NXP USA Inc. 的 BT1306-400D,600D 规格书

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1. Product profile
1.1 General description
Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic
integrated circuits and other low power gate trigger circuits.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
2. Pinning information
BT1306-400D/600D
Logic level triac
Rev. 2 — 14 September 2011 Product data sheet
TO-92
Sensitive gate in all four quadrants Low cost package.
General purpose bidirectional
switching
Phase control applications
Solid state relays Low power AC fan speed controllers.
VDRM 600 V (BT1306-600D) VDRM 400 V (BT1306-400D)
ITSM 8A IT(RMS) 0.6 A.
Table 1. Pinning - SOT54 (TO-92), simplified outline and symbol
Pin Description Simplified outline Symbol
1 main terminal 2
SOT54 (TO-92)
2 gate
3 main terminal 1
1
3
2
msb033
mbl305
1
3
2
Figuve 1 g Figure 3 A
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 2 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
3. Ordering information
4. Limiting values
Table 2. Ordering information
Type number Package
Name Description Version
BT1306-600D TO-92 Plastic single-ended leaded (through hole) package; 3 leads SOT54
BT1306-400D TO-92 Plastic single-ended leaded (through hole) package; 3 leads SOT54
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage
BT1306-600D 25 CTj125 C-600V
BT1306-400D - 400 V
IT(RMS) on-state current (RMS value) full sine wave; Tlead 65 C; Figure 1 and 2-0.6A
ITSM non-repetitive peak on-state current full sine wave; Tj=25C prior to surge;
Figure 3 and 4
t=20ms - 8 A
t = 16.7 ms - 8.8 A
I2tI
2t for fusing t = 10 ms - 0.32 A2s
dIT/dt repetitive rate of rise of on-state
current after triggering ITM =1A;I
G= 0.2 A; dIG/dt = 0.2 A/s
T2+ G+ - 50 A/s
T2+ G-50A/s
T2 G-50A/s
T2 G+ - 10 A/s
IGM gate current (peak value) t = 2 smax - 1 A
VGM gate voltage (peak value) - 5 V
PGM gate power (peak value) - 5 W
PG(AV) average gate power t = 2 smax; T
case 80 C-0.1W
Tstg storage temperature 40 +150 C
Tjjunction temperature 40 +125 C
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 3 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
f=50Hz
Tlead 65 C
Fig 1. Maximum permissible on-state current (RMS
value) as a function of lead temperature. Fig 2. Maximum permissible repetitive on-state
current (RMS value) as a function of surge
duration for sinusoidal currents.
tp20 ms
initial Tj 25 C
n = number of cycles
f=50Hz
initial Tj 25 C
Fig 3. Maximum permissible non-repetitive peak
on-state current as a function of pulse width
for sinusoidal currents.
Fig 4. Maximum permissible non-repetitive peak
on-state current as a function of number of
cycles for sinusoidal currents; typical values.
003aaa037
Tlead (°C)
0 15010050
0.4
0.2
0.6
0.8
IT(RMS)
(A)
0
tsurge (S)
10-3 10110-2
003aaa041
1
2
3
IT(RMS)
(A)
0
003aaa040
102
10
103
ITSM
(A)
1
tp (s)
10-5 10-1
10-2
10-4 10-3
ITSM
t
IT
Tp
dlT/dt limit
T2- G+ quadrant
10
8
6
4
2
0
11010
2103
ITSM
(A)
n
003aaa038
ngureS
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 4 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
5. Thermal characteristics
5.1 Transient thermal impedance
Table 4. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-lead) thermal resistance from junction to lead full cycle - - 60 K/W
half cycle 80
Rth(j-a) thermal resistance from junction to ambient mounted on a printed-circuit board;
lead length = 4 mm; Figure 5 -150-K/W
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values.
003aaa029
tp (s)
10-5 11010-1
10-2
10-4 10-3
102
10
103
Zth(j-a)
(K/W)
1
tp
P
t
Figure 8 Figure 9 Figure 10 Figure 11 Figure 7 Figure 12
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 5 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
6. Characteristics
Table 5. Characteristics
Tj=25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD=12V; I
T=0.1A; Figure 8
T2+ G+ - 15mA
T2+ G- 25mA
T2 G- 25mA
T2 G+ - 47mA
ILlatching current VD=12V; I
T=0.1A; Figure 9
T2+ G+ - 1 10 mA
T2+ G-510mA
T2 G-110mA
T2 G+ - 2 10 mA
IHholding current VD=12V; I
GT =0.1A; Figure 10 -110mA
VTon-state voltage IT=0.85A; Figure 11 -1.41.9V
VGT gate trigger voltage VD=12V; I
T=0.1A; Figure 7 -0.92V
VD=V
DRM; IT= 0.1 A; Tj=110C0.10.7-V
IDoff-state leakage current VD=V
DRM(max); Tj=110C-3100A
Dynamic characteristics
dVD/dt critical rate of rise of off-state
voltage VD= 67% of VDM(max); Tcase =110C;
exponential waveform; gate open circuit;
Figure 12
30 45 - V/s
dVcom/dt critical rate of rise of commutation
voltage VD= rated VDM; Tcase =50C; ITM =0.84A;
commutating dI/dt = 0.3 A/ms -5-V/s
tgt gate controlled turn-on time ITM = 1.0 A; VD=V
DRM(max); IG=25mA;
dIG/dt = 5 A/s-2-s
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 6 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
= conduction angle
Fig 6. On-state dissipation as a function of on-state
current (RMS value); maximum values. Fig 7. Normalized gate trigger voltage as a function
of junction temperature; typical values.
Fig 8. Normalized gate trigger current as a function
of junction temperature; typical values. Fig 9. Normalized latching current as a function of
junction temperature; typical values.
α = 180°
0
0.4
0.8
1.2
00.2 0.4 0.6 0.8
IT(RMS) (A)
Ptot
30°
60°
90°
120°
003aaa036
(W)
α
α
Tj (°C)
-60 14090-10 40
003aaa039
0.8
0.4
1.2
1.6
0
VGT(25°C)
VGT
Tj (°C)
-60 14090-10 40
003aaa030
1
2
3
0
(1)
(2)
(3)
(4)
(1)
(2)
(3)
(4)
IGT
IGT(25°C)
Tj (°C)
-60 14090-10 40
003aaa031
1
2
3
0
IL
IL(25°C)
I I
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 7 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
Fig 10. Normalized holding current as a function of
junction temperature; typical values. Fig 11. On-state current as a function of on-state
voltage; typical and maximum values.
Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values.
Tj (°C)
-60 14090-10 40
003aaa032
1.0
0.5
1.5
2.0
0
IH
IH(25°C)
0
0.4
0.8
1.2
1.6
00.8 1.6 2.4
003aaa033
IT
(A)
(A)
VT (V)
Tj = 125 °C
Tj = 25 °C
Typ Max
003aaa034
Tj (°C)
0 12510050 7525
102
10
103
dVD/dt
(V/μs)
1
E}@ W
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 8 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
7. Package outline
Fig 13. SOT54 (TO-92).
UNIT A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 5.2
5.0
b
0.48
0.40
c
0.45
0.38
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
e
2.54
e1
1.27
L
1
(1)
max.
2.5
b1
0.66
0.55
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOT54 TO-92 SC-43A 04-06-28
04-11-16
A L
0 2.5 5 mm
scale
b
c
D
b1L1
d
E
Plastic single-ended leaded (through hole) package; 3 leads SOT54
e1
e
1
2
3
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 9 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
8. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BT1306_XXXD_SER v.2 20110914 Product data sheet - BT1306_XXXD_SER v.1
(9397 750 12593)
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Package outline drawings have been updated to the latest version.
BT1306_XXXD_SER v.1
(9397 750 12593) 20040219 Product data - -
BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 10 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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BT1306_XXXD_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 14 September 2011 11 of 12
NXP Semiconductors BT1306-400D/600D
Logic level triac
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BT1306-400D/600D
Logic level triac
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 September 2011
Document identifier: BT1306_XXXD_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
5.1 Transient thermal impedance . . . . . . . . . . . . . . 4
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Contact information. . . . . . . . . . . . . . . . . . . . . 11
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12