onsemi 的 NSI45090JDT4G 规格书

in ON ON Semiconductors
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 3 1Publication Order Number:
NSI45090JD/D
NSI45090JDT4G
Adjustable Constant Current
Regulator & LED Driver
45 V, 90 − 160 mA + 15%, 2.7 W Package
The adjustable constant current regulator (CCR) is a simple,
economical and robust device designed to provide a cost effective
solution for regulating current in LEDs (similar to Constant Current
Diode, CCD). The CCR is based on Self-Biased Transistor (SBT)
technology and regulates current over a wide voltage range. It is
designed with a negative temperature coefficient to protect LEDs from
thermal runaway at extreme voltages and currents.
The CCR turns on immediately and is at 20% of regulation with
only 0.5 V Vak. The Radj pin allows Ireg(SS) to be adjusted to higher
currents by attaching a resistor between Radj (Pin 3) and the Cathode
(Pin 4). The Radj pin can also be left open (No Connect) if no
adjustment is required. It requires no external components allowing it
to be designed as a high or low−side regulator. The high anode-
cathode voltage rating withstands surges common in Automotive,
Industrial and Commercial Signage applications. This device is
available in a thermally robust package and is qualified to stringent
AEC−Q101 standard, which is lead-free RoHS compliant and uses
halogen-free molding compound, and UL94−V0 certified.
Features
•Robust Power Package: 2.7 Watts
•Adjustable up to 160 mA
•Wide Operating Voltage Range
•Immediate Turn-On
•Voltage Surge Suppressing − Protecting LEDs
•UL94−V0 Certified
•SBT (Self−Biased Transistor) Technology
•Negative Temperature Coefficient
•Eliminates Additional Regulation
•NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
•Automobile: Chevron Side Mirror Markers, Cluster, Display &
Instrument Backlighting, CHMSL, Map Light
•AC Lighting Panels, Display Signage, Decorative Lighting, Channel
Lettering
•Switch Contact Wetting
•Application Note AND8391/D − Power Dissipation Considerations
•Application Note AND8349/D − Automotive CHMSL
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DPAK
CASE 369C
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
NSI45090JDT4G DPAK
(Pb−Free)
2500/Tape & Ree
l
Anode
1
4
Cathode
Ireg(SS) = 90 − 160 mA
@ Vak = 7.5 V
3
Radj
123
4
1
Y = Year
WW = Work Week
NSI90J = Specific Device Code
G = Pb−Free Package
C
A
Radj
YWW
NSI
90JG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
NSV45090JDT4G DPAK
(Pb−Free)
2500/Tape & Ree
l
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2
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Anode−Cathode Voltage Vak Max 45 V
Reverse Voltage VR500 mV
Operating and Storage Junction Temperature Range TJ, Tstg −55 to +175 °C
ESD Rating: Human Body Model
Machine Model ESD Class 3A (4000 V)
Class B (200 V)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Steady State Current @ Vak = 7.5 V (Note 1) Ireg(SS) 76.5 90 103.5 mA
Voltage Overhead (Note 2) Voverhead 1.8 V
Pulse Current @ Vak = 7.5 V (Note 3) Ireg(P) 86.2 103 119.6 mA
Capacitance @ Vak = 7.5 V (Note 4) C 17 pF
Capacitance @ Vak = 0 V (Note 4) C 70 pF
1. Ireg(SS) steady state is the voltage (Vak) applied for a time duration ≥ 80 sec, using FR−4 @ 300 mm2 2 oz. Copper traces, in still air.
2. Voverhead = Vin − VLEDs. Voverhead is typical value for 65% Ireg(SS).
3. Ireg(P) non−repetitive pulse test. Pulse width t ≤ 1 msec.
4. f = 1 MHz, 0.02 V RMS.
Figure 1. CCR Voltage−Current Characteristic
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THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation (Note 5) TA = 25°C
Derate above 25°CPD1771
14.16 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5) RθJA 70.6 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 5) RψJL4 6.8 °C/W
Total Device Dissipation (Note 6) TA = 25°C
Derate above 25°CPD2083
16.67 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 6) RθJA 60 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 6) RψJL4 6.3 °C/W
Total Device Dissipation (Note 7) TA = 25°C
Derate above 25°CPD2080
16.64 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 7) RθJA 60.1 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 7) RψJL4 6.5 °C/W
Total Device Dissipation (Note 8) TA = 25°C
Derate above 25°CPD2441
19.53 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 8) RθJA 51.2 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 8) RψJL4 5.9 °C/W
Total Device Dissipation (Note 9) TA = 25°C
Derate above 25°CPD2309
18.47 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 9) RθJA 54.1 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 9) RψJL4 6.2 °C/W
Total Device Dissipation (Note 10) TA = 25°C
Derate above 25°CPD2713
21.71 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 10) RθJA 46.1 °C/W
Thermal Reference, Junction−to−Lead 4 (Note 10) RψJL4 5.7 °C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +175 °C
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
5. FR−4 @ 300 mm2, 1 oz. copper traces, still air.
6. FR−4 @ 300 mm2, 2 oz. copper traces, still air.
7. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
8. FR−4 @ 500 mm2, 2 oz. copper traces, still air.
9. FR−4 @ 700 mm2, 1 oz. copper traces, still air.
10.FR−4 @ 700 mm2, 2 oz. copper traces, still air.
TA : 740°C TA : 25° 1 / A : as) / TA :125°C 700 mmZ/z oz 500 mm2/2 Dz 300 mm2/2 oz 700 mmZ/I Dz 500 mmzn oz 300 mmZH oz
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TYPICAL PERFORMANCE CURVES
Minimum FR−4 @ 300 mm2, 2 oz Copper Trace, Still Air
Figure 2. Steady State Current (Ireg(SS)) vs.
Anode−Cathode Voltage (Vak) Figure 3. Pulse Current (Ireg(P)) vs.
Anode−Cathode Voltage (Vak)
Figure 4. Steady State Current vs. Pulse
Current Testing
Vak, ANODE−CATHODE VOLTAGE (V)
Ireg(P), PULSE CURRENT (mA)
1051009585
75
80
85
Ireg(P), PULSE CURRENT (mA)
Ireg(SS), STEADY STATE CURRENT (mA)
90 110 115
90
95
Figure 5. Current Regulation vs. Time
100
105
120
Figure 6. Ireg(SS) vs. Radj
Vak, ANODE−CATHODE VOLTAGE (V)
96543
Ireg(SS), STEADY STATE CURRENT (mA)
710
DC Test Steady State, Still Air, Radj = Open
8
TA = −40°C
TA = 25°C
TA = 85°C
[ −0.223 mA/°C
typ @ Vak = 7.5 V
[ −0.144 mA/°C
typ @ Vak = 7.5 V
210
TA = 125°C
[ −0.155 mA/°C
typ @ Vak = 7.5 V
TIME (s)
Ireg, CURRENT REGULATION (mA)
Radj (W), Max Power 125 mW
101
80
90
100
Ireg(SS), STEADY STATE CURRENT (mA)
100
110
120
130
140
1000
0
10
30
50
60
20
40
80
100
110
70
90
150
160
Vak @ 7.5 V
TA = 25°C
Radj = Open
Vak @ 7.5 V
TA = 25°C
109.08.07.06.05.04.0
85
95
100
110
105
3.0
90
Non−Repetitive Pulse Test
TA = 25°C
Radj = Open
9040200
99
100
60
89
90
Vak @ 7.5 V
TA = 25°C
Radj = Open
91
92
93
94
95
96
97
98
103
104
101
102
803010 50 70
Figure 7. Power Dissipation vs. Ambient
Temperature @ TJ = 1755C
TA, AMBIENT TEMPERATURE (°C)
8060200−20−40
600
900
1500
1800
POWER DISSIPATION (mW)
40
700 mm2/2 oz
700 mm2/1 oz
500 mm2/1 oz
1200
2100
300
300 mm2/1 oz
500 mm2/2 oz
2400
2700
3000 300 mm2/2 oz
120100
3300
3600
3900
4200
4500
4800
140
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APPLICATIONS INFORMATION
The CCR is a self biased transistor designed to regulate the
current through itself and any devices in series with it. The
device has a slight negative temperature coefficient, as
shown in Figure 2 – Tri Temp. (i.e. if the temperature
increases the current will decrease). This negative
temperature coefficient will protect the LEDS by reducing
the current as temperature rises.
The CCR turns on immediately and is typically at 20% of
regulation with only 0.5 V across it.
The device is capable of handling voltage for short
durations of up to 45 V so long as the die temperature does
not exceed 175°C. The determination will depend on the
thermal pad it is mounted on, the ambient temperature, the
pulse duration, pulse shape and repetition.
Single LED String
The CCR can be placed in series with LEDs as a High Side
or a Low Side Driver. The number of the LEDs can vary
from one to an unlimited number. The designer needs to
calculate the maximum voltage across the CCR by taking the
maximum input voltage less the voltage across the LED
string (Figures 8 and 9).
Figure 8.
Figure 9.
Higher Current LED Strings
Two or more fixed current CCRs can be connected in
parallel. The current through them is additive (Figure 10).
Figure 10.
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Other Currents
The adjustable CCR can be placed in parallel with any
other CCR to obtain a desired current. The adjustable CCR
provides the ability to adjust the current as LED efficiency
increases to obtain the same light output (Figure 11).
Figure 11.
Dimming using PWM
The dimming of an LED string can be easily achieved by
placing a BJT in series with the CCR (Figure 12).
Figure 12.
The method of pulsing the current through the LEDs is
known as Pulse Width Modulation (PWM) and has become
the preferred method of changing the light level. LEDs being
a silicon device, turn on and off rapidly in response to the
current through them being turned on and off. The switching
time is in the order of 100 nanoseconds, this equates to a
maximum frequency of 10 Mhz, and applications will
typically operate from a 100 Hz to 100 kHz. Below 100 Hz
the human eye will detect a flicker from the light emitted
from the LEDs. Between 500 Hz and 20 kHz the circuit may
generate audible sound. Dimming is achieved by turning the
LEDs on and off for a portion of a single cycle. This on/off
cycle is called the Duty cycle (D) and is expressed by the
amount of time the LEDs are on (Ton) divided by the total
time of an on/off cycle (Ts) (Figure 13).
Figure 13.
The current through the LEDs is constant during the period
they are turned on resulting in the light being consistent with
no shift in chromaticity (color). The brightness is in proportion
to the percentage of time that the LEDs are turned on.
Figure 14 is a typical response of Luminance vs Duty Cycle.
Figure 14. Luminous Emmitance vs. Duty Cycle
DUTY CYCLE (%)
100908070605040
0
1000
3000
ILLUMINANCE (lx)
2000
30
4000
6000
20100
5000
Lux
Linear
Reducing EMI
Designers creating circuits switching medium to high
currents need to be concerned about Electromagnetic
Interference (EMI). The LEDs and the CCR switch
extremely fast, less than 100 nanoseconds. To help eliminate
EMI, a capacitor can be added to the circuit across R2.
(Figure 12) This will cause the slope on the rising and falling
edge on the current through the circuit to be extended. The
slope of the CCR on/off current can be controlled by the
values of R1 and C1.
The selected delay / slope will impact the frequency that
is selected to operate the dimming circuit. The longer the
delay, the lower the frequency will be. The delay time should
not be less than a 10:1 ratio of the minimum on time. The
frequency is also impacted by the resolution and dimming
steps that are required. With a delay of 1.5 microseconds on
the rise and the fall edges, the minimum on time would be
30 microseconds. If the design called for a resolution of 100
dimming steps, then a total duty cycle time (Ts) of 3
milliseconds or a frequency of 333 Hz will be required.
"w 22WM: Full wave Ema: LED‘s xx xx xx xx xx xx cm 9
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Thermal Considerations
As power in the CCR increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
PD(MAX) +TJ(MAX) *TA
RqJA
Referring to the thermal table on page 2 the appropriate
RqJA for the circuit board can be selected.
AC Applications
The CCR is a DC device; however, it can be used with full
wave rectified AC as shown in application notes
AND8433/D and AND8492/D and design notes
DN05013/D and DN06065/D. Figure 15 shows the basic
circuit configuration.
Figure 15. Basic AC Application
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NSI45090JDT4G
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PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE E
b
D
E
b3
L3
L4b2
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.028 0.045 0.72 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
eBOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTION
NOTE 7
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