Vishay Semiconductor Opto Division 的 TSSP950xx 规格书

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TSSP950..
www.vishay.com Vishay Semiconductors
Rev. 1.3, 29-Mar-2021 1Document Number: 82867
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IR Sensor Module for Reflective Sensor, Light Barrier,
and Fast Proximity Applications
LINKS TO ADDITIONAL RESOURCES
DESCRIPTION
The TSSP950.. series are compact infrared detector
modules for presence, proximity, or light curtain
applications. They provide an active low output in response
to infrared bursts at 940 nm. The frequency of the burst
should correspond to the carrier frequency shown in the
parts table.
This component has not been qualified according to
automotive specifications.
FEATURES
• Up to 2 m for presence and proximity sensing
• Uses continuous AC signal or burst pattern of
infrared light
• PIN diode and sensor IC in one package
• Low supply current
• Shielding against EMI
• Visible light is suppressed by IR filter
• Insensitive to supply voltage ripple and noise
• Supply voltage: 2.0 V to 3.6 V
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
MECHANICAL DATA
Pinning:
1, 4 = GND, 2 = VS, 3 = OUT
ORDERING CODE
Taping:
TSSP950..TT - top view taped, 2200 pcs/reel
TSSP950..TR - side view taped, 2300 pcs/reel
APPLICATIONS
• Reflective sensors for hand dryers, towel or soap
dispensers, water faucets, toilet flush
• Vending machine fall detection
• Security and pet gates
• Person or object vicinity activation
• Fast proximity sensors for toys, robotics, drones, and
other consumer and industrial uses
BLOCK DIAGRAM PRESENCE SENSING
1
2
3
4
20953
1
2
3
4
209
5
3
Product Page
3
3
3
D
D
D
Marking
33 kΩ
Demo-
pass
AMPInput
PIN
Band
dulator
16833_17
3
1, 4
2
GND
VS
OUT
+3 V
IR emitter
+3 V
38 kHz
Envelope
signal
Out to
μC
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TSSP950..
www.vishay.com Vishay Semiconductors
Rev. 1.3, 29-Mar-2021 2Document Number: 82867
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
PARTS TABLE
Carrier frequency 38 kHz TSSP95038
56 kHz TSSP95056
Package Heimdall
Pinning 1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm) 6.8 W x 3.0 H x 3.2 D
Mounting SMD
Special options
• Extended temperature range: www.vishay.com/doc?82738
• Narrow optical filter: www.vishay.com/doc?81590
• Wide optical flter: www.vishay.com/doc?82726
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +3.6 V
Supply current IS5mA
Output voltage VO-0.3 to +3.6 V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb ≤ 85 °C Ptot 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS2.0 - 3.6 V
Supply current VS = 5 V, Ev = 0 ISD 0.25 0.37 0.45 mA
Ev = 40 klx, sunlight ISH -0.8-mA
Transmission distance
Ev = 0,
IR diode TSAL6200,
IF = 50 mA,
test signal see Fig. 1
d-8-m
Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see Fig. 1 VOSL - - 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min. -0.71.2mW/m
2
Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1 Ee max. 30 - - W/m2
Directivity Angle of half
transmission distance ϕ1/2 -± 50- °
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Rev. 1.3, 29-Mar-2021 3Document Number: 82867
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 3 - Output Function
Fig. 4 - Output Pulse Diagram
Fig. 5 - Frequency Dependence of Responsivity
Fig. 6 - Sensitivity vs. Ambient Temperature
16110
E
e
T
t
pi
*
t
* t
pi
10/f
0
is recommended for optimal function
V
O
V
OH
V
OL
t
Optical Test Signal
(IR diode TSAL6200, I
F
= 0.4 A, 30 pulses, f = f
0
, t = 10 ms)
Output Signal
t
d
1)
t
po 2)
1)
7/f
0
< t
d
< 15/f
0
2)
t
pi
- 5/f
0
< t
po
< t
pi
+ 6/f
0
10
100
1000
10000
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.1 10 1000 100 000
Axis Title
1st line
2nd line
2nd line
tpo - Output Pulse Width (ms)
Ee- Irradiance (mW/m2)
Output pulse width
Input burst length
λ= 950 nm,
optical test signal, Fig. 1
E
e
t
V
O
V
OH
V
OL
t
600 µs 600 µs
t = 60 ms
t
on
t
off
94 8134
Optical Test Signal
Output Signal, (see Fig. 4)
10
100
1000
10000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1 1 10 100 1000 10 000
Axis Title
1st line
2nd line
2nd line
ton, toff - Output Pulse Width (ms)
Ee- Irradiance (mW/m2)
ton
toff
λ= 950nm,
optical test signal, Fig. 3
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.7 0.9 1.1 1.3
f/f
0
- Relative Frequency
16925
f = f
0
± 5 %
Δf(3 dB) = f
0
/10
E
e min.
/E
e
- Relative Responsivity
10
100
1000
10000
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-30 -10 10 30 50 70 90
Axis Title
1st line
2nd line
2nd line
Ee min. - Threshold Irradiance (mW/m2)
Tamb - Ambient Temperature (°C)
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Rev. 1.3, 29-Mar-2021 4Document Number: 82867
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Fig. 7 - Relative Spectral Sensitivity vs. Wavelength
Fig. 8 - Horizontal Directivity
Fig. 9 - Vertical Directivity
Fig. 10 - Sensitivity vs. Supply Voltage
The typical application of these devices is a reflective or
beam break sensor with active low “detect” or “no detect”
information contained in its output. The TSSP950.. is also
suitable for fast (~ 15 ms) proximity sensor applications for
ranges between 10 cm and 2 m, if a burst pattern with
variable intensity is used.
Example for a sensor hardware:
There should be no common window in front of the emitter
and detector in order to avoid crosstalk via guided light
through the window.
10
100
1000
10000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 850 950 1050 1150
Axis Title
1st line
2nd line
2nd line
S(λ)rel. - Relative Spectral Sensitivity
λ - Wavelength (nm)
21425
21427
Axis Title
2nd line
2nd line
2nd line
Horizontal
drel. - Relative Transmission Distance
1.0
0.9
0.7
0.8
30°
50°
40°
80°
0.6 0.4 0.200.40.2 0.6
20°10°0°
60°
70°
21428
Axis Title
2nd line
2nd line
2nd line
Vertical
drel. - Relative Transmission Distance
1.0
0.9
0.7
0.8
30°
50°
40°
80°
0.6 0.4 0.200.40.2 0.6
20°10°0°
60°
70°
10
100
1000
10000
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1.01.52.02.53.03.54.0
Axis Title
1st line
2nd line
2nd line
Ee min. - Threshold Irradiance (mW/m2)
VS- Supply Voltage (V)
Emitter
TSAL6200
IR Receiver
TSSP6P38
Separation to avoid
crosstalk by stray light inside
the housing
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Rev. 1.3, 29-Mar-2021 5Document Number: 82867
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PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
6.6 ± 0.1
3.2
1.27
3 x 1.27 = 3.81
(4 x)
2.2
(1)
1.2 ± 0.2
(2.2)
2.2
(3.4)
(R1.3)
2.5
0.5 ± 0.1
0.8
(1.8)
3
Pick and place area
Proposed pad layout
from component side
(for reference only)
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.15
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
Marking area
Tool separation line
(0.635)
(1.65)
0.8
1.8
1.27
3 x 1.27 = 3.81
(3 x)
Mold residue
Mold residue
6.8
22608
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TSSP950..
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Rev. 1.3, 29-Mar-2021 6Document Number: 82867
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
TAPING VERSION TSSP..TR DIMENSIONS in millimeters
max. 120 s max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0 300
Axis Title
2nd line
Temperature (°C)
Time (s)
25020015010050
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
2
1.75
7.5
16
8
4
3.6
0.3
Ø 1.5 min.
Ø 1.5
Direction of feed
1.34 ref.
technical drawings
according to DIN
specifications
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Rev. 1.3, 29-Mar-2021 7Document Number: 82867
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TAPING VERSION TSSP..TT DIMENSIONS in millimeters
0.3
3.65
16
7.51.75
Ø 1.5
Ø 1.5
2
8
4
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
technical drawings
according to DIN
specifications
Direction of feed
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TSSP950..
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Rev. 1.3, 29-Mar-2021 8Document Number: 82867
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REEL DIMENSIONS in millimeters
LEADER AND TRAILER DIMENSIONS in millimeters
COVER TAPE REEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
300 ± 10 mm/min.
165° to 180° peel angle
16734
Trailer Leader
no devices
min.
200
min. 400
StartEnd
devices
96 11818
no devices
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Rev. 1.3, 29-Mar-2021 9Document Number: 82867
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OUTER PACKAGING
The sealed reel is packed into a pizza box.
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final
packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to
warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
CARTON BOX DIMENSIONS in millimeters
THICKNESS WIDTH LENGTH
Pizza box (SMD and heimdall)
(taping in reels) 50 340 340
VISHAY SEMICONDUCTORS GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17
Thickness
Width
22127
Length
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Rev. 1.3, 29-Mar-2021 10 Document Number: 82867
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DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD BAR
CODE LABELS (example)
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Aluminum bag
Label
Reel
15973
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
4
LEVEL
22522
22178
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