Chip Quik Inc. 的 SMD291SNL 规格书

www.chigguik.com *Shell Life Notes:
Datasheet revision 1.2 www.chipquik.com
Solder Paste No-Clean SAC305 in 5cc Syringe 15g T3 Mesh
Product Highlights
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Dispense grade
Compatible with enclosed print heads
Passes BONO test @1.56%
RoHS II and REACH compliant
Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 87% Metal by Weight
Melting Point: 217-220°C (423-428°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months *See notes below:
*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
thoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
1 © 1994-2017 Chip Quik® Inc.
S
SM
MD
D2
29
91
1S
SN
NL
L
L: 2100MQ (No
Recommended Profile
Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization.
Test Results
Test J-STD-004 or other
requirements as stated
Test Requirement
Result
Copper Mirror
IPC-TM-650: 2.3.32
L: No breakthrough
Corrosion
IPC-TM-650: 2.6.15
L: No corrosion
Quantitative Halides
IPC-TM-650: 2.3.28.1
L: <0.5%
Electrochemical Migration
IPC-TM-650: 2.6.14.1
L: <1 decade drop (No-clean)
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
IPC-TM-650: 2.6.3.7
L: ≥100MΩ (No-clean)
Tack Value
IPC-TM-650: 2.4.44
64g
Viscosity – Malcom @ 10 RPM/25°C
(x10
3
mPa/s)
IPC-TM-650: 2.4.34.4
Print: 155-215, Dispense: 125-170
Visual
IPC-TM-650: 3.4.2.5
Clear and free from precipitation
Conflict Minerals Compliance
Electronic Industry Citizenship
Coalition (EICC)
Compliant
REACH Compliance
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-005A (Solder Pastes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: Yes
2 © 1994-2017 Chip Quik® Inc.
25°C (77°F)
0sec
150°C (302°F)
175°C (347°F)
217°C (423°F)
249°C (480°F)
90sec
180sec
210sec
240sec
270sec
Time