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RADSERT

Amphenol RADSERT™ connectors provide a high power to board interconnect in a small package. The RADSERT brings power to the board from busbars suspended above the board and all of the board components. Pins from the busbar plug into the board mounted RADSERT. RADSERT’s provide a high power to board interconnect in a small package using RADSOK technology which is a hyperbolic socket design ensuring many points of contact. Solder versions or pre-loaded RADSERTs are installed during board fabrication with current ratings of 35 A in size 2.4 mm, 60 A in size 3.0 mm, 70 A in size 3.6 mm, and 120 A in size 5.7 mm. No special crimp tools required. No threaded fasteners. All eliminating the risk of PTH cracking or delamination within the board while creating faster through-put with an interconnect that is RoHS compliant.

PTM Published on: 2016-04-04