Texas Instruments 的 TPA6138A2 规格书

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INR+
INR-
INL+
INL-
OUTR
OUTL
GND
GND
VSS
CPCN
UVP
VDD
MUTE
Gain-Setting
Resistor
Array
OUTR+
OUTR-
OUTL+
OUTL-
CODEC
VBAT
MUTE CONTROL
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TPA6138A2 DirectPath™ Headphone Driver With Adjustable Gain
1 Features 3 Description
The TPA6138A2 is a pop-free stereo headphone
1• Stereo DirectPath™ Headphone Amplifier amplifier designed to allow the removal of the output
– 40 mW Into 32 ΩWith 3.3-V Supply dc-blocking capacitors for reduced component count
• Low THD+N < 0.01% at 10 mW Into 32 Ωand cost. The device is ideal for single-supply
electronics where size and cost are critical design
• High SNR, >90 dB parameters.
• Differential Input and Single-Ended Output Designed using TI’s patented DirectPath™
• Adjustable Gain by External Gain-Setting technology, The TPA6138A2 is capable of driving 25
Resistors mW into a 32-Ωload with 3.3-V supply voltage. The
• Configurable as a Second-Order Low-Pass Filter device has differential inputs and uses external gain-
– Ideal for PWM Audio Sources setting resistors that supports a gain range of ±1 V/V
to ±10 V/V. Gain can be configured individually for
• Low DC Offset, <1 mV each channel. The device can also be configured as
• Ground-Referenced Outputs Eliminate DC- a second-order low-pass filter and is ideal for
Blocking Capacitors interfacing with PWM audio sources. Audio output
– Reduce Board Area compiles with ±8-kV IEC ESD protection, requiring
just a simple resistor-capacitor ESD protection circuit.
– Reduce Component Cost The TPA6138A2 has built-in active-mute control for
– Improve THD+N Performance pop-free audio on/off control. The TPA6138A2 has an
– No Degradation of Low-Frequency Response external undervoltage detector that mutes the output
Due to Output Capacitors when the power supply is removed, ensuring a pop-
free shutdown.
• Short-Circuit Protection
• Click- and Pop-Reduction Circuitry Using the TPA6138A2 in audio products can reduce
component count considerably compared to
• External Undervoltage Mute traditional headphone amplifiers. The TPA6138A2
• Active Mute Control for Pop-Free Audio On/Off does not require a split-rail power supply or a dc
Control blocking capacitor. The TPA6138A2 integrates its
• Space-Saving TSSOP Package own charge pump to generate a negative supply rail
that provides a clean, pop-free ground-biased audio
signal.
2 Applications
The TPA6138A2 is available in a 14-pin TSSOP.
• LCD and PDP TV
• Blu-ray Disc™, DVD Players Device Information(1)
• Set-Top Boxes PART NUMBER PACKAGE BODY SIZE (NOM)
• Mini/Micro Combo Systems TPA6138A2 TSSOP (14) 5.00 mm × 4.40 mm
• Sound Cards (1) For all available packages, see the orderable addendum at
• Laptops the end of the datasheet.
Simplified Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
9.2 Functional Block Diagram......................................... 8
1 Features.................................................................. 19.3 Feature Description................................................... 8
2 Applications ........................................................... 19.4 Device Functional Modes.......................................... 9
3 Description ............................................................. 110 Application and Implementation........................ 11
4 Revision History..................................................... 210.1 Application Information.......................................... 11
5 Device Comparison Table..................................... 310.2 Typical Application ............................................... 12
6 Pin Configuration and Functions......................... 311 Power Supply Recommendations ..................... 13
7 Specifications......................................................... 412 Layout................................................................... 14
7.1 Absolute Maximum Ratings ..................................... 412.1 Layout Guidelines ................................................. 14
7.2 ESD Ratings.............................................................. 412.2 Layout Example .................................................... 14
7.3 Recommended Operating Conditions....................... 413 Device and Documentation Support ................. 15
7.4 Thermal Information.................................................. 413.1 Device Support...................................................... 15
7.5 Electrical Characteristics........................................... 513.2 Community Resources.......................................... 15
7.6 Operating Characteristics.......................................... 513.3 Trademarks........................................................... 15
7.7 Typical Characteristics.............................................. 613.4 Electrostatic Discharge Caution............................ 15
8 Parameter Measurement Information .................. 713.5 Glossary................................................................ 15
9 Detailed Description.............................................. 714 Mechanical, Packaging, and Orderable
9.1 Overview ................................................................... 7Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2011) to Revision B Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, Parameter Measurement Information section, and Mechanical, Packaging, and
Orderable Information section ............................................................................................................................................... 1
• Added the information in Section 8.1 as "Direct Path Headphone Driver" to Feature Description section............................ 8
• Removed section "Gain-Setting Resistors" ........................................................................................................................... 9
Changes from Original (January 2011) to Revision A Page
• Added Rev A and May 2011 to Header, No other changes to page 1................................................................................... 1
• Changed Pin Functions Description for UVP pin from "connect to PVDD with a 10-kΩresistor if function is unused"
to "internal pull-up, unconnected if UVP function is unused". ................................................................................................ 3
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1
+INR
2
3
4
–INR
OUTR
GND
5
6
78
Mute
VSS
CN
9
10
11
12
13
14
CP
VDD
GND
OUTL
–INL
+INL
Charge Pump
UVP
External
Under-
Voltage
Detector
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5 Device Comparison Table
TPA6138A2 TPA6130A2 TPA6132A2 TPA6133A2 TPA6136A2 TPA6140A2 TPA6141A2
Ground-Centered Outputs Yes Yes Yes Yes Yes Yes Yes
Class-G – – – – – Yes Yes
Special Features Adj. Gain - Gain Select Fixed Gain Gain Select – Gain Select
Volume Control – Yes – – – Yes –
Headphone Channels Stereo Stereo Stereo Stereo Stereo Stereo Stereo
Output Power (W) 0.25 0.138 0.025 0.138 0.025 0.025 0.025
PSRR (dB) 80 109 100 109 100 105 105
6 Pin Configuration and Functions
PW Package
14-Pin TSSOP
(Top View)
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
CN 7 I/O Charge-pump flying capacitor negative connection
CP 8 I/O Charge-pump flying capacitor positive connection
GND 4, 10 P Ground
–INL 13 I Left-channel OPAMP negative input
+INL 14 I Left-channel OPAMP positive input
–INR 2 I Right-channel OPAMP negative input
+INR 1 I Right-channel OPAMP positive input
Mute 5 I Mute, active-low
OUTL 12 O Left-channel OPAMP output
OUTR 3 O Right-channel OPAMP output
UVP 11 I Undervoltage protection; internal pull-up, unconnected if UVP function is unused.
VDD 9 P Positive supply
VSS 6 P Supply voltage
(1) I = input, O = output, P = power
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD to GND –0.3 4 V
Input voltage, VIVSS – 0.3 VDD + 0.3 V
Minimum load impedance – line outputs – OUTL, OUTR 12.8 Ω
Mute to GND, UVP to GND –0.3 VDD +0.3 V
Maximum operating junction temperature range, TJ–40 150 °C
Storage temperature range, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000
Electrostatic
V(ESD) V
discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN NOM MAX UNIT
VDD Power supply DC supply voltage 3 3.3 3.6 V
RLLoad impedance 16 32 Ω
VIL Low-level input voltage Mute 40 %VDD
VIH High-level input voltage Mute 60 %VDD
TAAmbient temperature –40 25 85 °C
7.4 Thermal Information
TPA6138A2
THERMAL METRIC(1) PW (TSSOP) UNIT
14 PINS
RθJA Junction-to-ambient thermal resistance 130 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49 °C/W
RθJB Junction-to-board thermal resistance 63 °C/W
ψJT Junction-to-top characterization parameter 3.6 °C/W
ψJB Junction-to-board characterization parameter 62 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
VDD = 3.3 V, RDL = 32 Ω, Rfb = 30 kΩ, RIN = 15 kΩ, TA= 25°C, Charge pump: CP= 1 µF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOS| Output offset voltage VDD = 3.3 V 0.5 1 mV
PSRR Power-supply rejection ratio 80 dB
VOH High-level output voltage VDD = 3.3 V 3.1 V
VOL Low-level output voltage VDD = 3.3 V –3.05 V
VUVP_EX External UVP detect voltage 1.25 V
VUVP_EX_HYSTERESIS External UVP detect hysteresis current 5 µA
fCP Charge-pump switching frequency 200 300 400 kHz
|IIH| High-level input current, Mute VDD = 3.3 V, VIH = VDD 1 µA
|IIL| Low-level input current, Mute VDD = 3.3 V, VIL = 0 V 1 µA
VDD = 3.3 V, no load, Mute = VDD, no load 5 14 25
IDD Supply current mA
VDD = 3.3 V, no load, Mute = GND, 14
disabled
7.6 Operating Characteristics
VDD = 3.3 V, RDL = 32 Ω, Rfb = 30 kΩ, RIN = 15 kΩ, TA= 25°C, Charge pump: CP= 1 µF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POOutput power, outputs in phase THD+N = 1%, VDD = 3.3 V, f = 1 kHz, RL= 32 Ω40 mW
THD+N Total harmonic distortion plus noise VDD = 3.3V, f = 1kHz, RLD = 32Ω, Po = 10mW 0.01%
SNR Signal-to-noise ratio(1) A-weighted 90 96 dB
DNR Dynamic range(2) A-weighted 90 100 dB
VNNoise voltage A-weighted 13 μV
ZOOutput Impedance when muted Mute = GND 110 mΩ
Input-to-output attenuation when Mute = GND 80 dB
muted
Crosstalk—L to R, R to L Po = 20 mW –75 dB
ILIMIT Current limit PVDD = 3.3 V 50 mA
(1) SNR is calculated relative to 25-mW output.
(2) DNR is calculated relative to output at 1% THD+N.
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0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
20 50 100 200 500 1k 2k 5k 10k 20k
f – Frequency – Hz
Crosstalk – dB
20 50 100 200 500 1k 2k 5k 10k 20k
f - Frequency - Hz
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
32 W
16 W
PSRR - Power Supply Rejection Ratio - dB
1
5
0.1
0.05
0.01
0.005
0.001
THD+N – Total Harmonic Distortion+Noise – %
20 50 100 200 500 1k 2k 5k 10k 20k
f – Frequency – Hz
10 mW
Gain = 2 V/V,
Active Filter
20 mW
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7.7 Typical Characteristics
VDD = 3.3 V , TA= 25°C, C(PUMP) = C(VSS) = 1 μF , CIN = 2.2 μF, RIN = 15 kΩ, Rfb = 30 kΩ, ROUT = 10 Ω, COUT = 1 nF
(unless otherwise noted)
VDD = 3.3 V, RL= 32 ΩVDD = 3.3 V, RL= 16 Ω
Figure 1. Total Harmonic Distortion and Noise Figure 2. Total Harmonic Distortion and Noise
vs Output Power vs Output Voltage
VDD = 3.3 V, RL= 32 ΩVDD = 3.3 V RL= 16 Ω
Figure 3. Total Harmonic Distortion and Noise vs Frequency Figure 4. Total Harmonic Distortion and Noise vs Frequency
Gain = 6dB Vripple = 200 mVpp
Figure 6. Supply Rejection Ratio vs Frequency
Figure 5. Crosstalk vs Frequency
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8 Parameter Measurement Information
All parameters are measured according to the conditions described in Specifications.
9 Detailed Description
9.1 Overview
The TPA6138A2 is a DirectPath™ stereo headphone amplifier that requires no output DC blocking capacitors
and is capable of delivering 25m-W into a 32-Ωload. The device has built-in pop suppression circuitry to
completely eliminate pop noise during turn- on and turn-off. The amplifier outputs have short-circuit protection.
The TPA6138A2 features fully differential inputs to reduce system noise pickup between the audio source and
the headphone amplifier. The high power supply noise rejection performance and differential architecture
provides increased RF noise immunity.
The TPA6138A2 gain is controlled by external resistors Rin and Rfb, see the Gain-Setting Resistor Ranges
section for recommended values.
The TPA6138A2 operates from a single 3-V to 3.6-V supply, as it uses a built-in charge pump to generate a
negative voltage supply for the headphone amplifiers.
The TPA6138A2 features an external undervoltage protection which must be set according to TPA6138A2 UVP
Operation.
The TPA6138A2 can also be used as a standard operational amplifier (op amp), this makes possible to configure
the device as a second-order low-pass filter to remove out-of-band noise.
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L O
1
f =
2 R Cp
Click and Pop
Suppression
Short-Circuit
Protection
GND
Bias
Circuitry
VSS
CN CP
VDD
–INR
+INR
OUTL
–INL
OUTR
+INL
Mute GND
UVP
Driver
Headphone
Driver Headphone
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9.2 Functional Block Diagram
9.3 Feature Description
9.3.1 Direct Path Headphone Driver
Single-supply line-driver amplifiers typically require dc-blocking capacitors. The top drawing in Figure 7 illustrates
the conventional line-driver-amplifier connection to the load and output signal. DC blocking capacitors are often
large in value. The headphone load (typical resistive values of 16 Ωto 32 Ω) combine with the dc blocking
capacitors to form a high-pass filter. Equation 1 shows the relationship between the load impedance (RL), the
capacitor (CO), and the cutoff frequency (fC).
(1)
COcan be determined using Equation 2, where the load impedance and the cutoff frequency are known.
(2)
If fCis low, the capacitor must then have a large value because the load resistance is small. Large capacitance
values require large package sizes. Large package sizes consume PCB area, stand high above the PCB,
increase cost of assembly, and can reduce the fidelity of the audio output signal.
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OPAMP
Co
Mute Circuit
Output
Enable
+
+
+
–
Conventional Solution
Mute Circuit
Output
Enable
3.3 V
+
–
TPA6138A2 Solution
VDD
VSS
GND
VDD
VDD/2
GND
DirectPath™
9 V–12 V
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Feature Description (continued)
Figure 7. Conventional and DirectPath Line Driver
The DirectPath amplifier architecture operates from a single supply but makes use of an internal charge pump to
provide a negative voltage rail. Combining the user-provided positive rail and the negative rail generated by the
IC, the device operates in what is effectively a split-supply mode. The output voltages are now centered at zero
volts with the capability to swing to the positive rail or negative rail. The DirectPath amplifier requires no output
dc-blocking capacitors. The bottom block diagram and waveform of Figure 7 show the ground-referenced line-
driver architecture. This is the architecture of the TPA6138A2.
9.4 Device Functional Modes
9.4.1 Mute Operation
The TPA6138A2 is able to turn off the output transistors by asserting to low level the Mute pin. This option is
useful when an idle state is needed.
9.4.2 Using the TPA6138A2 as a Second-Order Filter
Several audio DACs used today require an external low-pass filter to remove out-of-band noise. This is possible
with the TPA6138A2, as it can be used like a standard OPAMP. Several filter topologies can be implemented,
both single-ended and differential. In Figure 8, a multi-feedback (MFB) topology with differential input and single-
ended input is shown.
An ac-coupling capacitor to remove dc content from the source is shown; it serves to block any dc content from
the source and lowers the dc gain to 1, helping to reduce the output dc offset to a minimum.
To calculate the component values, use the TI WEBENCH®Filter Designer (www.ti.com/filterdesigner)
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R1
R2
R3
VSUP_MO
UVP
–IN
Differential Input Inverting Input
TPA6138A2
R1
R1
R2
R2
+
–
C3
C3
R3
R3 C1
C1
C2
R1
R2
+
–
C3 R3 C1
C2
+IN
–IN
TPA6138A2
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Device Functional Modes (continued)
Figure 8. Second-Order Active Low-Pass Filter
The resistor values should have a low value for obtaining low noise, but should also have a high enough value to
allow use of a small-size ac-coupling capacitor. With the proposed values of 15 kΩ, 30 kΩ, and 43 kΩ, a dynamic
range (DYR) of 106 dB can be achieved with a 1-μF input ac-coupling capacitor.
9.4.3 TPA6138A2 UVP Operation
The shutdown threshold at the UVP pin is 1.25 V. The customer must use a resistor divider to obtain the
shutdown threshold and hysteresis desired for a particular application. The customer-selected thresholds can be
determined as follows:
VUVP = (1.25 – 6 µA × R3) × (R1 + R2) / R2 (3)
Hysteresis = 5 µA × R3 × (R1 + R2) / R2 (4)
For example, to obtain VUVP = 3.8 V and 1-V hysteresis, we can use R1 = 3 kΩ,R2=1kΩand R3 = 50 kΩ.
Figure 9. UVP Resistor Divider
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cIN IN
IN IN cIN IN
1 1
f = C =
2 R C 2 f R
or
p p
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPA6138A2 starts its operation by asserting the MUTE pin to logic 1. The device enters in mute mode when
pulling low MUTE pin. The charge pump generates a negative supply voltage. The charge pump flying capacitor
connected between CP and CN transfers charge to generate the negative supply voltage. The output voltages
are capable of positive and negative voltage swings and are centered close to 0 V, eliminating the need for
output capacitors. Input coupling capacitors block any dc bias from the audio source and ensure maximum
dynamic range. The device has built-in pop suppression circuitry to completely eliminate pop noise during turn-
on, turn-off and enter or exit shutdown mode.
10.1.1 Gain-Setting Resistor Ranges
The gain-setting resistors, RIN and Rfb, must be chosen so that noise, stability, and input capacitor size of the
TPA6138A2 are kept within acceptable limits. Voltage gain is defined as Rfb divided by RIN.
Selecting values that are too low demands a large input ac-coupling capacitor, CIN. Selecting values that are too
high increases the noise of the amplifier. Table 1 lists the recommended resistor values for different inverting-
input gain settings.
Table 1. Recommended Resistor Values
INPUT RESISTOR VALUE, RIN FEEDBACK RESISTOR VALUE,
GAIN Rfb
–1 V/V 10 kΩ10 kΩ
–1.5 V/V 8.2 kΩ12 kΩ
–2 V/V 15 kΩ30 kΩ
–10 V/V 4.7 kΩ47 kΩ
10.1.2 Input-Blocking Capacitors
DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the
TPA6138A2. These capacitors block the dc portion of the audio source and allow the TPA6138A2 inputs to be
properly biased to provide maximum performance.
These capacitors form a high-pass filter with the input resistor, RIN. The cutoff frequency is calculated using
Equation 5. For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the
input resistor chosen from Table 1; then the frequency and/or capacitance can be determined when one of the
two values is given.
It is recommended to use electrolytic capacitors or high-voltage-rated capacitors as input blocking capacitors to
ensure minimal variation in capacitance with input voltages. Such variation in capacitance with input voltages is
commonly seen in ceramic capacitors and can increase low-frequency audio distortion.
(5)
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R3
C1
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LEFT
INPUT
LEFT OUTPUTRIGHT OUTPUT
3.3-V Supply
C2
C1
R3
R2
R2
R1R1
R3
+
–
C2
R3
R1
R1
1mF
R2
C1
R2
C1
1mF
1mF
Linear
Low-Dropout
Regulator
R11
R12
10mF
System Supply
C3
C3
C3
C3
Headphone
Driver
Headphone
Driver
Short-Circuit
Protection
Click and Pop
Suppression
Bias
Circuitry
+INR
–INR
TPA6138A2
–INL
OUTL
UVP
+INL
GND
VDD
CPCN
MUTE
VSS
GND
OUTR
TPA6138A2
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10.2 Typical Application
R1 = 15 kΩ, R2 = 30 kΩ, R3 = 43 kΩ, C1 = 47 pF, C2 = 180 pF
Figure 10. Typical Application Schematic
10.2.1 Design Requirements
This typical application requires the parameters listed in Table 2.
Table 2. Design Parameters
PARAMETER VALUES
Input voltage range 3 V to 3.6 V
Current 14 mA to 25 mA
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10.2.2 Detailed Design Procedure
10.2.2.1 Charge-Pump Flying Capacitor and VSS Capacitor
The charge-pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.
The VSS capacitor must be at least equal to the charge-pump capacitor in order to allow maximum charge
transfer. Low-ESR capacitors are an ideal selection, and a value of 1 μF is typical. Capacitor values that are
smaller than 1 μF can be used, but the maximum output voltage may be reduced, and the device may not
operate to specifications. If the TPA6138A2 is used in highly noise-sensitive circuits, it is recommended to add a
small LC filter on the VDD connection.
10.2.2.2 Decoupling Capacitors
The TPA6138A2 is a DirectPath headphone amplifier that requires adequate power-supply decoupling to ensure
that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 1 μF, placed as close as possible to the device VDD lead works best. Placing this
decoupling capacitor close to the TPA6138A2 is important for the performance of the amplifier. For filtering
lower-frequency noise signals, a 10-μF or greater capacitor placed near the audio power amplifier would also
help, but it is not required in most applications because of the high PSRR of this device.
10.2.3 Application Curves
See the curves listed in Table 3 for the application curves.
Table 3. Table of Graphs
FIGURE
Total Harmonic Distortion and Noise vs Output Power Figure 1
Total Harmonic Distortion and Noise vs Output Voltage Figure 2
Total Harmonic Distortion and Noise vs Frequency Figure 3
Total Harmonic Distortion and Noise vs Frequency Figure 4
Crosstalk vs Frequency Figure 5
Supply Rejection Ratio vs Frequency Figure 6
11 Power Supply Recommendations
The TPA6138A2 DirectPath headphone amplifier requires adequate power supply decoupling to ensure that
output noise and total harmonic distortion (THD) remain low. Use good low equivalent-series-resistance (ESR)
ceramic capacitors (X5R material or better is required for best performance). Place a 2.2 μF capacitor within 5
mm of the VDD pin. Reducing the distance between the decoupling capacitor and VDD minimizes parasitic
inductance and resistance, improving TPA6138A2 supply rejection performance. Use 0402 or smaller size
capacitors if possible.
For additional supply rejection, connect an additional 10 μF or higher value capacitor between VDD and ground.
This will help filter lower frequency power supply noise. The high power supply rejection ratio (PSRR) of the
TPA6138A2 makes the 10μF capacitor unnecessary in most applications.
Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TPA6138A2
i TEXAS INSTRUMENTS UVP W; g o Lw W W WT : an» I GNDiLw W W W : n 73M; HHHHHH \ . L Decoupling capacitors as TPA6138A2 235%???” resis\t:)r/Filter close as possible to the IC huuuuuu / Rm W W W ELWE : W ‘r ” I A GND_Rw if W W# MUTE Jwv - 0 III
Connection to ground plane Connection to power 3.3V
Top layer traces Top layer ground plane
Right Output
Left Output
TPA6138A2
SLOS704B –JANUARY 2011–REVISED AUGUST 2015
www.ti.com
12 Layout
12.1 Layout Guidelines
12.1.1 Gain-Setting Resistors
The gain-setting resistors, RIN and Rfb, must be placed close to pins 13 and 17, respectively, to minimize
capacitive loading on these input pins and to ensure maximum stability of the TPA6138A2. For the
recommended PCB layout, see the TPA6138A2EVM User's Guide (SLOU305).
12.1.2 Decoupling Capacitors Placement
A low equivalent-series-resistance (ESR) ceramic capacitor, typically 1 μF, placed as close as possible to the
device VDD lead works best. Placing this decoupling capacitor close to the TPA6138A2 is important for the
performance of the amplifier. For filtering lower-frequency noise signals, a 10-μF or greater capacitor placed near
the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of
this device
12.2 Layout Example
14 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TPA6138A2
l TEXAS INSTRUMENTS
TPA6138A2
www.ti.com
SLOS704B –JANUARY 2011–REVISED AUGUST 2015
13 Device and Documentation Support
13.1 Device Support
13.1.1 Development Support
For the TPA6138A2EVM and Gerber files, go to www.ti.com/tool/TPA6138A2EVM.
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
DirectPath, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
Blu-ray Disc is a trademark of Blu-ray Disc Association.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: TPA6138A2
I TEXAS INSTRUMENTS Sample: Sample: Sample:
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
HPA01075PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TPA6138
TPA6138A2PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TPA6138
TPA6138A2PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TPA6138
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+K0 '«PI» Reel Diame|er AD Dimension deSIgned Io accommodate me componem wIdIh E0 Dimension desIgned Io eeeemmodaIe me component Iengm K0 Dlmenslun desIgned to accommodate me componem Ihlckness 7 w Overall with loe earner cape i p1 Pitch between successwe cavIIy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O SprockeIHoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPA6138A2PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA6138A2PWR TSSOP PW 14 2000 350.0 350.0 43.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 2
l TEXAS INSTRUMENTS T - Tube height| L - Tube length l ,g + w-Tuhe _______________ _ ______________ width 47 — B - Alignment groove width
TUBE
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
TPA6138A2PW PW TSSOP 14 90 530 10.2 3600 3.5
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 3
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PW (RiPDsoicM) LAND PATTERN DATA PLASTHC SMALL OUTLINE Example Board Layout (Male 0) —>| ‘,——12x0 65 HHHHHHHi 5,60 HHHHHHHHi l“ l l l Example Non So‘dermask Defined Pad 4 x 1,60 / H l <—0,07 y/="" ah="" around="" pad="" seamelry="" (see="" nale="" c)="" solder="" mask="" opening="" (see="" note="" e)="" stencil="" 0="" en'ln="" s="" (notepd)="" ‘3="" 14x0="" 30="" h="" '«,lzxo="" 65="" ~hhhhhh~="" 5,60="" hhhhhhh—="" example="" example="" 421128472/6="" 08/15="" notes:="" ah="" h‘lneor="" dimensions="" one="" in="" rnihll'rneters.="" tn‘ls="" dvowing="" is="" subject="" lp="" change="" wltnoul="" nallee.="" publl'cotlon="" hpcjssh="" is="" recommended="" lar="" allemale="" deslgns.="" laser="" cutllng="" apertures="" wch="" tropexoidm="" walls="" and="" also="" raund‘lna="" comers="" wlll="" we!="" better="" pasle="" release="" customers="" show="" contact="" their="" board="" assembly="" sl’te="" (ov="" stenci‘="" design="" recommendations.="" reler="" to="" ”50—7525="" lur="" other="" stencl‘="" recommendotluns="" customers="" shou‘d="" contact="" their="" board="" hoercot'lon="" shte="" (or="" solder="" musk="" tolerances="" between="" and="" around="" s'lgnol="" pods.="" *1?="" tums="" instruments="" www.ti.com="">
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