Take Advantage of Miniaturized Wiring Systems for Space-Constrained Designs

As electronic systems continue to shrink and functional density increases, designers face a challenge in ensuring robust interconnects. This is especially true in industrial, medical, and military/aerospace settings, where connectors must be compact yet able to withstand vibration, thermal cycling, and other stressors. To address these challenges, designers require compact interconnect solutions that pair reliability with space efficiency.

This article explores key requirements for such interconnects, including terminal density, robust mating mechanisms, thermal tolerance, and signal and power capacity. It then introduces a versatile connector ecosystem from Samtec and shows how it can be used to meet these requirements.

Connector design and conductor routing in compact layouts

When selecting connectors for space-constrained designs, a good starting point is the spacing of the contacts, known as the contact pitch. A smaller pitch generally corresponds to a more compact connector.

The availability of multiple connector styles can also be highly valuable. For example, a single-row connector might be the best option for routing conductors through narrow spaces, while a double-row variant can offer higher contact density. Similarly, the ability to mount headers onto printed circuit boards (pc boards) in either a vertical or horizontal orientation makes it easier to work around tight clearances.

The choice between ribbon cables and discrete wires also warrants consideration. While each has its advantages, discrete wire solutions can provide more routing options. This is especially important in applications requiring branched interconnects, where a single cable assembly must gather conductors from multiple locations within a device (Figure 1).

Figure 1: Shown is a discrete wire system used to simplify the aggregation of conductors and the use of multiple connector types in a single assembly. (Image source: Samtec)

Another advantage of discrete wires is that multiple connector styles can be used within a single assembly to accommodate the requirements of various components and subsystems. Discrete wires also provide the flexibility to combine power and signal conductors within an assembly, with the option to use color coding to identify the purpose of each wire.

Connector retention and thermal compatibility in challenging conditions

One of the primary threats to interconnect reliability is unintentional demating during operation. In larger systems, retention methods such as screws, fasteners, or nuts can prevent separation under mechanical stress. However, smaller systems often lack the space to make these options practical.

These challenges are compounded in systems that require frequent mating cycles. Whether driven by maintenance needs, field upgrades, or reconfiguration, repeated connection and disconnection calls for retention methods that are both secure and easy to use.

To address these concerns, compact latching mechanisms are typically required. These should allow connectors to be securely mated and demated by hand, without the need for tools or secondary fastening hardware.

Material selection is also a key consideration. Connector housings and wire insulation must be suited to the application’s environmental conditions, including the expected operating temperature range and any applicable safety or regulatory requirements.

Power delivery and signal integrity in miniaturized interconnects

While size is the leading consideration for space-constrained designs, miniaturized connectors must still meet electrical demands. Even with a fine contact pitch, interconnects need to support excellent signal quality and adequate current and voltage levels for power delivery.

These considerations place added importance on contact and terminal design. Their geometry should ensure a reliable contact patch, and the materials should resist corrosion to maintain signal integrity over time. A dual-leaf design is particularly useful here, as it helps maintain consistent contact pressure across a wide temperature range and vibration profile, which is essential for avoiding signal dropout or power interruption in demanding environments.

High-performance interconnect platforms for space-constrained systems

The Micro Mate discrete wire system from Samtec is explicitly designed to meet the demands of space-constrained applications. The defining feature of the Micro Mate platform is its 1 millimeter (mm) contact pitch, which enables compact connector footprints across the product range. Solutions are available for cable-to-board, cable-to-cable, and cable-to-panel applications, offering broad design flexibility. Key features of the family include:

• Single- or double-row configurations with 2 to 40 total contacts to support a range of signal and I/O density requirements
• Single- or dual-latch mechanisms for secure mating in mechanically stressed environments
• Voltage ratings up to 250 V_AC and 353 V_DC, with current ratings up to 2.7 A per contact, to support both signal and moderate power distribution
• Dual-leaf gold-plated contact systems for consistent connectivity and high signal quality in demanding environments
• Optional Teflon fluoropolymer sheathing for enhanced chemical resistance and compatibility with halogen-free or high-temperature applications

In addition to standard cable assemblies, Samtec offers component-level solutions for custom wiring. These solutions support the creation of tailored assemblies that maximize space efficiency and routing flexibility in application-specific designs.

Ready-made assemblies for simplified integration

A typical example of a Micro Mate cable-to-cable solution is the S1SS-08-28-GF-06.00-L1 (Figure 2) 8-position, single-row assembly that terminates in a rectangular socket at each end.

Figure 2: The S1SS-08-28-GF-06.00-L1 features a tool-free positive latch lock mechanism to ensure robust connections. (Image source: Samtec)

A noteworthy feature of this solution is the rugged tool-free positive latch lock mechanism built into the connector housings. This latch ensures a reliable connection even in harsh operating conditions. It also enables manual decoupling during routine maintenance, eliminating the need for screws or fasteners, which can be particularly advantageous in confined spaces where tool use is challenging.

The cable assembly can mate with various Micro Mate headers that include an integrated locking ramp to ensure a secure connection. One notable example is the T1M-08-F-SV-L (Figure 3). This horizontal, surface-mount, low-profile header supports installation at the board edge, helping minimize vertical height above the pc board. With an insulation height of just 5.51 mm, this configuration supports close board-to-board spacing without compromising mechanical robustness.

Figure 3: The T1M-08-F-SV-L header is a horizontal, surface-mount solution for applications where vertical space is limited. (Image source: Samtec)

Tool-free panel mounting solutions

Panel-mounted interconnects introduce additional challenges in scenarios where mounting screws or other fasteners cannot be used. Snap-in tabs address this problem.

For example, the T1PST-05-28-GF-02.0-A-T3 (Figure 4) cable-to-panel assembly features a ruggedized socket with integrated snap-in tabs, allowing the connector to be self-secured in a panel opening, eliminating the need for dedicated retaining hardware. It supports panel thicknesses ranging from 0.033 to 0.090 inches (in.).

Figure 4: The T1PST-05-28-GF-02.0-A-T3 features a snap-in interconnect design, enabling quick, tool-free panel mounting. (Image source: Samtec)

By eliminating the need for fasteners, designers can preserve valuable panel space for other functional elements, such as indicators, buttons, or switches. This assembly also demonstrates the versatility of the Micro Mate platform. In this configuration, the cable is sheathed in an optional Teflon fluoropolymer jacket rated for temperatures ranging from -40°C to +125°C, supporting use in high-temperature or halogen-free applications.

Custom interconnect assemblies and tooling support

While ready-made assemblies provide convenient solutions for many interconnect needs, space-constrained designs often require custom configurations. For example, an application might require branched cable routing or a transition between single- and double-row pin layouts to optimize space usage. These techniques can be particularly useful in complex enclosures such as handheld diagnostic tools or drone subsystems, where wires must be routed through irregular spaces and around other electromechanical components.

To cater to custom requirements, Samtec offers component-level solutions that enable engineers to create Micro Mate assemblies from scratch or modify existing assemblies to suit their needs. An example is the IDT1-05 (Figure 5) housing plug. This double-row solution is designed to maximize contact density.

Figure 5: The IDT1-05 housing plug can be used to create a custom assembly with ten conductors in a double-row layout. (Image source: Samtec)

Custom designs use the same gold-plated dual-leaf contacts as factory-assembled products. As the TC37R-01-GF (Figure 6) contact illustrates, they provide a large mating surface with 0.076 micrometer (µm) gold plating for low electrical resistance and long-term reliability.

Figure 6: The TC37R-01-GF contact uses a dual-leaf, gold-plated design for low electrical resistance and reliability. (Image source: Samtec)

To maintain consistent connection quality, proper tooling is essential. The CAT-HT-309-2830-12 (Figure 7) hand crimper tool for the Micro Mate family helps technicians produce custom assemblies using 28 or 30 AWG wire that match the mechanical and electrical integrity of factory-built solutions.

Figure 7: The CAT-HT-309-2830-12 hand crimper tool supports reliable manual assembly of Micro Mate interconnects using 28 or 30 AWG wire. (Image source: Samtec)

Conclusion

Space-constrained systems require interconnects that strike a balance between compactness, durability, and electrical capacity. The Micro Mate discrete wire platform addresses these needs with a miniaturized 1 mm pitch solution. Whether connecting internal subsystems or providing panel interfaces, the platform offers a wide range of options to support flexible, high-performance wiring design.