Chip Quik Inc. 的 SMDSWLT.047 4OZ 规格书

规格书反馈/错误

www.chigguik.com Tesﬁ TD-004 or other requ ements as stated Coalition (EICC)

Datasheet revision 1.0 www.chipquik.com

Sn42/Bi57/Ag1 .047” Solid Core Solder Wire 4oz Spool

Product Highlights

LOW TEMPERATURE

Melts at 138°C (281°F)

Lead-Free

RoHS III and REACH compliant

Specifications

Alloy: Sn42/Bi57/Ag1

Wire diameter: 0.047” (1.2mm)

Melting Point: 138°C (281°F)

Packaging: 4oz Spool

Storage and Handling

Store in a non-corrosive, dry environment.

Please Note: Although Sn42/Bi57/Ag1 forms strong joints and is more ductile due to the added 1% Silver, in wire form it is

brittle and needs to be handled gently when unspooling. It is normal for spooled Sn42/Bi57/Ag1 wire to have some breaks in

it.

Test Results

Test J-STD-004 or other

requirements as stated

Test Requirement Result

Conflict Minerals Compliance Electronic Industry Citizenship

Coalition

(

EICC

)

Compliant

REACH Compliance Articles 33 and 67 of Regulation (EC)

No 1907/2006

Contains no substance >0.1% w/w that

is listed as a SVHC or restricted for

use in solder materials

Conforms to the following Industry Standards:

J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes

RoHS 3 Directive (EU) 2015/863: Yes