Panasonic Electronic Components 的 AN48810B 规格书

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Hall ICs

Publication date: November 2002 SPC00016AEB

AN48810B

Low current consumption, high sensitivity CMOS Hall IC

One-way magnetic field operation

■Overview

The AN48810B is a Hall IC (a magnetic sensor) which

has 2 times or more sensitivity and a low current consump-

tion of about one three-hundredth compared with our

conventional one.

In this Hall IC, a Hall element, a offset cancel circuit,

an amplifier circuit, a sample and hold circuit, a Schmidt

circuit, and output stage FET are integrated on a single

chip housed in a small package by IC technique.

■Features

•High sensitivity (6 mT max.) due to offset cancel circuit

and a new sample and hold circuit

•Small current by using intermittent action

•Small package (SMD)

•CMOS inverter output

■Applications

•Flip type cellular phone, digital video camera

■Block Diagram

Unit: mm

SMINI-5DA (Lead-free package)

0.225

2.10

±0.10

1.65

±0.10

1.30

±0.10

Seating plane

0.80

±0.10

0 to 0.10

0.32

±0.10

2.00

±0.10

0.22

+0.10

0.05

0.11

+0.10

0.05

0.65 0.65

0.13

0.10

On/Off controlCLK

VCC N.C.

GND

1Out

N.C.

Sample

and

hold

Hall

element

Amplifier

Switch

■Pin Descriptions

Note) The magnetism detection time should be longer than one intermittent action cycle (On = 200 µs and Off = 51 ms).

Pin No. Symbol Description

4 N.C.

CC Power supply

Pin No. Symbol Description

1 Out Output

2 GND Ground

3 N.C.

Maintenance/

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AN48810B

2SPC00016AEB

■Recommended Operating Range

Parameter Symbol Range Unit

Supply voltage VCC 2.5 to 3.5 V

■Absolute Maximum Ratings

Parameter Symbol Rating Unit

Supply voltage VCC 5V

VOUT 5V

Output current IO15 mA

Power dissipation PD60 mW

Operating ambient temperature Topr −20 to +75 °C

Storage temperature Tstg −55 to +125 °C

Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.

2. The reverse insertion of this IC will cause its breakdown.

3. It will operate normally in several tens of ms after power on.

4. This IC is not suitable for car electrical equipment.

Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low.

2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high.

3. ICCON is a consumption current when the magnetism detection system is on, and ICCOFF is that when the magnetism detection

system is off. One magnetism detection cycle is On = 200 µs and Off = 51 ms. ICCAVE is an average consumption current.

■Electrical Characteristics at Ta = 25°C

Parameter Symbol Conditions Min Typ Max Unit

Operating magnetic flux density 1 BH-L VCC = 3 V  6mT

Operating magnetic flux density 2 BL-H VCC = 3 V 0.5 mT

Hysteresis width BW VCC = 3 V 1.2 mT

Output voltage 1 VOL VCC = 3 V, IO = 2 mA, B = 6 mT 0.1 0.3 V

Output voltage 2 VOH VCC = 3 V, IO = −2 mA, B = 0.5 mT 2.7 2.9 V

Supply current 1 ICCON VCC = 3 V, B = 0.5 mT 2mA

Supply current 2 ICCOFF VCC = 3 V, B = 0.5 mT 3µA

Supply current 3 ICCAVE VCC = 3 V, B = 0.5 mT 10 15 µA

■Technical Data

•Position of a Hall element (unit in mm)

Distance from a package surface to sensor part: 0.31 mm (reference value)

A Hall element is placed on the shaded part in the figure.

0.31

1.0

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AN48810B

SPC00016AEB

■Technical Data (continued)

•Magneto-electro conversion characteristics

H-L

L-H

Output voltage

Direction of applied magnetic field Operating magnetic flux density

Applied magnetic flux density B

•Simple polarity distinction method of mounting magnet to product incorporating Hall IC

A magnet, which is used in pair with a Hall IC, can be mounted to a product incorporating a built-in Hall IC (e.g.,

a cellular phone) smoothly and correctly with a simple tool. The polarity of the magnet (hereafter referred to as Hall

IC magnet) will be automatically discriminated.

This tool is a plastic bar, one end of which is attached with a small magnet (hereafter referred to as plastic bar

magnet), as shown in the above illustration. The plastic bar magnet, the polarity of which is known, is secured on the

bar with a plastic cover. When the plastic bar magnet is located close to the Hall IC magnet, the Hall IC magnet will

be attracted to the plastic bar magnet. The contact side of the Hall IC magnet is different in polarity from that of the

plastic bar magnet. As a matter of course, the polarity of the Hall IC magnet will be known then. The Hall IC magnet

can be mounted to the appliance in this state. The attraction force of the plastic bar magnet is rather weak due to the

plastic cover on it. Therefore, the plastic bar can be separated from the Hall IC magnet with ease after the Hall IC

magnet is mounted properly.

Plastic coverPlastic bar Magnet for Hall IC

Magnet

•Main characterisitcs

Operating magnetic flux density  Supply voltage Operating magnetic flux density  Ambient temperature

0.5

1.0

1.5

2.0

2342.5 3.5 4.5 5

Supply voltage V

(V)

Operating magnetic flux density B (mT)

Ta = 25°C

Sample 1 BW

Sample 2 BW

Sample 3 BW

−25 0 25 50 75

Ambient temperature T

(°C)

Operating magnetic flux density B (mT)

= 3.0 V

Sample 1 B

H-L

Sample 2 B

H-L

Sample 3 B

H-L

Sample 3 B

L-H

Sample 1 B

L-H

Sample 2 B

L-H

Maintenance/

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Maintenance/Discontinued includes following four Product lifecycle stage.

planed maintenance type

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AN48810B

4SPC00016AEB

■Technical Data (continueed)

•Main characterisitcs

Operating magnetic flux density  Supply voltage Average consumption current  Supply voltage

Low-level output voltage  Supply voltage Low-level output voltage  Ambient temperature

∆ high-level output voltage  Supply voltage ∆ high-level output voltage  Ambient temperature

−50

Ambient temperature T

(°C)

= 3.0 V

125−25 0 25 50 75 100

0.00

0.07

Low-level output voltage V

(V)

0.01

0.02

0.03

0.04

0.05

0.06

0.00

0.14

Supply voltage V

(V)

∆ hgh-level output voltage ∆V

(V)

= −2 mA

0.02

0.04

0.06

0.08

0.10

0.12

125°C

−25°C

−50°C

241356

75°C

25°C

0.00

0.07

Supply voltage V

(V)

Low-level output voltage V

(V)

= 2 mA

0.01

0.02

0.03

0.04

0.05

0.06

241356

75°C

25°C

125°C

−25°C

−50°C

0.00

0.14

−50

Ambient temperature T

(°C)

∆ hgh-level output voltage ∆V

(V)

= 3.0 V

0.02

0.04

0.06

0.08

0.10

0.12

125

−25 0 25 50 75 100

Supply voltage VCC (V)

Average consumption current ICCAVE (µA)

241356

−50°C

125°C

25°C

Output = High

2342.5 3.5 4.5 5

= 25°C

Sample 2 B

H-L

Sample 2 B

L-H

Sample 1 B

H-L

Sample 1 B

L-H

Sample 3 B

H-L

Sample 3 B

L-H

Supply voltage V

(V)

Operating magnetic flux density B (mT)

Maintenance/

Discontinued

Maintenance/Discontinued includes following four Product lifecycle stage.

planed maintenance type

maintenance type

planed discontinued typed

discontinued type

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Panasonlc Sun‘le kinds ot adhesive generute conuslve gas tsuch us chlmlc gas) during Curing. T se a l‘uueuuuul del‘eet ot‘diseuuue It l-lull 1c is to he sehled utter iustullutiou. attention should be given to the udhesiv and substrate cleaner. as well as us the udhesive used to. l-lull 1c rnstallution. Pleuse cun dheslve, fur we ﬁnd it difﬁcult lu guarantee lhe Power supply line/Powerlransmission line It a power supply line/power transru . sion llne becomes longei. noise uud/or osc cllur ot n,l llF to l() llF near the Hall IC tu prevent it. 1le voltuge of [R v or more is thought to he applied lo the puwer supply 1!" pulse. em). avoid it wuh extetuul compuueuts (capacilur. resistut. Zenel dtod of lhe surlace mount type package (MlNl-GDR) When mounted Lm the printed circnll board. the Hall IC may be highly the suldeung. This may also Cause u chunge in the opeluung magnetic ﬂux d mslure Wrong Correcl 4. vCC and GND Do not reverse v“. and GND, If the vCC and GND pins ure reterselv cunnecled, this IC will be destruyed IC GND-pin voltage is set higher than other pin vultuge. the IC cont biased diode. Theietore. it WI" uuu on at the diude totwtud voltuge (upptoximutely 0 d a lurge cullenl flow lhmugh lhe 1C, ending up in ils deslruclkln. (This is Common to mmmlilhlc IC.) 5. Caulions on power-on of Hall lC When u Hull 1c is lumed on. the pusllmn ot‘ the tnugnet or looseuess may chtutge the output 0le Hull 1c. un may he generuted. Thelefore, care should be given whenever the output stute ul‘a Hull IC is ctiticul when lll'ulkm w me as a ll: power is on. 6. On fixing a Hall IC lo holder When 1: Hull IC is muunled un the pl lnted circuit huzlrd with ll hulder and Ihe coefﬁcient of e is large. the lead wire ot the Hall 1c wll d uud u may give v u s to the Hull {C It the lead wile .~ stressed intensely due to the drsturtion uf holder or hourd, the adhes the leud wire may he weakened u iug III the deterroruuo Sensitivity tnuy ulsu he ch 9 flux in solde e u ﬂux wh tents trotn hulogen gr s of halo the lead flame and 1) surface ot an IC chip el is loo 5

AN48810B

SPC00016AEB

■Caution on Use of Hall ICs

The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by

exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix

the package with adhesives or fix it on a dedicated case.

1. A case using an adhesive

Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the

aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.

If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals

and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those

manufacturers before using.

We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.

2. Power supply line/Power transmission line

If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.

In this case, set the capacitor of 0.1 µF to 10 µF near the Hall IC to prevent it.

If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition

pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).

3. On mounting of the surface mount type package (MINI-3DR)

When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from

the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance

to moisture.

4. VCC and GND

Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the

IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward

biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will

flow through the IC, ending up in its destruction. (This is common to monolithic IC.)

5. Cautions on power-on of Hall IC

When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse

may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply

power is on.

6. On fixing a Hall IC to holder

When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder

is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.

If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and

the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.

Sensitivity may also be changed by this stress.

7. On using flux in soldering

Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The

ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the

disconnection of the aluminum wiring on the surface of an IC chip.

8. In case of the magnetic field of a magnet is too strong

Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux

density should be used within the range of 100 mT.

9. On surface treatment of mini-mold package

Surface treatment is available in either smooth or dull finish.

10. On soldering of the surface mount type package

Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at

mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering

abiding by its recommended conditions.

CorrectWrong

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planed maintenance type

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semiconductors described in this book

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Consult our sales staff in advance for information on the following applications:

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Maintenance/

Discontinued

Maintenance/Discontinued includes following four Product lifecycle stage.

planed maintenance type

maintenance type

planed discontinued typed

discontinued type

Please visit following URL about latest information.

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