Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Slide 17 Slide 18 Slide 19 Slide 20 Slide 21 Slide 22 Product List

Vishay offers a variety of surface mount packaging technologies in tantalum capacitors. First, the molded chips consisting of a tantalum pellet, attached to a lead-frame enclosed in a plastic case consistent with EIA packaging standards. This series is the most popular choice in commercial applications. Although molded chips are quite cost effective, they are limited in terms of volumetric efficiency, form factor offerings and maximum capacitance values. The conformal coated type offers the highest volumetric efficiency of any SMD tantalum capacitor. These products have the highest capacitance (2200uF), very low ESR and the highest voltage ratings (63V) available in SMD tantalums. They also offer a 3 to 1 improvement in equivalent series inductance (ESL) over molded chip technology. Vishay’s newest packaging technology is MAP (Multiple Array Packaging) which has “L-Shaped” terminations.  Focused on small case sizes, the MAP is available in 0805, 0603 and soon to be released 0402 cases.  MAP offers the highest capacitance/voltage ratings in small case sizes and the molded case results in manufacturing “friendly” construction.

PTM Published on: 2011-11-08