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Vishay offers a variety of surface mount packaging technologies for tantalum capacitors. Listed first on this chart are the molded chips which consist of a tantalum pellet attached to a lead-frame enclosed in a plastic case consistent with EIA packaging standards. This series is the most popular choice in commercial applications. Although molded chips are quite cost effective, they are limited in terms of volumetric efficiency, form factor offerings and maximum capacitance values. The conformal coated type offers the highest volumetric efficiency of any SMD tantalum capacitor. These products have the highest capacitance (2200 microfarad), very low ESR and the highest voltage ratings (63 volts) available in surface mount tantalums. They also offer a 3 to 1 improvement in ESL (equivalent series inductance) over molded chip technology.MAP (Multiple Array Packaging) with “L-Shaped” terminations is Vishay’s newest packaging technology. Focused on small case sizes, the MAP is available in 0805, 0603 and now recently released 0402 case sizes. MAP offers the highest capacitance/voltage ratings in smaller case sizes.
