Our 2030+ Sustainability Ambition Framework sets the frame for our global sustainability strategy, with clear ambitions and targets that we want to achieve in this decade.

Bergquist 的 SIL PAD TSP 3500 是一种有机硅弹性体，其配方可最大程度地提高介电性能和热性能。

Bergquist 的 GAP FILLER TGF 3600 是一种双组分液体间隙填充材料，具有超高的热性能。

Bergquist Company 是热管理材料开发与制造的领域的全球领导者，产品包括 Sil-Pad® 导热绝缘层和各种特种材料、Gap Pad® 间隙填充材料、Hi-Flow® 相变材料以及 Softface® 和 Bond-Ply®。

Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM).

Advanced communication technologies, motor controls, drives and power converters are delivering more function in smaller form factors, which raises power densities and increases heat generation.

Bergquist 基于 GapPad® TGP 6000ULM 有机硅的非导电 Gap Pad 具有高贴合性，可在各种表面形貌上提供出色的覆盖率。

Bergquist’s Gap Pad® TGP 7000ULM 软间隙填充材料的额定导热率为 7.0 W/mK，适用于要求低组装应力的高性能应用。

LOCTITE STYCAST 2850FT 导热环氧树脂密封剂旨在用于密封需要散热和热冲击属性的组件。

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

Bergquist 的 Gap Pad HC 5.0 是一种软质、相容性填隙材料，其导热率为 5.0 W/M-K，具有出色的热性能和非常小的抗压应力。

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Sil-Pad® 900S 绝缘材料的热阻为 0.61°C-in2/W (@50 psi)，适用于包括电源在内的多种应用。

可替换油脂的 Q-Pad® 3 玻璃增强型热界面可在焊接和清洗前安装。

Gap Pad® 1500 非强化填补材料具有 1.5 W/M-K 的导热率和顺应性、低硬度特性。

基于 Kapton 的 Sil-Pad® K-10 绝缘体具有良好的切割通过性和出色的热性能。