67W/m-K | |
Features | - | |
Shelf Life | 60 Months | |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) | |
Material Flammability Rating | - | |
Shelf Life Start | Date of Manufacture | |
Shipping Info | Shipped from Digi-Key | |
Digi-Key Storage | - |
Resource Type | Link |
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Datasheets | TC1-200G Datasheet |
MSDS Material Safety Datasheet | Thermal Paste SDS |
HTML Datasheet | TC1-200G Datasheet |
Attribute | Description |
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RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 3403.99.0000 |
Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
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1 | ¥420.45000 | ¥420.45 |
Attribute | Description |
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Standard Package | 1 |