Littelfuse Inc. 的 SDP_CB Biased Series 规格书

u— — — w HF-
30
SIDACtor® Protection Thyristors
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Broadband Optimized Protection
SDP Biased Series
Description
Features & Benefits
t$PNQBUJCMFXJUI7%4-
(30MHz)
t#BMBODFEPWFSWPMUBHF
protection
t-PXEJTUPSUJPO
t-PXJOTFSUJPOMPTT
t-PXQSPmMF
t40GPPUQSJOUDPNQBUJCMF
t'BJMTTIPSUDJSDVJUXIFO
surged in excess of ratings
Applicable Global Standards
Electrical Characteristics
Part Number Marking VDRM@IDRM=5μA VS@100V/μs IHISIT
VT@IT=2.2
Amps Capacitance
V min V max mA min mA max A max V max
SDP0080Q38CB SDP-8C 6 25 50 800 2.2 8
See Capacitance vs
Voltage Chart
SDP0640Q38CB SDP06C 58 77 150 800 2.2 8
SDP0720Q38CB SDP07C 65 88 150 800 2.2 8
SDP0900Q38CB SDP09C 75 98 150 800 2.2 8
SDP1100Q38CB SDP11C 90 130 150 800 2.2 8
SDP1300Q38CB SDP13C 120 160 150 800 2.2 8
SDP1800Q38CB SDP18C 170 220 150 800 2.2 8
SDP2600Q38CB SDP26C 220 300 150 800 2.2 8
SDP3100Q38CB SDP31C 275 350 150 800 2.2 8
SDP3500Q38CB SDP35C 320 400 150 800 2.2 8
Notes:
- Absolute maximum ratings measured at TA= 25ºC (unless otherwise noted).
- Devices are bi-directional (unless otherwise noted).
t5*""
t*56,&OIBODFE
Level
t*56,#BTJD-FWFM
t*&$
t(3*OUFSCVJMEJOH
t(3*OUSBCVJMEJOH
t:%5
t:%5
t:%5
Pinout Designation
Agency Approvals
Agency Agency File Number
E133083
Schematic Symbol
1
2
3
4
8
7
6
5
Tip in Tip out
- Bias + Bias
Ground Ground
Ring in Ring out
SDP Biased Series - 5x6 QFN
This new SDP Biased series provides overvoltage
protection for applications such as VDSL2, ADSL2, and
"%4-XJUINJOJNBMFGGFDUPOEBUBTJHOBMT5IJTMBUFTU
silicon design innovation results in a capacitive loading
characteristic that is compatible with these high bandwidth
applications. This surface mount QFN package provides a
surge capability that exceeds most worldwide standards
and recommendations for lightning surge withstand
capability of secondary protectors.
Line In (1)
Line In (4)
-Bias (2)
Ground (3)
(8) Line Out
(5) Line Out
(7) +Bias
(6) Ground
Phillip Havens Oct 2008
31
SIDACtor® Protection Thyristors
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Broadband Optimized Protection
SDP Biased Series
Series
IPP ITSM
2x10μs 1.2x50μs/8x20μs 10x700/5x310μs 10x1000μs 600VRMS 1 cycle
A min A min A min A min ARMS
C 500 400 200 100 30
Surge Ratings
Parameter Name Test Conditions Value Units
ITSM Maximum non-reptitive
on-state current, 50/60Hz
0.5s 6.5
A
1s 4.6
2s 3.4
5s 2.3
30s 1.3
900s 0.73
50/60Hz Ratings
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+
V
-V
+I
-I
V
S
V-I: Characteristics Capacitance vs. Voltage*
0
5
10
15
20
25
30
35
40
0010111.0
Line Voltage (V)
Capacitance (pF)
0V 3.3V
5V 12V
24V 30V
50V
Bias Voltage
* Bias voltage must be lower than VDRM
Notes:
- Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product.
- IPPSBUJOHTBQQMJDBCMFPWFSUFNQFSBUVSFSBOHFPG$UP$
- The device must initially be in thermal equilibrium with -40°C < TJ <¡$
Package Symbol Parameter Value Unit
5x6 QFN
TJJunction Temperature UP °C
TSTG Storage Temperature Range UP °C
R0JA Thermal Resistance: Junction to Ambient 100 °C/W
Thermal Considerations
32
SIDACtor® Protection Thyristors
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Broadband Optimized Protection
SDP Biased Series
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – °C
Percent of VS Change – %
25 °C
25°C
Case Temperature (T
C
) - ºC
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-40 -20 0 20 40 60 80 100 120 140 160
Ratio of I
H
I
H
(T
C
= 25ºC)
Normalized VS Change vs. Junction Temperature
Normalized DC Holding Current vs. Case Temperature
Soldering Parameters
Physical Specifications
Environmental Specifications
Lead Material Copper Alloy
Terminal Finish 100% Matte-Tin Plated
Body Material UL recognized epoxy meeting flammability
classification 94V-0
High Temp Voltage
Blocking
80% Rated VDRM (VAC Peak ¡$PS¡$
504 or 1008 hrs. MIL-STD-750 (Method 1040)
JEDEC, JESD22-A-101
Temp Cycling
¡$UP¡$NJOEXFMMVQUP
cycles. MIL-STD-750 (Method 1051) EIA/JEDEC,
JESD22-A104
Biased Temp &
Humidity
52 VDC¡$3)VQUPIST&*"
JEDEC, JESD22-A-101
High Temp Storage ¡$IST.*-45%.FUIPE
JEDEC, JESD22-A-101
Low Temp Storage -65°C, 1008 hrs.
Thermal Shock
¡$UP¡$NJOEXFMMTFDUSBOTGFS
10 cycles. MIL-STD-750 (Method 1056) JEDEC,
JESD22-A-106
Resistance to Solder
Heat ¡$TFDT.*-45%.FUIPE
Moisture Sensitivity
Level
3)¡$ISTSFnPXDZDMFT
¡$1FBL+&%&$+45%-FWFM
Reflow Condition Pb-Free assembly
(see Fig. 1)
Pre Heat
- Temperature Min (Ts(min))¡$
- Temperature Max (Ts(max))¡$
- Time (Min to Max) (ts)60-180 secs.
Average ramp up rate (Liquidus Temp (TL)
to peak) 3°C/sec. Max.
TS(max) to TL - Ramp-up Rate 3°C/sec. Max.
Reflow - Temperature (TL) (Liquidus) ¡$
- Temperature (tL)60-150 secs.
Peak Temp (TP)¡$
Time within 5°C of actual Peak Temp (tp)30 secs. Max.
Ramp-down Rate 6°C/sec. Max.
Time 25°C to Peak Temp (TP)8 min. Max.
Do not exceed ¡$
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Figure 1
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Figure 1
% Littelfuse“ Dpnmsnnpphid \ Ansmug nehvmd
33
SIDACtor® Protection Thyristors
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Broadband Optimized Protection
SDP Biased Series
Dimensions — 5x6 QFN
A
B
PIN 1 INDICATOR
F (REF)
G (REF)
PIN 1 & 8: TIP CONNECTIONS
PIN 2: BIAS (-)
PIN 3 & 6: GROUND CONNECTIONS
PIN 4 & 5: RING CONNECTIONS
PIN 7: BIAS (+)
5678
432I
D
E
GF
LKH
I
J
C
Part Marking
Part Numbering
CONSTRUCTION VARIABLE
I
PP
RATING
TYPE
SDP
C
MEDIAN VOLTAGE
PACKAGE TYPE
xxx 0 Q38 B
BIASED
SIDACtor DSL Protector
Package Type Description Quantity Added Suffix Industry Standard
Q38 5x6x1.5 QFN
Tape and Reel Pack 4000 N/A EIA-481-D
Packing Options
Part Marking Code
(Refer to Electrical Characteristics Table)
Date Code
XXXXXX
XXXXX
.0200
.0500
.2920 .2050 .1180
.0279
.0100
1
.2362
6
5x6 QFN Solder Pad Layout
Dimension Inches Millimeters
Min Max Min Max
A0.187 0.207 4.745 5.253
B0.226 0.246 5.745 6.253
C0.054 0.064 1.374 1.628
D0.165 0.171 4.199 4.351
E0.027 0.033 0.686 0.838
F0.011 0.017 0.279 0.432
G0.047 0.053 1.194 1.346
H0.032 0.038 0.800 0.953
I0.027 0.033 0.686 0.838
J0.100 0.106 2.540 2.692
K0.027 0.033 0.686 0.838
L0.015 0.021 0.381 0.533
% Li elfuse‘ mums» 000%booo oooo booo¢ El EMU] Ellyn El DVD El T ; ’ T \ 41* T1» .: C? mi} T OOOIOOOOi}::¢:jfi 1 E m E: HQ ”1}
34
SIDACtor® Protection Thyristors
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Broadband Optimized Protection
SDP Biased Series
Tape and Reel Specifications — 5x6 QFN
A
B
D
C
W
1
N
Reel Dimension
K
0
P
0
P
1
W
D
0
A
0
D
1
P
2
E
2
F
W
0
CARRIER TAPE
COVER TAPE
TE
1
B
0
Tape Dimension Items
TRAILER
160mm MIN
LEADER
400mm MIN
CARRIER TAPE
COVER TAPE
Tape Leader and Trailer Dimensions
START
END
Symbols Description Inches Millimeters
Min Max Min Max
AReel Diameter N/A 12.992 N/A 330.0
BDrive Spoke Width 0.059 N/A 1.50 N/A
CArbor Hole Diameter 0.504 0.531 12.80 13.50
DDrive Spoke Diameter 0.795 N/A 20.20 N/A
NHub Diameter 1.969 N/A 50.00 N/A
W1Reel Inner Width at Hub 0.488 0.567 12.40 14.40
A0Pocket Width at Bottom 0.204 0.212 5.20 5.40
B0Pocket Length at Bottom 0.244 0.252 6.20 6.40
D0Feed Hole Diameter 0.059 0.063 1.50 1.60
D1Pocket Hole Diameter 0.059 N/A 1.50 N/A
E1Feed Hole Position 1 0.065 0.073 1.65 1.85
E2Feed Hole Position 2 0.400 0.408 10.15 10.35
FFeed Hole Center -
Pocket Hole Center 2 0.212 0.220 5.40 5.60
K0Pocket Depth 0.067 0.075 1.70 1.90
P0Feed Hole Pitch 0.153 0.161 3.90 4.10
P1Component Spacing 0.311 0.319 7.90 8.10
P2
Feed Hole Center -
Pocket Hole Center 1 0.077 0.081 1.90 2.10
TCarrier Tape Thickness 0.010 0.014 0.25 0.35
WEmbossed Carrier
Tape Width 0.460 0.484 11.70 12.30
W0Cover Tape Width 0.358 0.366 9.10 9.30