Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Slide 17 Slide 18 Slide 19 Slide 20 Slide 21 Slide 22 Slide 23 Slide 24 Slide 25 Slide 26 Slide 27 Slide 28 Product List Associated Content
Compact High-Power Packages

Another advantage of ROHM products is the variety of compact package sizes that still support high input voltages and output currents. Continuing evolution has resulted in the tiny 2 mm x 2 mm flip-chip package that is 86% smaller than traditional types. Flip-chip packaging technology allows for better thermal performance and smaller parasitics in a smaller footprint.

PTM Published on: 2023-03-24