Microchip Technology 的 MIC38150 规格书

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MIC38150
HELDO®
1.5A High Efficiency Low Dropout
Regulator
HELDO is a registered trademark of Micrel, Inc.
MLF and MicroLeadFrame are registered trademark of Amkor Technologies
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 2010
M9999-061010-C
General Description
The MIC38150 is a 1.5A continuous output current step
down converter. This is a follow on product in the new
HELDO® (High Efficiency Low DropOut Regulators) family,
that provide the benefits of an LDO with respect to ease of
use, fast transient performance, high PSRR and low noise
while offering the efficiency of a switching regulator.
As output voltages move lower, the output noise and
transient response of a switching regulator become an
increasing challenge for designers. By combining a
switcher whose output is slaved to the input of a high
performance LDO, high efficiency is achieved with a clean
low noise output. The MIC38150 is designed to provide
less than 5mV of peak-to-peak noise and over 70dB of
PSRR at 1kHz. Furthermore, the architecture of the
MIC38150 is optimized for fast load transients allowing the
output to maintain less than 30mV of output voltage
deviation even during ultra fast load steps. This makes the
MIC38150 an ideal choice for low voltage ASICs and other
digital ICs.
The MIC38150 features a fully integrated switching
regulator and LDO combination, operates with input
voltages from 3.0V to 5.5V input and offers adjustable
output voltages down to 1.0V.
The MIC38150 is offered in the small 28-pin 4mm × 6mm
× 0.9mm MLF® package and can operate from –40°C to
+125°C.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com
HELDO®
Features
• Output current up to 1.5A
• Input voltage range: 3.0V to 5.5V
• Adjustable output voltage down to 1.0V
• Output noise less than 5mV
• Ultra fast transient performance
• Unique switcher plus LDO architecture
• Fully integrated MOSFET switches
• Micro-power shutdown
• Easy upgrade from LDO as power dissipation
becomes an issue
• Thermal shutdown and current limit protection
• 4mm × 6mm × 0.9mm MLF® package
Applications
• Point-of-load applications
• Networking, server, industrial power
• Wireless base-stations
• Sensitive RF applications
___________________________________________________________________________________________________________
Typical Application
OUTPUT VOLTAGE
(50mV/div)
LOAD CURRENT
(1A/div)
2n PGND AGND 231 23a :63 269 5003 5099
Micrel, Inc. MIC38150
June 2010 2 M9999-061010-C
Ordering Information
Part Number
Output
Current
Voltage(1)
Junction
Temperature Range
Package
MIC38150HYHL 1.5A ADJ -40°C to +125°C PB-Free 28-Pin 4x6 MLF®
Note: For additional voltage options, contact Micrel.
Pin Configuration
28-Pin 4mm x 6mm MLF® (ML)
(Top View)
Pin Description
Pin Number Pin Name Pin Name
1, 2, 3, 4, 5 SWO Switch (Output): This is the output of the PFM Switcher.
6, 23, 24, 25,
26, 27, 28
SW Switch Node: Attach external resistor from LPF to increase hysteretic
frequency.
7, 22 ePAD Exposed heat-sink pad. Connect externally to PGND.
8 AVIN Analog Supply Voltage: Supply for the analog control circuitry. Requires
bypass capacitor to ground. Nominal bypass capacitor is 1µF.
9 LPF Low Pass Filter: Attach external resistor from SW to increase hysteretic
frequency.
10 AGND Analog Ground.
11 FB Feedback: Input to the error amplifier. Connect to the external resistor
divider network to set the output voltage.
12, 13 LDOOUT LDO Output: Output of voltage regulator. Place capacitor to ground to
bypass the output voltage. Nominal bypass capacitor is 10µF.
14, 15 LDOIN LDO Input: Connect to SW output. Requires a bypass capacitor to ground.
Nominal bypass capacitor is 10µF.
16, 17 PVIN Input Supply Voltage (Input): Requires bypass capacitor to GND. Nominal
bypass capacitor is 10µF.
18 EN Enable (Input): Logic low will shut down the device, reducing the quiescent
current to less than 50µA. This pin can also be used as an under-voltage
lockout function by connecting a resistor divider from EN pin-to-VIN and
GND. It should be not left open.
19, 20, 21 PGND Power Ground.
Micrel, Inc. MIC38150
June 2010 3 M9999-061010-C
Absolute Maximum Ratings(1)
Supply Voltage (VIN) .........................................................6V
Output Switch Voltage (VSW) ...........................................6V
Logic Input Voltage (VEN) ..................................-0.3V to VIN
Power Dissipation .................................. Internally Limited(3)
Storage Temperature (TS)................... -65°C TJ +150°C
Lead Temperature (soldering, 10sec)........................ 260°C
ESD Rating(4) ..............................................................1.5kV
Operating Ratings(2)
Supply voltage (VIN) ...................................... 3.0V to 5.5V
Enable Input Voltage (VEN) ................................. 0V to VIN
Junction Temperature Range .........–40°C TJ +125°C
Package Thermal Resistance
4mm × 6mm MLF-28 (θJA) .............................24°C/W
Electrical Characteristics(5)
TA = 25°C with VIN = VEN = 5V; IOUT = 10mA, VOUT = 1.8V. Bold values indicate –40°C TJ +125°C, unless noted.
Parameter Conditions Min Typ Max Units
Supply Voltage Range 3.0 5.5 V
Under-Voltage Lockout Threshold Turn-on 2.85 V
UVLO Hysteresis 100 mV
Quiescent Current IOUT = 0A, Not switching, Open Loop 1 mA
Turn-on Time VOUT to 95% of nominal 200 500 µs
Shutdown Current VEN = 0V 30 50 µA
Feedback Voltage ±2.5% 0.975 1 1.025 V
Feedback Current 5 nA
Dropout Voltage (VIN – VOUT) ILOAD = 1.5A; VOUT = 3V 0.85 1.2 V
Current Limit VFB = 0.9×VNOM 1.75 3 A
Output Voltage Load Regulation VOUT = 1.8V, 10mA to 1.5A 0.1 1 %
Output Voltage Line Regulation VOUT = 1.8V, VIN from 3.0V to 5.5V 0.35 0.5 %/V
Output Ripple ILOAD = 1.5A, COUTLDO = 20µF, COUTSW = 20µF
LPF=25k
2 mV
Over-Temperature Shutdown 150 °C
Over-Temperature Shutdown Hysteresis 15 °C
Enable Input(6)
Enable Input Threshold Regulator enable 0.90 1 1.1 V
Enable Hysteresis 20 100 200 mV
Enable Input Current 0.03 1 µA
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / JA. Exceeding the maximum allowable power
dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
4. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
5. Specification for packaged product only.
6. Enable pin should not be left open.
Micrel, Inc. MIC38150
June 2010 4 M9999-061010-C
Typical Characteristics
VIN = 3.3V, VOUT = 1.8V, COUT = 10µF, RLPF = 25k, IOUT = 100mA, unless noted
MIC38150 PSRR
0
10
20
30
40
50
60
70
80
90
10 100 1000 10000 100000
FREQUENCY (Hz)
PSRR (dB)
Load Regulation
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
0 0.3 0.6 0.9 1.2 1.5
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
Output Voltage
vs. Input Voltage
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
012345
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Output Voltage
vs. Temperature
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
Thermal Shutdown
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-40 10 60 110 160 210
TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
MIC38150 Efficiency
0
10
20
30
40
50
60
70
80
90
0 0.3 0.6 0.9 1.2 1.5
LOAD CURRENT (A)
EFFICIENCY (%)
Dropout Voltage
vs. Load Current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
00.511.5
LOAD CURRENT (A)
DROPOUT VOLTAGE (V)
Dropout Voltage
vs. Temperature
0.0
0.2
0.4
0.6
0.8
1.0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
DROPOUT VOLTAGE (V)
Current Limit
v s. Input Voltage
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
33.544.555.5
INPUT VOLTAGE (V)
CURRENT LIMIT (A)
Enable Threshold
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
33.544.555.5
INPUT VOLTAGE (V)
ENABLE VOLTAGE (V
)
Operating Current
vs. Input Voltage
0
10
20
30
40
50
60
3 3.5 4 4.5 5 5.5
INPUT VOLTAGE (V)
OPERATING CURRENT (mA)
VIN = 3.3V
VOUT = 1.8V VOUT = 1.8V
IOUT = 10mA
IOUT = 1.5A
VIN = 3.3V
IOUT = 10mA
VIN = 3.3V
VOUT = 1.8V
VIN = 5.0V
VOUT = 3.3V
RLPF = 25k
VOUT = 3.3V
VOUT = 3.3V
IOUT = 1.5A
VOUT= 1.8V
COUT = 20µF
RLPF = 25k
VOUT = 1.8V
VOUT = 1.8V
COUT = 20µF
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Micrel, Inc. MIC38150
June 2010 5 M9999-061010-C
Typical Characteristics
VIN = 3.3V, VOUT = 1.8V, COUT = 10µF, RLPF = 25k, IOUT = 100mA, unless noted
Switch Frequency vs.
RLPF Resistance (3.3V-1.0V)
0
0.5
1
1.5
2
2.5
3
10 100 1000
RLPF (kΩ)
SW FREQUENCY (MHz)
Switch Frequency vs.
RLPF Resistance (3.3V-1.8V)
0
0.5
1
1.5
2
2.5
3
10 100 1000
RLPF (kΩ)
SW FREQUENCY (MHz)
Switch Frequency vs.
RLPF Resistance (5.0V-1.0V)
0
0.5
1
1.5
2
2.5
3
10 100 1000
RLPF (kΩ)
SW FREQUENCY (MHz)
Switch Frequency vs.
RLPF Resistance (5.0V-1.8V)
0
0.5
1
1.5
2
2.5
3
10 100 1000
RLPF (kΩ)
SW FREQUENCY (MHz)
Switch Frequency vs.
RLPF Resistance (5.0V-2.5V)
0
0.5
1
1.5
2
2.5
3
10 100 1000
RLPF (kΩ)
SW FREQUENCY (MHz)
10mA
500mA
1A
1.5A
10mA
500mA
1.5A
1A 10mA
1A
1.5A
500mA
10mA
1A
1.5A
500mA
10mA
500mA
1.5A
1A
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Micrel, Inc. MIC38150
June 2010 6 M9999-061010-C
Functional Characteristics
VIN = 3.3V, VOUT = 1.8V, COUT = 10µF, Inductor = 470nH; RLPF = 25k, IOUT = 100mA, unless noted
OUTPUT VOLTAGE
(50mV/div)
LOAD CURRENT
(1A/div)
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Micrel, Inc. MIC38150
June 2010 7 M9999-061010-C
EMI Performance
VOUT =1.8V, IOUT =1.2A
EMI Test – Horizontal Front
EMI Test – Vertical Front
Additional components to MIC38150 Evaluation Board:
1. Input Ferrite Bead Inductor. Part number: BLM21AG102SN1D
2. 0.1µF and 0.01µF ceramic bypass capacitors on PVIN, SW, SWO, and LDOOUT pins.
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Micrel, Inc. MIC38150
June 2010 8 M9999-061010-C
Block Diagram
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Micrel, Inc. MIC38150
June 2010 9 M9999-061010-C
Application Information
Enable Input
The MIC38150 features a TTL/CMOS compatible
positive logic enable input for on/off control of the device.
High enables the regulator while low disables the
regulator. In shutdown the regulator consumes very little
current (only a few microamperes of leakage). For
simple applications the enable (EN) can be connected to
VIN (IN).
Input Capacitor
PVIN provides power to the MOSFETs for the switch
mode regulator section and the gate drivers. Due to the
high switching speeds, a 10µF capacitor is
recommended close to PVIN and the power ground
(PGND) pin for bypassing.
Analog VIN (AVIN) provides power to the analog supply
circuitry. AVIN and PVIN must be tied together
externally. Careful layout should be considered to
ensure high frequency switching noise caused by PVIN
is reduced before reaching AVIN. A 1µF capacitor as
close to AVIN as possible is recommended.
Output Capacitor
The MIC38150 requires an output capacitor for stable
operation. As a µCap LDO, the MIC38150 can operate
with ceramic output capacitors of 10µF or greater.
Values of greater than 10µF improve transient response
and noise reduction at high frequency. X7R/X5R
dielectric-type ceramic capacitors are recommended
because of their superior temperature performance.
X7R-type capacitors change capacitance by 15% over
their operating temperature range and are the most
stable type of ceramic capacitors. Larger output
capacitances can be achieved by placing tantalum or
aluminum electrolytics in parallel with the ceramic
capacitor. For example, a 100µF electrolytic in parallel
with a 10µF ceramic can provide the transient and high
frequency noise performance of a 100µF ceramic at a
significantly lower cost. Specific undershoot/overshoot
performance will depend on both the values and
ESR/ESL of the capacitors.
For less than 5mV noise performance at higher current
loads, 20µF capacitors are recommended at LDOIN and
LDOOUT.
Low Pass Filter Pin
The MIC38150 features a Low Pass Filter (LPF) pin for
adjusting the switcher frequency. By tuning the
frequency, the user can further improve output ripple.
Adjusting the frequency is accomplished by connecting a
resistor between the LPF and SW pins. A small value
resistor would increase the frequency while a larger
value resistor decreases the frequency. Recommended
RLPF value is 25k.
Adjustable Regulator Design
Adjustable Regulator with Resistors
The adjustable MIC38150 output voltage can be
programmed from 1V to 5.0V using a resistor divider
from output to the FB pin. Resistors can be quite large,
up to 100k because of the very high input impedance
and low bias current of the sense amplifier. For large
value resistors (>50k), R1 should be bypassed by a
small capacitor (CFF = 0.1µF bypass capacitor) to avoid
instability due to phase lag at the ADJ/SNS input.
The output resistor divider values are calculated by:
)1+
R2
R1
(×1V=VOUT
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
100×
I×V
I×V
=(%)Efficiency
ININ
OUTOUT
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply, reducing
the need for heat sinks and thermal design
considerations and it reduces consumption of current for
battery powered applications. Reduced current draw
from a battery increases the devices operating time and
is critical in hand held devices.
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high side switch during the on cycle. Power loss is equal
to the high side MOSFET RDSON multiplied by the Switch
Current2. During the off cycle, the low side N-channel
MOSFET conducts, also dissipating power. Device
operating current also reduces efficiency. The product of
the quiescent (operating) current and the supply voltage
is another DC loss.
Over 100mA, efficiency loss is dominated by MOSFET
RDSON and inductor losses. Higher input supply voltages
will increase the Gate to Source threshold on the internal
MOSFETs, reducing the internal RDDSON. This improves
efficiency by reducing DC losses in the device. As the
inductors are reduced in size, the inductor losses are
mainly caused by the DC resistance (DCR).
The DCR losses can be calculated as follows:
L_PD = IOUT
2 × DCR
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased.
Micrel, Inc. MIC38150
June 2010 10 M9999-061010-C
PCB Layout Guideline
Warning!!! To minimize EMI and output noise, follow
these layout recommendations.
PCB Layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths.
The following guidelines should be followed to insure
proper operation of the MIC38150.
IC
• Place the IC close to the point of load (POL).
• Use fat traces to route the input and output power
lines.
• The exposed pad (ePAD) on the bottom of the IC
must be connected to the PGND pins of the IC.
• Use several vias to connect the ePAD to the ground
plane.
• Signal and power grounds should be kept separate
and connected at only one location.
• Keep the switch node (SW) away from the feedback
(FB) pin.
Input Capacitor
• Place the input capacitor next.
• Place the input capacitors on the same side of the
board and as close to the MIC38150 as possible.
• Keep both the PVIN and PGND connections short.
• Place several vias to the ground plane close to the
input capacitor ground terminal, but not between the
input capacitors and IC pins.
• Use either X7R or X5R dielectric input capacitors.
Do not use Y5V or Z5U type capacitors.
• Do not replace the ceramic input capacitor with any
other type of capacitor. Any type of capacitor can be
placed in parallel with the input capacitor.
• If a Tantalum input capacitor is placed in parallel
with the input capacitor, it must be recommended for
switching regulator applications and the operating
voltage must be derated by 50%.
• In “Hot-Plug” applications, a Tantalum or Electrolytic
bypass capacitor must be used to limit the over-
voltage spike seen on the input supply with power is
suddenly applied.
• The 1µF capacitor, which connects to the AVIN
terminal, must be located right at the IC. The AVIN
terminal is very noise sensitive and placement of the
capacitor is very critical. Connections must be made
with wide trace.
Output Capacitor
• Use a wide trace to connect the VSW output
capacitor ground terminal to the PVIN input
capacitor ground terminal.
• The feedback trace should be separate from the
power trace and connected as close as possible to
the output capacitor.
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Micrel, Inc. MIC38150
June 2010 11 M9999-061010-C
Evaluation Board Schematics
Bill of Materials
Item Part Number Manufacturer Description Qty
0805ZD106MAT2A AVX(1)
LMK212BJ106KG-T Taiyo Yuden(2)
C2012X5R1A106K TDK(3)
C1, C3, C4, C5, C6
GRM219R61A106KE44D Murata(4)
10uF, 10V, X5R, 0805 Ceramic Capacitor 5
C2012X5R1A105K TDK(3)
0805ZD105KAT2A AVX(1)
C2
GRM219R61A105MA01D Murata(4)
1uF, 10V, X5R, 0805 Ceramic Capacitor 1
R1 CRCW06038061FRT1 Vishay(5) 8.06k, 1%, 1/10W, 0603 1
R2, R4 CRCW06031002KEYE3 Vishay(5) 10k, 1%, 1/10W, 0603 2
R3 CRCW06032492FRT1 Vishay(5) 24.9k, 1%, 1/10W, 0603 1
U1 MIC38150-HYHL Micrel, Inc.(6) HELDO® 1.5A High Efficiency Low Dropout
Regulator 1
Notes:
1. AVX: www.avx.com
2. Taiyo Yuden: www.t-yuden.com
3. TDK: www.tdk.com
4. Murata: www.murata.com
5. Vishay: www.vishay.com
6. Micrel, Inc.: www.micrel.com
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Micrel, Inc. MIC38150
June 2010 12 M9999-061010-C
PCB Layout
Top Layer
Mid Layer 1
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Micrel, Inc. MIC38150
June 2010 13 M9999-061010-C
Mid Layer 2
Bottom Layer
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Micrel, Inc. MIC38150
June 2010 14 M9999-061010-C
Package Information
28-Pin 4mm x 6mm MLF® (ML)
LP # HMLF4GT-28LD-LP-1 All units are In mm Tolerance 2 0.05 If not noted 0.50 0 ‘2 3.38 DQDDEIMJDDML fig ‘g‘O O E 3.0 o a EDHDUJDJDDDU: Red cutle Indicates Thomal Via, Sue should be 300- 350 mm m dnmcler and I! should be connected to GND plane for maximum thermal perfomnnce. anl
Micrel, Inc. MIC38150
June 2010 15 M9999-061010-C
Recommended Landing Pattern
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 US
A
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use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
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t
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