Vishay Dale Thin Film 的 THJP 规格书

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THJP
www.vishay.com Vishay Dale Thin Film
Revision: 18-Mar-2021 1Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ThermaWickTM Thermal Jumper Surface Mount Chip
LINKS TO ADDITIONAL RESOURCES
THJP surface mount chips are designed to provide an
electrically isolated thermal conductive pathway to a ground
plane or heat sink while maintaining the electrical isolation of
the device. The devices are constructed with aluminum
nitride substrates in both SnPb and Pb-free wraparound
termination styles. The low capacitance of the device makes
them an excellent choice for high frequency and thermal
ladder applications. Custom sizes available.
CONSTRUCTION
FEATURES
• Electrically isolated thermal conductor
• High thermal conductivity AlN substrate
(170 W/mK)
• Electrically isolated terminations (> 999 MΩ)
•Low capacitance
• Available with SnPb or lead (Pb)-free wrap
terminations
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Power supplies and converters
• RF amplifiers
•Synthesizers
• Switch mode power supplies
• Pin and laser diodes
•Filters
FUNCTIONAL APPLICATIONS /
CONNECTION OPTIONS
• Component to heat sink
•Component to case
• Component to ground plane
•Pad to pad
• Pad to via
•Pad to trace
HEAT TRANSFER DEMONSTRATION
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices
were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause
the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper
connecting the device to the heat sink.
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction
Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) Ceramic Chip Resistor With Thermal Jumper (95.5 °C)
3
3
3
D
D
D
3
D
3D Models
Infographics
Solder coating
Nickel termination
Aluminum nitride
substrate
Available
Available
Available
Thermal jumper location
VISHAY. Imnmm@wshay Com www.v\shay.CUm/doc?91000
THJP
www.vishay.com Vishay Dale Thin Film
Revision: 18-Mar-2021 2Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
•
where k is the thermal conductivity of AIN, 170 W/mK
DIMENSIONS in inches
CASE SIZE L W T D
0603 0.061 ± 0.005 0.033 ± 0.005 0.030 ± 0.005 0.015 ± 0.005
0612 0.063 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.015 ± 0.005
0805 0.079 ± 0.005 0.047 ± 0.005 0.030 ± 0.005 0.020 ± 0.005
1206 0.126 ± 0.005 0.063 ± 0.005 0.030 ± 0.005 0.020 ± 0.005
1225 0.126 ± 0.005 0.252 ± 0.005 0.030 ± 0.005 0.020 ± 0.005
2512 0.252 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.020 ± 0.005
TYPICAL CHARACTERISTICS
CASE SIZE 0603 0612 0805 1206 1225 2512
Thermal resistance (°C/W), TR1441315415
Thermal conductance (mW/°C), TC70 259 77 65 259 65
Capacitance (pF) 0.07 0.26 0.15 0.07 0.26 0.07
Dielectric withstanding voltage kVAC, RMS (60 Hz) > 1.5 > 1.5 > 1.5 > 1.5 > 1.5 > 1.5
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS
Operating temperature range -65 °C to +150 °C
Storage temperature range -65 °C to +150 °C
STANDARD MATERIAL SPECIFICATIONS
Substrate material Aluminum nitride (170 W/mK)
Termination (tin / lead) Electroplate tin / lead over electroplate nickel
Termination (lead (Pb)-free) Electroplate tin (e3) over electroplate nickel
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements)
ENVIRONMENTAL TEST CONDITIONS LIMITS TYPICAL VISHAY
PERFORMANCE
Solderability Visual J-STD-002, method B and B1 95 % Acceptable
Solder mounting integrity Visual MIL-PRF-55342, method par. 4.8.13.1 Pass / fail Pass
Board flex Visual AEC-Q200, method 005 Pass / fail Pass
W
T
D
D
L
TR
L
k T W•()
-------------------------
=
TC
1
TR
------
=
thwnmm®wshay com www.v\shay,com/doc?91000
THJP
www.vishay.com Vishay Dale Thin Film
Revision: 18-Mar-2021 3Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: THJP1206AST1
GLOBAL MODEL CASE SIZE THICKNESS TERMINATION PACKAGING
THJP 0603
0805
0612
1206
1225
2512
A = 0.030" B = wraparound Sn/Pb solder
with nickel termination
S = wraparound Sn (e3) solder
with nickel termination
RoHS compliant
BS = BULK 100 min., 1 mult.
TAPE AND REEL
T0 = 100 min., 100 mult.
T1 = 1000 min., 1000 mult.
T3 = 300 min., 300 mult.
T5 = 500 min., 500 mult.
TF = full reel
TS = 100 min., 1 mult.
TI = 100 min., 1 mult.
(item single lot date code)
TP = 100 min., 1 mult.
(package unit single lot date code)
06AS 1T1PTH 2J
— VISHAY. V
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Revision: 09-Jul-2021 1Document Number: 91000
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