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The IPD product family was introduced to address the needs of wireless device OEMs and RF front-end module makers. The goal of the technology is to integrate multiple functions on a single die to provide space savings and cost savings to customers. These devices are built using either glass or high-resistivity silicon substrates. ST differentiates from competing solutions by offering customers low cost, space saving, and high performance devices. Customers are also offered the optional flexibility to use ST’s foundry services.
PTM Published on: 2013-02-27
