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Image of Phoenix Contact Industrial Case System (ICS) - Packaging for IIOT Devices

One challenge facing designers and mechanical engineers is figuring out how to easily and economically incorporate a variety of common connection types. Many common enclosure or packaging options require secondary milling operations to incorporate most connection technology. Not only does this add cost and time, but it is also difficult to maintain a pleasing aesthetic to the device.

PTM Published on: 2021-01-22