Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Product List
Fred Pt Die Technology in eSMP Packages Slide 6

Vishay has been developing the eSMP® package for quite some time. The main feature of the eSMP® packages, besides the features that are listed on this slide are: it has increased power dissipation capability, offers thinner packages that are typically less than 1 mm in height both benefits combined allow to design smaller packages with equal or better thermal efficiency with reduced PCB space occupancy, improved efficiency and lower height for slim end application requirements.

PTM Published on: 2015-03-05