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Highly specialized machines for industry has improved manufacturing efficiency. Subsequent to programming, autonomous production has supplanted costly manual operations in factories. In order to accommodate the trend of miniaturization, designs of electronic components have shrunk. The sensitive and miniaturized elements require unique production methodology. So, among other options, Surface Mountable Technology was created and quickly adopted in manufacturing facilities. SMT is fully automated assembly meeting the demand of high volume and quality manufacturing of minimized electronic components. It uses the pick-and-place process and machined assembly. SMD elements have a special design. SMD elements enable soldering and mounting directly on the surface of printed circuit boards. The soldering paste can be placed by machine units or screen printing. No additional wiring or boring for wire bonding is required. Even a double-sided assembly is possible. This method improves the stability of the connection and simplifies mounting. These devices deliver reduced conducting paths, so HF-Characteristics are improved. SMD components can also be implemented in modern and efficient production lines. An example is they can be delivered on tape and reel, then precisely grabbed by Pick-and-Place machines that run through reflow soldering and automatic assembly. Subsequently the product quality can be tested by an AOI procedure. This process and technology improves the manufacturing quality, saves time and money.
