NXP USA Inc. 的 BAP64-05W 规格书

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BAP64-05W

Silicon PIN diode

Rev. 3.2 — 1 February 2019 Product data sheet

1 Product profile

1.1 General description

Two planar PIN diodes in common cathode configuration in a SOT323 small plastic SMD

package.

1.2 Features and benefits

•High voltage, current controlled

•RF resistor for RF attenuators and switches

•Low diode capacitance

•Low diode forward resistance

•Low series inductance

•For applications up to 3 GHz

•AEC-Q101 qualified

1.3 Applications

•RF attenuators and switches

BAP64-05W Table 1. Discrete pinning Table 2. Ordering information Table 3. Marking Table 4. Marking

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

2 / 11

2 Pinning information

Table 1. Discrete pinning

Pin Description Simplified outline Symbol

1 anode (a1)

2 anode (a2)

3 common cathode

1 2

top view

sym136

3 Ordering information

Table 2. Ordering information

PackageType number

Name Description Version

BAP64-05W - plastic surface-mounted package; 3 leads SOT323

4 Marking

Table 3. Marking

Type number Marking Description

% = t: made in MalaysiaBAP64-05W 5W%

% = W: made in China

Table 4. Marking

Type number Marking code

BAP64-05W 5W-

5 Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Values are specified per diode.

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 100 V

IFforward current - 100 mA

Ptot total power dissipation Tsp ≤ 90 °C - 240 mW

Tstg storage temperature -65 +150 °C

Tjjunction temperature -65 +150 °C

BAP64-05W Table 6‘ Thermal characteristics

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

3 / 11

6 Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point 250 K/W

BAP64-05W Figure 1 Figure 2

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

4 / 11

7 Characteristics

Table 7. Characteristics

Values are specified per diode; Tj = 25 °C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF = 50 mA - 0.95 1.1 V

VR = 60 V - - 10 µAIRreverse current

VR = 20 V - - 1 µA

see Figure 1; f = 1 MHz;

VR = 0 V - 0.52 - pF

VR = 1 V - 0.37 - pF

Cddiode capacitance

VR = 20 V - 0.23 0.35 pF

see Figure 2; f = 100 MHz; [1]

IF = 0.5 mA - 20 40 Ω

IF = 1 mA - 10 20 Ω

IF = 10 mA - 2.0 3.8 Ω

rDdiode forward resistance

IF = 100 mA - 0.7 1.35 Ω

τLcharge carrier life time when switched from IF = 10 mA to

IR = 6 mA; RL = 100 Ω; measured at

IR = 3 mA

- 1.55 - µs

LSseries inductance - 1.2 - nH

[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.

BAP64-05W 3557017759 355 017777 3557017751 3557017750

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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7.1 Graphical data

aaa-017759

0 4 8 12 16 20

100

200

300

400

500

VR (V)

(fF)(fF)

f = 1 MHz; Tj = 25 °C.

Figure 1. Diode capacitance as a function of reverse

voltage; typical values

aaa-017777

10-1 1 10 102

10-1

102

IF (mA)

(Ω)(Ω)

f = 100 MHz; Tj = 25 °C.

Figure 2. Forward resistance as a function of forward

current; typical values

aaa-017760

0.5 1 1.5 2 2.5 3

-25

-20

-15

-10

-5

f (GHz)

ISLISL

(dB)(dB)

Tamb = 25 °C

Diode zero biased and inserted in series with a 50 Ω

stripline circuit

Figure 3. Isolation of the diode as a function of

frequency; typical values

aaa-017761

0.5 1 1.5 2 2.5 3

-2.5

-2

-1.5

-1

-0.5

f (GHz)

Lins

(dB)(dB)

(1)(1)

(2)(2)

(3)(3)

(4)(4)

Tamb = 25 °C

1. IF = 100 mA

2. IF = 10 mA

3. IF = 1 mA

4. IF = 0.5 mA

Diode inserted in series with a 50 Ω stripline circuit and

biased via the analyzer T-network

Figure 4. Insertion loss of the diode as a function of

frequency; typical values

BAP64-05W ass-015155

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

6 / 11

aaa-018155

10-1 1 10

100

125

150

IF (mA)

IP2

(dB)(dB)

(1)(1)

(2)(2)

Tamb = 25 °C

1. f = 900 MHz

2. f = 1800 MHz

Figure 5. Second-order intercept point as a function of forward current; typical values

BAP64-05W Plastic surface-mounted package; 3 leads SOT323 TH. \RD44

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

7 / 11

8 Package outline

UNIT A1

max bpc D E e1HELpQ wv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

1.1

0.8

0.4

0.3

0.25

0.10

2.2

1.8

1.35

1.15 0.65

1.3 2.2

2.0

0.23

0.13 0.20.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT323 SC-70

detail X

vMA

0 1 2 mm

scale

1 2

Plastic surface-mounted package; 3 leads SOT323

04-11-04

06-03-16

Figure 6. Package outline SOT323

BAP64-05W Table 8. Abbreviations Table 9. Revision history

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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9 Abbreviations

Table 8. Abbreviations

Acronym Description

AQL acceptable quality level

PIN P-type, intrinsic, N-type

SMD surface-mounted device

S4 special inspection level 4

10 Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAP64-05W v.3.2 20190201 Product data sheet - BAP64-05W v.3.1

Modifications •changed condition for reverse current for VR from 100 V to 60 V

BAP64-05W v.3.1 20181211 Product data sheet - BAP64-05W v.3

Modifications •adapted marking code

BAP64-05W v.3 20180713 Product data sheet - BAP64-05W v.2

Modifications •changed IRconditions at characteristics

•adapted the layout of the data sheet

BAP64-05W v.2 20150428 Product data sheet - BAP64-05W v.1

Modifications •The format of this data sheet has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•AEC-Q101 qualified

BAP64-05W v.1 (9397

750 07192)

20000713 Product specification - -

BAP64-05W incs nus dacumem w hmzllwwmxgmm

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

9 / 11

11 Legal information

11.1 Data sheet status

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product

development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

BAP64-05W

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

10 / 11

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

11.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

BAP64-05W

NXP Semiconductors BAP64-05W

Silicon PIN diode

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 February 2019

Document identifier: BAP64-05W

Contents

1 Product profile .................................................... 1

1.1 General description ............................................1

1.2 Features and benefits ........................................1

1.3 Applications ........................................................1

2 Pinning information ............................................ 2

3 Ordering information .......................................... 2

4 Marking .................................................................2

5 Limiting values ....................................................2

6 Thermal characteristics ......................................3

7 Characteristics .................................................... 4

7.1 Graphical data ................................................... 5

8 Package outline ...................................................7

9 Abbreviations ...................................................... 8

10 Revision history .................................................. 8

11 Legal information ................................................ 9

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