Texas Instruments 的 TS3DV20812 规格书

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TS3DV20812
www.ti.com
SCDS302 –JUNE 2010
2-Gbps DIFFERENTIAL SWITCH 8-Bit, 1:2 MULTIPLEXER/DEMULTIPLEXER
WITH 3-SIDE BAND SIGNALS
Check for Samples: TS3DV20812
1FEATURES APPLICATIONS
• HDMI/DVI Video MUX
• Four High-Speed Bidirectional Differential Pair
Channel MUX/DEMUX • Panel LVDS Bus MUX
• LVDS, LVPECL, CML
• Supports up to 2 Gbps Data Rate • Analog Signals VGA
• VDD Operating Range 2.5 V or 3.3 • Gigabit LAN Signal MUX
– -0 V to 3.3 V Rail To Rail at 2.5 V • Serial Backplane Signal MUX
– -0 V to 5 V Rail To Rail at 3.3V • Optical Module
• IOFF partial Powerdown and Back-Drive • Central Office Telecommunication
Protection. • Wireless Base Station
• 5-V Input Tolerant on Control Pin • High-Speed Logic Data I/O MUX
• Supports Both AC- and DC-Coupled Signals
• Low Crosstalk: -38 dB at 825 MHz, RHH PACKAGE
(TOP VIEW)
2.5 V or 3.3 V
• Insertion Loss: -1.5 dB at 825 MHz,
2.5 V or 3.3 V
• Off Isolation -24.67 dB at 825 MHz
• Low Bit-to-Bit Skew within Pair 5 ps Maximum
• Channel-to-Channel Skew: 30 ps Maximum
• Propagation Delay Times: 250 ps Maximum
• ESD Performance Tested per JESD 22
– 2000-V Human Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
TS3DV20812 is a High Speed Data Rate up to 2Gbps for Differential Signal Passive bi-directional Multiplexer
and De-multiplexer for I/O rails up to 5V Level with Low Crosstalk and Insertion Loss.
TS3DV20812 can be used in either HDMI/DVI sink side or source side with 4-differential pair supporting the high
speed and control pins.
The Ioff and back drive protection allowing to connect the external cable and prevent the back flow current when
the Vcc is into 0V.
The 3 side band signals can be used in DDC (SDAL, SCL) and CEC Signal MUX.
TS3DS20812 is characterized for operation from -40C to 85C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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TS3DV20812
SCDS302 –JUNE 2010
www.ti.com
Table 1. ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
–40°C to 85°C QFN – RHH Tape and reel TS3DV20812RHH TBD
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
LOGIC DIAGRAM
FUNCTION TABLE
INPUT DIFFERENTIAL FUNCTIONS
SEL SIGNAL I/Os A-PORT B-PORT
L Dn (±), nA (AUX (±), DnA (±), nA_A High-impedance mode
HPD, CAD/CEC)
H High-impedance mode DnB (±), nA_B
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ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Supply voltage range –0.5 4.6 V
VIN Control input voltage range(2)(3) SEL –0.5 7 V
I/O –0.5 7 V
VIO Switch I/O voltage range (all three I/O ports)(4) D0-D3, Aux, HPD, CAD/CEC –0.5 VCC + 0.5 V
A port and B port –0.5 VCC + 0.5 V
IIK Control input clamp current VIN < 0 –50 mA
II/OK I/O port clamp current VO< 0 –50 mA
IIO Continuous output current(5) ON-state switch ±128 mA
Continuous current through VDD or GND ±100 mA
ΘJA Package thermal impedance(6) RHH package 31.8 °C/W
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for VIO.
(5) IIand IOare used to denote specific conditions for IIO.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
VDD Supply voltage 2.25 3. 6 V
VIH High-level control input voltage SEL 2 5.5 V
VIL Low-level control input voltage SEL 0 0.8 V
VI/O Input/output voltage All ports 0 5.5 V
VANALOG Analog signal range Differential signal range 0 VDD V
VIInput tolerant SEL 0 5.5 V
TAOperating free-air temperature –40 85 °C
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ELECTRICAL CHARACTERISTICS
for high-frequency switching over recommended operating free-air temperature range VDD = 3.3 V ± 0.3 V (unless otherwise
noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK SEL VDD = 3.6 V, IIN = –18 mA –0.7 –1.2 V
IIH SEL VDD = 3.6 V, VIN = VDD ±1 mA
IIL SEL VDD = 3.6 V, VIN = GND ±1 mA
IOFF VDD = 06 V, VO= 0 to 3.6 V , VI= 0 , VIN = 0 1 mA
ICC VDD = 3.6 V, IIO = 0 Switch ON or OFF 250 500 mA
CIN SEL f = 10 MHz , VIN = 0 2 2.5 pF
COFF 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is 2.5 4 pF
OFF
CON 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is 8 pF
ON
rON VDD = 3.6 V 1.5 V ≤VI≤VDD, IO= –40 mA 4 6 Ω
rON(flat) (3) VDD = 3.6 V 1.5 V ≤VI≤VDD, IO= –40 mA 0.5 Ω
ΔrON(4) VDD = 3.6 V 1.5 V ≤VI≤VDD, IO= –40 mA 0.4 1 Ω
(1) VI, VO, II, and IOrefer to I/O pins, VIN refers to the control inputs.
(2) All typical values are at VDD = 3.3 V (unless otherwise noted), TA= 25°.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (D0 to Dn) ports to any other port.
ELECTRICAL CHARACTERISTICS
for high-frequency switching over recommended operating free-air temperature range VDD = 2.5 V ± 0.25 V (unless otherwise
noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK SEL VDD = 2.5 V , IIN = –18 mA –0.7 –1.2 V
IIH SEL VDD = 2.5 V , VIN = VDD ±1 mA
IIL SEL VDD = 2.5 V , VIN = GND ±1 mA
IOFF VDD = 06 V, VO= 0 to 2.5 V , VI= 0 , VIN = 0 1 mA
ICC VDD = 2.5 V , IIO = 0 Switch ON or OFF 250 500 mA
CIN SEL f = 10 MHz , VIN = 0 2 2.5 pF
COFF 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is 2.5 4 pF
OFF
CON 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is 8 pF
ON
rON VDD = 2.5 V 1.5 V ≤VI≤VDD, IO= –40 mA 4 6 Ω
rON(flat) (3) VDD = 2.5 V VI= 1.5 V and VDD, IO= –40 mA 0.5 Ω
ΔrON(4) VDD = 2.5 V 1.5 V ≤VI≤VDD, IO= –40 mA 0.4 1 Ω
(1) VI, VO, II, and IOrefer to I/O pins, VIN refers to the control inputs.
(2) All typical values are at VDD = 2.5 V (unless otherwise noted), TA= 25°.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (D0 to Dn) ports to any other port.
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SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL= 200 Ω, CL= 10 pF (unless otherwise
noted) (see Figure 9 and Figure 10)
FROM TO MIN TYP(1) MAX UNIT
PARAMETER (INPUT) (OUTPUT)
tpd(2) Dn DAor DB149 ps
tPZH, tPZL SEL DAor DB0.5 15 ns
tPHZ, tPLZ SEL DAor DB0.9 12 ns
SEL to switch turn on time DAor DB9 14 ns
SEL to switch turn off time DAor DB5 11 ns
tsk(o) (3) Dn (+)(-), DA(+)(-), DB(+)(-) 22 28 ps
tsk(o) Dn (all), DnA(all), DnB(All) 19 25 ps
tsk(p)(4) 22 31 ps
(1) All typical values are at VDD = 2.5 V (unless otherwise noted), TA= 25°.
(2) The propagation delay is the calculated RC time constant of the typical ON-State resistance of the switch and the specified load
capacitance when driven by an ideal voltage source (zero output impedance).
(3) Output skew between center port to any other port.
(4) Skew between opposite transitions of the same output in a given device |tPHL – tPLH|
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 2.5V ± 0.25 V, RL= 200 Ω, CL= 10 pF (unless otherwise
noted) (see Figure 9 and Figure 10)
FROM TO MIN TYP(1) MAX UNIT
PARAMETER (INPUT) (OUTPUT)
tpd(2) Dn DAor DB149 ps
tPZH, tPZL SEL DAor DB0.5 14 ns
tPHZ, tPLZ SEL DAor DB0.9 15 ns
SEL to switch turn on time DAor DB9 17 ns
SEL to switch turn off time DAor DBDAor DB5 18 ns
tsk(o) (3) Dn (+)(-), DA(+)(-), DB(+)(-) 22 31 ps
tsk(o) Dn (all), DnA(all), DnB(All) 19 23 ps
tsk(p)(4) 22 33 ps
(1) All typical values are at VDD = 2.5 V (unless otherwise noted), TA= 25°.
(2) The propagation delay is the calculated RC time constant of the typical ON-State resistance of the switch and the specified load
capacitance when driven by an ideal voltage source (zero output impedance).
(3) Output skew between center port to any other port.
(4) Skew between opposite transitions of the same output in a given device |tPHL – tPLH|
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SCDS302 –JUNE 2010
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DYNAMIC CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL= 50 Ω, CL= 10 pF (unless otherwise
noted)
PARAMETER TEST CONDITIONS TYP UNIT
XTALK Differential crosstalk 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 11 -34.67 dB
OIRR Differential OFF isolation 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 12 -19.09 dB
ILOSS Differential insertion loss 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, seeFigure 13 -2.84 dB
IRETURN Differential return loss 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 13 -9.43 dB
DR Data rate 2.20 Gbps
BW Differential bandwidth 1.10 Ghz
DYNAMIC CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 2.5 V ± 0.25 V, RL= 50 Ω, CL= 10 pF (unless otherwise
noted)
PARAMETER TEST CONDITIONS TYP UNIT
XTALK Differential crosstalk 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 7 -34.94 dB
OIRR Differential OFF isolation 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 8 -18.39 dB
ILOSS Differential insertion loss 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 9 -3.07 dB
IRETURN Differential return loss 825 MHz, 1.65Gbps, RL= 50 Ω, CL= 10 pF, see Figure 9 -9.56 dB
DR Data rate 2.20 Gbps
BW Differential bandwidth 1.10 Ghz
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TS3DV20812
www.ti.com
SCDS302 –JUNE 2010
TYPICAL PERFORMANCE
Figure 1. Differential Gain vs Frequency Figure 2. Differential Off Isolation vs Frequency
Figure 3. Differential Crosstalk vs Frequency Figure 4. rON vs VCOM (Differential Switch)
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TS3DV20812
SCDS302 –JUNE 2010
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APPLICATION INFORMATION
Figure 5. Typical Application Switching HDMI 1.2a and DVI
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TS3DV20812
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SCDS302 –JUNE 2010
Figure 6. Typical Application for Dual LVDS
A. The switch already has IOFF circuit and it will reduce the current flow leakage limit to 10 mA maximum and it will
prevent the damage from back drive current flow from the power-on circuit.
Figure 7. IOFF (Back Drive Protection)
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TS3DV20812
SCDS302 –JUNE 2010
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PARAMETER MEASUREMENT INFORMATION
Figure 8. Differential Signaling Device
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TS3DV20812
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SCDS302 –JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 9. Test Circuit for Propagation Delay and Intra-Pair Skew
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 10. Test Circuit and Voltage Waveforms
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SCDS302 –JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 11. Differential Crosstalk Test Circuit
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 12. Differential OFF Isolation Test Circuit
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SCDS302 –JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 13. Differential Insertion Loss, Return Loss, and Common-Mode Insertion Loss Test Circuit
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TS3DV20812RHHR ACTIVE VQFN RHH 36 2500 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 SY812
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«PT» Reel Diame|er AD Dimension des‘gned to accommodate the componem wwdlh E0 Dimension damned to eccemmodam the component \ength KO Dimenslun desgned to accommodate the componem thickness 7 w Overen with loe earner cape i p1 Pitch between successwe cavuy eemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS3DV20812RHHR VQFN RHH 36 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3DV20812RHHR VQFN RHH 36 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
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GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
VQFN - 1 mm max heightRHH 36
PLASTIC QUAD FLATPACK - NO LEAD
6 x 6, 0.5 mm pitch
4225440/A
5® CCCCCCCCCj \“w““+‘w“ ,jign DJ mmmmmm
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PACKAGE OUTLINE
6.1
5.9
6.1
5.9
1.0
0.8
0.05
0.00
2X 4
32X 0.5
2X 4
36X 0.65
0.45
36X 0.30
0.18
4.1 0.1
(0.2) TYP
VQFN - 1 mm max heightRHH0036B
PLASTIC QUAD FLATPACK - NO LEAD
4225414/A 10/2019
0.08 C
0.1 C A B
0.05
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
PIN 1 INDEX AREA
SEATING PLANE
PIN 1 ID
SYMM
EXPOSED
THERMAL PAD
SYMM
1
9
10 18
19
27
28
36
37
SCALE 2.300
A
B
C
Jo “H M¢$§m$¢% *— T/\ ““““ ,,,,, / Wm mu: m p w M Egg E @
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EXAMPLE BOARD LAYOUT
32X (0.5)
(R0.05) TYP
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
36X (0.75)
36X (0.24)
(5.65)
(5.65)
( 4.1)
( 0.2) TYP
VIA
(0.68)
TYP
(1.8)
TYP
(0.68)
TYP
(1.8) TYP
VQFN - 1 mm max heightRHH0036B
PLASTIC QUAD FLATPACK - NO LEAD
4225414/A 10/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SYMM
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
SEE SOLDER MASK
DETAIL
1
9
10 18
19
27
28
36
37
METAL EDGE
SOLDER MASK
OPENING
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DEFINED
SOLDER MASK DETAILS
r7 fl { flfl fiQEEfl} Cb ,E, ,E
www.ti.com
EXAMPLE STENCIL DESIGN
36X (0.75)
36X (0.24)
32X (0.5)
(5.65)
(5.65)
9X ( 1.16)
(R0.05) TYP
(1.36) TYP
(1.36)
TYP
VQFN - 1 mm max heightRHH0036B
PLASTIC QUAD FLATPACK - NO LEAD
4225414/A 10/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 15X
EXPOSED PAD 37
72% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SYMM
SYMM
1
9
10 18
19
27
28
36
37
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