BH7673G 规格书

Technical Note ' I f F1122 Rigs w mm ...........................
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The accessory IC series for the video
Video isolation amplifier
BH7673G
General
BH7673G is the single isolation video amplifier. It can reject the external noise when it receives the signal outside of the
application. It can reduce the influence of the external noise substantially. Because it has high common mode noise
rejection ratio (-60dB Typ.). It is the best for the application of automotives, because it is able to use a wide range of
temperature and it has the high electrostatic discharge rating. Moreover, because the frequency characteristic can
correspond to the Hi-Vision signal, it is at the development to equal to or more than 30 MHz.
Features
1) The high Electrostatic discharge(ESD) rating (The human body model±6000V pass)
2) Abele to use a wide range of temperature, from -40 to +85
3) High common mode rejection ratio(Typ. -60dB, f=20kHz)
4) It is not the degradation of CMRR when inserting ESD resistance at the input terminal.
5) Wide band [suitable for D4 standard] (0dB at f=30MHz)
6) Wide output dynamic range(Typ. 3.8Vpp)
7) High input Impedance(Typ. 150k)
8) Low circuit current consumption(Typ. 4.8mA)
9) Bias input
10) SSOP5 small package
Applications
The car navigation systems, the car monitor etc.
The signal input to the rear monitor, the picture taking-in from the rear camera and the measure of the noise when pulling
around a video signal out of the substrate.
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Limits Unit
Supply voltage VCC 7.0 V
Power dissipation Pd 540 1 mW
Input voltage range VIN 0VCC+0.2 V
Operating temperature Topr -40+85
Storage temperature Tstg -55+125
* Reduced by 5.4mW/ at 25 or higher
When mounting on a 70mmX70mmX1.6mm PCB board.
Operating Condition (Ta=25)
Parameter Symbol Min. Typ. Max Unit
Supply voltage VCC 4.5 5.0 5.5 V
* This product is not designed for protection against radioactive rays.
No.15069EBT01
Technical Note
2/9
BH7673G
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Electrical characteristics Unless otherwise specified, Ta= 25, VCC=5.0V
Parameter Symbol Min. Typ. Max. Unit Conditions
Circuit current ICC 4.8 8.0 mA No signal
Maximum output level VOM 3.2 3.8 Vpp f=10kHz, THD=1.0%
Voltage gain GV -1.0 0.0 1.0 dB Vin=1.0Vpp, f=1MHz
Frequency characteristics 1 GF1 -1.0 0.0 1.0 dB Vin=1.0Vpp, f=10MHz/1MHz
Frequency characteristics 2 GF2 0.0 dB Vin=1.0Vpp, f=30MHz/1MHz
Common mode rejection ratio CMRR -60 -40 dB Vin=1.0Vpp, f=20kHz
Input Impedance ZIN 110 150 190 k
Differential gain DG 0.1 % Vin=1.0Vpp, Standard stair step signal
Differential phase DP 0.3 deg. Vin=1.0Vpp, Standard stair step signal
S/NY S/NY 70 dB
Vin=1.0Vpp, bandwidth 100k6MHz
100% white video signal
Electrostatic discharge rating
(The human body model) HBM ±6 kV R=1.5k, C=100pF
Block diagram
1
2
3
5
4
VOUT
GND
VCC VIN
VGND
iifi
Technical Note
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BH7673G
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I/O equivalent circuit diagrams
PIN Name Equivalent circuit DC voltage The function explanation
1 VOUT
2.1V
Video signal output pin.
Use load resistance at equal to or more than
2 k.
VOUT pin cannot drive 75.
2 GND 0V GND pin
3 VCC 5V VCC pin
4 VIN
100
150k
2.8V
2.8V Video signal input pin is used for bias
type input. Input impedance is 150 k.
5 VGND
100
150k
2.8V
2.8V The bias type input.
Input Impedance is 150k
Note1) The above DC potential is only when VCC = 5V. This value is a reference value and is not guaranteed.
Note2) Numerical values shown in these figures are design values, and compliance to standards is not guaranteed.
Technical Note WC 3 mi 4‘ ii, gimg ”—47 4 Fig.1 Test Circuit Diagram D . 00 Evaluation board pattern diagram and Circuit diagram Application circuit examples e a; " P vans vour N W I ‘ m 1_ 6 GND VD; W1 Evcc T Fig.2 Application circuit examples “Bum... '55 .. '55 E .. '2 =- We): $541099? m1:309 meg “ " W Fig.3 Evaluation Board Pattern Diagram m E WW BH7673G Fig.4 Evaluation Board Circuit Diagram Pans list Symcci Funmiun Recommended value Cumments R42 R52 |npu|terminating resistor son 75;) sum etc R41 R51 Surge Resis|ance unless 1m 11 adds according ic the necessity c4 c5 Input ccupiing capacimr 1 om: (See pages e in determinei Recommended a characterishcs RI The load resistance 2m over c1 Output wupllng capacimr See pages e in de|ermine Recommended a characterishcs c32 1cm: c31 Decuupling capacitur u M: Recommended a characterishcs nAbout the setting of a jumper switch swans Make SW5 connection H4 on the side of the circuit and make H5 OPEN. swans Make SW5 connection H4 an the opposite side and make H www.mnmmm © 2015 ROHM 00.. Ltd. All ngnts reserved. 4/9
Technical Note
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Test Circuit Diagrams Application circuit examples
Evaluation board pattern diagram and circuit diagram
Fig.3 Evaluation Board Pattern Diagram
Fig.4 Evaluation Board Circuit Diagram
Parts list
Symbol Function Recommended value Comments
R42 R52 Input terminating resistor 50, 75, 600 etc.
R41 R51 Surge Resistance unless 1k It adds according to the necessity.
C4 C5 Input coupling capacitor 1.0uF (See pages 6 to determine) Recommended B characteristics
R1 The load resistance 2k over
C1 Output coupling capacitor See pages 6 to determine Recommended B characteristics
C32
Decoupling capacitor
10uF
Recommended B characteristics
C31 0.1uF
About the setting of a jumper switch
Fi
g
.1 Test Circuit Dia
g
ram Fi
g
.2 A
pp
lication circuit exam
p
les
Make SW5 connection H4 on the side of the
circuit and make H5 OPEN.
Make SW5 connection H4 at the circuit and on
the opposite side and make H5 ON.
1
2
3
5
4
VOUT
GND
VCC VIN
VGND
1.0uF
VCC
10μF
22uF
75Ω
VGND
VI
N
Video
Dviver I
C
1.0uF
0.1μF
75Ω
75Ω
BH76806FVM etc.
BH7673G
2
5
VOUT
GND
VCC VIN
VGN
D
4.7uF
VCC
10μF
4.7uF
0.1μF
V
47μF
2kΩ
A50Ω
See pages 6 for description of how to determine the
capacity of I/O coupling capacitors.
This IC cannot drive 75 directly. When driving 75,
connect a video driver such as BH76806FVM behind
this IC.
Test circuit diagrams are used for shipment
ins
p
ections
,
and differ from a
pp
lication circuits.
Fig.6 CMRR measurement
Fig.5 Generally, it is when evaluating.
Technical Note
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Cautions for use
1. The numerical values and data shown here are typical design values, not guaranteed values.
2. The application circuit examples show recommended circuits, but characteristics should be checked carefully before using
these circuits. If any external part constants are modified before use, factors such as variation in all external parts and
ROHM LSI ICs, including not only static characteristics but also transient characteristics, should be fully considered to set
an ample margin.
3. Absolute maximum ratings
If the absolute maximum ratings for applied voltage and/or operation temperature are exceeded, LSI damage may
result. Therefore, do not apply voltage or use in a temperature that exceeds these absolute maximum ratings. If it
is possible that absolute maximum ratings will be exceeded, use a physical safety device such as a fuse and make
sure that no conditions that might exceed the absolute maximum ratings will be applied to the LSI IC.
4. GND potential
Regardless of the operation mode, the voltage of the GND pin should be at least the minimum voltage. Actually check
whether or not the voltage at each pin, including transient phenomena, is less than the GND pin voltage.
5. Thermal design
The thermal design should be done using an ample margin that takes into consideration the allowable dissipation under
actual use conditions.
6. Shorts between pins and mounting errors
When mounting LSI ICs onto the circuit board, make sure each LSI's orientation and position is correct. The ICs may
become damaged if they are not mounted correctly when the power is turned on. Similarly, damage may also result if a
short occurs, such as when a foreign object is positioned between pins in an IC, or between a pin and a power supply or
GND connection
7. Operation in strong electromagnetic field
When used within a strong electromagnetic field, evaluate carefully to avoid the risk of operation faults
8. Place the power supply's decoupling capacitor as close as possible to the VCC pin (PIN 3) and GND pin (PIN 2).
9. The parasitic capacitance of the application board may cause the peak of the frequency characteristic response to occur at
a high frequency. To lower the peak of the frequency characteristic, connect in series resistors having resistance of
several dozen ohm to several hundred ohm as close as possible to the output pin.
10. The attention point when treating HD signal
As shown in reference data Fig.20, BH7673G have the frequency characteristic of equal to or more than 30 MHz but by the
influence with the parasitic capacitance of the application board and so on, a characteristic as in the carrying data isn't
sometimes gotten. The frequency characteristic can be improved in inserting about 2k ~ 3k resistance between the
output terminal and the GND terminal to the case.
1
OUT
Resistors (several dozen Ω to
several hundredΩ) to lower peak
fr eque ncy
Fig.7 Positions where Resistors are Inserted to Lower Peak Frequency Response
OUT
The resistance for the frequency characteristi
c
improvement2kΩ~3
1
2GND
Fig.8 The resistance insertion position for the frequency characteristic improvement
characteristics and determine capacity. Fig.9 Example of Screen Wllh Obvious Sag (H-bar Slgnal) Method for determining capacity of output coupling capacitor The HPF is formed in the same way by the output coupllng capacitor and the lnpul impedance of the IC which connects with the following paragraph by the Vldeo output termlnal, so estimate an output ooupling capacitor Wllh necessary capacity according to the formula (a). The case of insert ser e resistor at VlN and VGND terminals Use the same value resistance when insert serge resistor(Fig 4 R41 and R51) at video input lerminals(max value 1km. The degradation of CMRR etc are not deteriorating when insel1lng resistance with the same value. 0 Reference data [Unless otherwise specified, VCC:5V. Ta:25°C] s s11:11111;;;.1111 31111111111111 1 41111111111111111 sw111111111111 £3 E31111111111111111 {39 K11111111 o u e 21111111111111111 ; 111111111111 1 11111111111111111 Ew111111111111 llllllllllllllll > llllllllllll Temp [‘C] vcclv] Temp [‘C] Frgm Flg.“ Flg.12 Clrcult Current vs Clrcull Current vs, Maxlmum Output Level vs, Ambient Temperature Supply Voltage Amp1ent Temperature 355 llll llll llll llll D“ r 1111111111111111 :02 a D llll ll l llll llll I \ I 5351111111111111111 Em) E ,; 111111111111111 Q t 3 1111111111111111 ( ( £ 1111111111111111 ”VAN ‘9 ‘3“1111111111111111 .01 VCCW] T:mn[‘C] VCC[V] FIgJS Flg.14 F1915 Maximum Output Level vs. Gam vs. Gam vs. Supply Voltage Amp1eni Temperature Supply Vpltage WWW-mhmmm 6/9 2015.03 - Rev.B © 2015 ROHM 00.. Ltd. All rlghts reserved.
Technical Note
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BH7673G
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Cautions for selection and use of application parts
Method for determining capacity of input coupling capacitor
The input coupling capacitor and input impedance Zin (=150k) inside the IC composes HPF.
When the cutoff frequency(fc) of HPF takes from 1 Hz to be computed by the following formula (a). The value of the input
coupling capacitor is computed with the degree as much as 1uF (Generally, the fc takes from equal to or less than several Hz).
fc=1 / (2π×C×Zin)・・・・(a)
When evaluating the Sag characteristics and determining the capacity of the capacitor during video signal input, a horizontal
stripe signal called "H bar" (shown in Fig.9) is suitable, and this type of signal is used instead of a color bar signal to evaluate
characteristics and determine capacity.
Fig.9 Example of Screen with Obvious Sag (H-bar Signal)
Method for determining capacity of output coupling capacitor
The HPF is formed in the same way by the output coupling capacitor and the input impedance of the IC which connects with the
following paragraph by the video output terminal, so estimate an output coupling capacitor with necessary capacity according to
the formula (a).
The case of insert serge resistor at VIN and VGND terminals
Use the same value resistance when insert serge resistor(Fig.4 R41 and R51) at video input terminals(max value1k).
The degradation of CMRR etc are not deteriorating when inserting resistance with the same value.
Reference data [Unless otherwise specified, VCC=5V, Ta=25]
0
1
2
3
4
5
6
-50 0 50 100
Temp.[]
ICC[mA]
Fig.10
Circuit Current vs.
Ambient Temperature
0
1
2
3
4
5
6
4.0 4.5 5.0 5.5 6.0
VCC[V]
ICC[mA]
Fig.11
Circuit Current vs.
Supply Voltage
3.6
3.7
3.8
3.9
4.0
4.1
4.2
-50 0 50 100
Temp.[]
VOM(f=10kHz, THD=1.0%)[Vpp]
Fig.12
Maximum Output Level vs.
Ambient Temperature
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4.04.55.05.56.0
VCC[V]
VOM(f=10kHz, THD=1.0%)[Vpp]
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
-50 0 50 100
Temp.[]
GAIN(f=1MHz)[dB]
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
4.04.55.05.56.0
VCC[V]
GAIN(f=1MHz)[dB]
Fig.13
Maximum Output Level vs.
Supply Voltage
Fig.14
Gain vs.
Ambient Temperature
Fig.15
Gain vs.
Supply Voltage
Technical Note
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BH7673G
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-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
-50 0 50 100
Temp.[℃]
Freq. Responce1(10M/1MHz)[dB]
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
4.0 4.5 5.0 5.5 6.0
VCC[V]
Freq. Responce1(10M/1MHz)[dB]
Fig.16
Frequency Responce1 vs.
Ambient Temperature
Fig.17
Frequency Responce1 vs.
Supply Voltage
Fig.18
Frequency Responce2 vs.
Ambient Temperature
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 0 50 100
Temp.[℃]
Freq. Responce2(30M/1MHz)[dB]
-70
-65
-60
-55
-50
4.0 4.5 5.0 5.5 6.0
VCC[V]
CMRR(f=20kHz)[dB]
-70
-60
-50
-40
-30
-20
-10
1k 10k 100k 1M 10M 100M
Frequency[Hz]
CMRR[dB]
Fig.22
Common Mode Rejection Ratio vs.
Supply Voltage
Fig.23
Common Mode Rejection Ratio vs.
Frequency
Fig.24
Input Impedance vs.
Ambient Temperature
100
120
140
160
180
200
-50 0 50 100
Temp.[℃]
Zin[kΩ]
Fig.25
Input Impedance vs.
Supply Voltage
Fig.26
Differential Gain & Differential Phase vs.
Ambient Temperature
Fig.27
Differential Gain & Differential Phase vs.
Supply Voltage
100
120
140
160
180
200
4.04.55.05.56.0
VCC[V]
Zin[kΩ]
0.0
0.2
0.4
0.6
0.8
-50 0 50 100
Temp.[℃]
DG[%], DP[deg.]
DP
DG
0.0
0.2
0.4
0.6
0.8
4.0 4.5 5.0 5.5 6.0
VCC[V]
DG[%], DP[deg.]
DP
DG
-70
-65
-60
-55
-50
-50 0 50 100
Temp.[℃]
CMRR(f=20kHz)[dB]
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
4.0 4.5 5.0 5.5 6.0
VCC[V]
Freq. Responce2(30M/1MHz)[dB]
Fig.19
Frequency Responce2 vs.
Supply Voltage
Fig.20
Gain vs. Frequency
Fig.21
Common Mode Rejection Ratio vs.
Ambient Temperature
-8
-6
-4
-2
0
2
1M 10M 100M
Frequency[Hz]
GAIN[dB]
Fig.30 Exlem www.mhmmm © 2015 ROHM Co.‘ le. Au nghls reserved.
Technical Note
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External dimensions and label codes
Fig.30 External Dimensions of BH7673G Package
A
Lot No.
5
SSOP5 ( UNITmm )
60
65
70
75
80
-50 0 50 100
Temp.[℃]
S/N Y[dB]
60
65
70
75
80
4.04.55.05.56.0
VCC[V]
S/N Y[dB]
Fig.28
S/N Y vs.
Ambient Temperature
Fig.29
S/N Y vs.
Supply Voltage
The name 0! an anicle 2m; [:23 [:23 E253 E283 E283 Tape Embassed camev \ape Ouanmy acoupcs D I TH 0:31;" The dwecnon ‘5 me um m menu \S a! me awe! Hgm when you new ( my on the m "and and you pun out me mpg on me ngm new ) \—‘ 1pm 0 o o o o O o o o 0 \—,\‘ www.mhmmm © 2015 ROHM Co.‘ le. Au nghls reserved. 9/9
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The ordering -shaped name selection
B
The name of an article The wrapping specification
H 7 6 7 3 G T R
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
SSOP5
2.9±0.2
0.13
4°+6°
4°
1.6
2.8±0.2
1.1±0.05
0.05±0.05
+0.2
0.1
+0.05
0.03
0.42+0.05
0.04
0.95
54
123
1.25Max.
0.2Min.
0.1 S
S
Datasheet
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.