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DRAM Modules Slide 2

ATP strives to serve designers and engineers of end applications which require high reliability and high performance even in extended temperatures or harsh environments and need long term stability with a true locked BOM. ATP’s DRAM modules receive a TDBI, Test During Burn-In, to ensure only the best ICs are used on their DRAM DIMMs. ATP also uses high quality six and ten layer PCB’s and 30 μ” gold finger plating. The end result is a DRAM module product offering across most JEDEC form factors, in architectures ranging from legacy SDRAM and DDR 1 to leading edge DDR 4, in both commercial and industrial temperature ratings.

PTM Published on: 2015-07-28