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The photos on the left are examples of the external form factors for the BR200 series. The external dimensions and footprints are based on accepted industry-wide standards. With a component height of 4.2 mm, side notched and gold-plated termination pads allow for easy inspection of solder joints during manufacturing. The right figure is an example of the BR200 series excellent output voltage response to load transients as well as a performance comparison to competing offerings. This makes the BR200 series well suited for supplying power to FPGA’s that typically require tight voltage regulation in rapidly changing load conditions.
PTM Published on: 2015-03-17
