DMG20102 规格书

Panasonic 2.9 4,; 2 1i \ F95 ‘ A u, m _ N H H; La 1 1 (0 95)(0 95) 1. 9 (El) 122‘ l 2 3 (Bl) (E) (El)
Ver. DEDPublication date: January 2014 1
DMG20102
Silicon NPN epitaxial planar type (Tr1)
Silicon PNP epitaxial planar type (Tr2)
For general amplification
Features
High forward current transfer ratio hFE with excellent linearity
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: CY
Basic Part Number
DSC2002 + DSA2002 (Common emitter)
Packaging
DMG201020R
Embossed type (Thermo-compression sealing): 3
000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Tr1
Collector-base voltage (Emitter open) VCBO 60 V
Collector-emitter voltage (Base open) VCEO 50 V
Emitter-base voltage (Collector open) VEBO 5 V
Collector current IC500 mA
Peak collector current ICP 1 A
Tr2
Collector-base voltage (Emitter open) VCBO –60 V
Collector-emitter voltage (Base open) VCEO –50 V
Emitter-base voltage (Collector open) VEBO –5 V
Collector current IC–500 mA
Peak collector current ICP –1 A
Overall
Total power dissipation PT300 mW
Junction temperature Tj150 °C
Operating ambient temperature Topr –40 to +85 °C
Storage temperature Tstg –55 to +150 °C
Unit: mm
1: Base (Tr1)
2: E
mitter (Common)
3: Base (Tr2)
4: Collector (Tr2)
5: Collector (Tr1)
Panasonic Mini5-G3-B
JEITA SC-74A
Code MO-178
(C2)
4
Tr1Tr2
(C1)
5
1
(B1)
3
(B2)
2
(E)
Panasonic
Ver. DED
DMG20102
2
Electrical Characteristics Ta = 25°C±3°C
Tr1
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = 10 µA, IE = 0 60 V
Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V
Emitter-base voltage (Collector open) VEBO IE = 10 µA, IC = 0 5 V
Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 µA
Forward current transfer ratio
hFE1 VCE = 10 V, IC = 150 mA 120 340
hFE2 VCE = 10 V, IC = 500 mA 40
Collector-emitter saturation voltage VCE(sat) IC = 300 mA, IB = 30 mA 0.1 0.6 V
Transition frequency fTVCE = 10 V, IC = 50 mA 160 MHz
Collector output capacitance
(Common base, input open circuited) Cob VCB = 10 V, IE = 0, f = 1 MHz 4.8 15 pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Tr2
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0 –60 V
Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V
Emitter-base voltage (Collector open) VEBO IE = –10 µA, IC = 0 –5 V
Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 – 0.1 µA
Forward current transfer ratio
hFE1 VCE = –10 V, IC = –150 mA 120 340
hFE2 VCE = –10 V, IC = –500 mA 40
Collector-emitter saturation voltage VCE(sat) IC = –300 mA, IB = –30 mA – 0.2 – 0.6 V
Base-emitter saturation voltage VBE(sat) IC = –300 mA, IB = –30 mA – 0.9 –1.5 V
Transition frequency fTVCE = –10 V, IC = –50 mA 130 MHz
Collector output capacitance
(Common base, input open circuited) Cob VCB = –10 V, IE = 0, f = 1 MHz 7.3 15 pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
PT Ta
00 20016040 12080
300
200
100
400
Ambient temperature Ta (°C)
Total power dissipation PT (mW)
DMG20102_PT-Ta
Common characteristics chart
Panasonic
Ver. DED
DMG20102
3
IC VCE hFE IC VCE(sat) IC
0
0 12 2 10 4 8 6
600
500
400
300
200
100
Collector current IC (mA)
Collector-emitter voltage VCE (V)
DMG20102(Tr1)_IC-VCE
Ta = 25°C IB = 3.0 mA
0.3 mA
0.6 mA
0.9 mA
1.2 mA
1.5 mA
1.8 mA
2.1 mA
2.4 mA
2.7 mA
0
1
350
300
250
200
150
100
50
10 102 103
Forward current transfer ratio hFE
Collector current IC (mA)
DMG20102(Tr1)_hFE-IC
25°C
−40°C
Ta = 85°C
VCE = 10 V
10−2
10−1
1
1
10
10 102 103
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
DMG20102(Tr1)_VCEsat-IC
25°C
−40°C
Ta = 85°C
IC / IB = 10
Characteristics charts of Tr1
IC VBE Cob VCB fT IC
IC VCE hFE IC VCE(sat) IC
0
0 1.2 0.2 1.0 0.4 0.8 0.6
500
400
300
200
100
Collector current IC (mA)
Base-emitter voltage VBE (V)
DMG20102(Tr1)_IC-VBE
−40°C
Ta = 85°C
VCE = 10 V
25°C
0
1
20
12
16
8
4
10 102
Collector-base voltage VCB (V)
DMG20102(Tr1)_Cob-VCB
Collector output capacitance
(Common base, input open circuited) Cob (pF)
IE = 0
f = 1 MHz
Ta = 25°C
0
10−1
250
200
150
100
50
1 10 102
Transition frequency fT (MHz)
Collector current IC (mA)
DMG20102(Tr1)_fT-IC
VCE = 10 V
Ta = 25°C
0
0 −12 −2 −10 −4 −8 −6
−120
−100
−80
−60
−40
−20
Collector current IC (mA)
Collector-emitter voltage VCE (V)
DMG20102(Tr2)_IC-VCE
Ta = 25°C
IB = −500 µA
−400 µA
−300 µA
−200 µA
−100 µA
0
−1
300
250
200
150
100
50
−10 −102
−
103
Forward current transfer ratio hFE
Collector current IC (mA)
DMG20102(Tr2)_hFE-IC
25°C
−40°C
Ta = 85°C
VCE = −10 V
−10−2
−1
−10−1
−1
−10
−10 −102 −103
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
DMG20102(Tr2)_VCEsat-IC
25°C
−40°C
Ta = 85°C
IC / IB = 10
Characteristics charts of Tr2
Panasonic
Ver. DED
DMG20102
4
IC VBE Cob VCB fT IC
0
0 −1.2 − 0.4 − 0.8
−600
−500
−400
−300
−200
−100
Collector current IC (mA)
Base-emitter voltage VBE (V)
DMG20102(Tr2)_IC-VBE
−40°C
25°C
Ta = 85°C
VCE = −10 V
0
−1
25
20
10
15
5
−10 −102
Collector-base voltage VCB (V)
DMG20102(Tr2)_Cob-VCB
Collector output capacitance
(Common base, input open circuited) Cob (pF)
IE = 0
f =1 MHz
Ta = 25°C
0
−
10
−
1
250
200
150
100
50
−
1
−
10
−
102
Transition frequency fT (MHz)
Collector current IC (mA)
DMG20102(Tr2)_fT-IC
VCE = −10 V
Ta = 25°C
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Ver. DED
DMG20102
5
Mini5-G3-B Unit: mm
Land Pattern (Reference) (Unit: mm)
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents. the laws and regulations of the exporting country. espeCially. those With regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore. no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment. communications equipment. measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications. moreover please exchange documents separately on terms of use etc,: Special applications (such as for in-vehicle equipment. airplanes. aerospace. automotive equipment. traffic signaling equipment. combustion equipment. medical equipment and safety devices) in which exceptional quality and reliability are required. or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product speCifications described in this book are subject to change wtthout notice for modification and/or improvement, At the final stage of your design. purchasing. or use of the products, therefore. ask for the most up- to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially. please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode»switching. Other- wtse. we Will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design. arresting the spread of tire or preventing glitch are recommended in order to prevent physical injury. fire. somal damages. for example. by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD. EOS. thermal stress and mechanical stress) at the time of handling. mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required. satisfy the conditions. such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination. please understand that customers will bear the burden. (B) This book may be not reprinted or reproduced whether wholly or partially. without the prior written permission of our company.
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
No.010618