Knowles 的 SPH6611LR5H-1 规格书
F m Pam :n .v
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RF (:‘ded
Bo'mm 70H
JH’IJ Smbk: Pa’fx’rn‘nnca
Om'u mm
SH“ ‘(1 '(J SVD Rd ()W H g}
Low stmmov‘f Hugh ADP
r gr mm: (3
Sim”! ,Lm‘ Muh I}
hm
x2 1:} ma 5
Held: 5
FOTJII‘C 0 0(3ij w“
(TUthzmwz
Vdd to Ground 413, +5 0 V pm: Corrmiers
OUT «3 Ground 703, Vda+o,5 v TW “‘5
W: :‘(t MU . DMUS
Input Current :5 mA
Storage Temperamre \ndefinne m Ground orVdd ”C
Operalmg Temperature 740 m +100 ”C
em dm 1
n w
am 1d>
SPH6611LR5H-1
MCILRATH-Y
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
ABSOLUTE MAXIMUM RATINGS
Parameter
Absolute Maximum Rating
Units
MEMS
Transducer
Buffer
Charge
Pump
Vdd
OUT
GND
Regulator
PRODUCT FEATURES
TYPICAL APPLICATIONS
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mil / (‘7‘ 'l .i \‘r: ,i r ’1 "l'l :
Test Conditions 23 we 55am R H , vdd=1 av, no load, unless omerWlse indicated
Supply Vollaga Vdd 1‘5 - 3,6 v
Vdd=1.8V , 145 135
Supply Current Idd pA
Sensitivity s 94 dB SPL @ 1kHz 739 739 737 dBV/Pa
Signal to Noise Ralio SNR 94 dB SPL @ 1kHz, A-weigtiled - 65 - dBV/Pa
Near-Ultrasonic SNR 94 dB SPL, @ 19 kHz , BW =1a,5 - zoro kHz - 79 - as
94 dB SPL @ 1 kHz - 02 05 a
Tolal Hairnoriic Distortion THD 115 dB SPL @ 1 kHz , 2.0 , A
1%THD@ 1 kHz, s=lyp , 105 , dB SPL
Acoualio Overload Poinl AOP 10% THD @ 1 kHz, 5 = lyp , 124 , dB SPL
Low Frequency Rolloir LFRO -3dE relative lo 1 kHz - 9n - Hz
ngh Frequency Flalness was ialatiye lo 1 kHz - 12 - kHz
Resonant Frequency Peak Frss - 25 - kHz
Power Supply Rejection Ratio PSRR 209 mVpp sine wave @ 1 kHz, SinglerEnded Moue , sa , dB
PM” SUW'Y Rajec‘i“ PSRW gDZEVl-figvgff‘lweA-weigmed, Single-Ended W—
DC Output Vdd = 1.9 v
culput Impedance Zout @ 1 kHz
Cload
culpul Load
Rload AC£oupled
Sensitivity Drop Vdd(min) s Vdd s Vdd(max)
Dlrectrwty /
Polarity Increasing sound pressure /
Startup Time s wilhin 1 as of final value, outputs AC cflpled
‘Sensitiyity and Supply Current are 190% rested
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
ACOUSTIC & ELECTRICAL SPECIFICATIONS1
Parameter
Symbol
Conditions
Min
Typ
Max
Units
‘( knowles
mum ’wm Apr'hratm” 01mm
NC’ES
Eli/Pass capamtors shou‘d be ahead next to each Vdd pm for best performance
6000011015 near the mlcvophone shomd not comm c1055 2 d1eleclv1cs due to mew puezoe1ecmc effect
FoHow me codec manufacluvers rewmmendauons for cwcumy and layout
Tesx Cond1t1ons 23 we, 55mm R H , v0 , av, no 1000, unless omerwse 1nd1cated
F1gum 2 100091 :u r, 01011119910011” *0 Phase Responsv
12 100
g 9 135
g 6 90
a
S 3 45 E
g 0 0 3
7.‘ E
-. -x 45 a
a:
a .5 -90
2
= -9 435
E
,g -12 400
10 100 1.000 10.000
Frequency (Hz)
ngve d Typwa‘ Group Dem
1
A 0.1
{’L
i‘ 0.01
i
n
0001
0.0001
0.00001
0000001
10 100 1.000 10.000
Frequencyfl'll)
020
3 3mm
F1gum A Tywca‘ THD 0r. CPL
Ia
THD (5‘)
0.1
90 95 100 105 110
SPL (dB)
115
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HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
PERFORMANCE CURVES
Vdd
GND
Analog Mic
Interface
CODEC OR
APPLICATION PROCESSOR
Vdd
+
-
MIC
OUT
GND
Vdd
Rout
Vdd
‘( knowles
Fxguve 6 Typma‘ FH—e Fwd U‘trason a '{espnnst— nguve a Nome floor F‘ome' SpenKra‘ De
20
g 15
E
a lo
3 5
E
3 o
u
a:
z. -s
2
z -w
5
u. 45
0 20 40 50 50 10 Ian LEGO 10,000
Frequency (kHz) quuanzy (Hz)
ngm 7 Tywcn‘ \dd vs ‘Jdd ngm .9 Typma‘ psrw
200 so
150 35
160
an
140
A A 75
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HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
‘( knowles
- IX 1675 —
( 3.094 ] 2x151;
'ET
[ 0.292 )—| l— "A?”
"H. , 4x 0.725 2x 0.950
7 .1023; <9 «w="" 7="" 2x="" 0.300="" '®="" @i="" v="" .10="" —="" $1.025="" —="" (251.525="" length="" (l)="" 3.50="" 20.10="" 1="" out="" signal="" ompm="" swgnal="" wmm="" (w)="" 2.65="" 20.10="" 2,="" 3="" ground="" power="" gmund="" .="" toe:="" pin="" he'g'“="" (h)="" ”'95="" ’0'")="" 4="" (knowles="" n/a="" connecl="" to="" ground="" acnuslic="" port="" (ap)="" 00.325="" 20.05="" 'mema'="" “59)="" _0="" 05="" 5="" v00="" power="" power="" supply="" pcb="" thickness="" (i)="" 0.292="" +0="" 05'="" h="" 1.675="" 2x="" 1.675="" l="" i="" l="" i“="" ”25="" 4x="" 0.725="" le="" ax="" 0.475="" v="" r="" _l="" ‘="" ‘="" um="" %="" %="" @1521="" w="" k\="" fl="" 1.513="" 1—-="" 1.525="" 1.513="" v="">9><23 1.025="" \(="" it'-="" chk="" area="" cn‘y="" extends="" to="" o="" 25="" mm="" of="" any="" edge="" or="" he‘s="" un‘="" s="" othervns="" decme="" dwmenswons="" ave="" m="" rmlhmexers="" uness="" omerwlse="" specmed="" know‘e="" m="" \da="" eet="" s="" lrsr-h="" rev="" b="" 0:20="" know‘es="" ecuomc="" lc="" ha="" l="" usa="" his="" reserved="" swsomc="" k="" w‘esandl="" \ogoar="" adema="" fknow‘="" uomcs,llc="" 4x="" 0.522="" k="">23>
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
MECHANICAL SPECIFICATIONS
Pin #
Pin Name
Type
Description
Example Land Pattern Example Solder Stencil Pattern
Item
Dimension
Tolerance
‘( knowles
To‘evanoe \s :0 15mm un‘ess otherwwse specmed
\n [he acousnc pam, TED me recommended PCB Ho‘e Demeter \s o e s D 5 ‘ Dmm, TBD [he recommended Gaskel cawy Dwameler \s D 210mm and TBD (he
recommended Case Ho‘e Dlameter ‘51 o s D s15mm Further optlmwzatwons based on apphcatlon should be performed
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
‘( knowles
8 00:0 10 1 1 2010 10
1.751010 2.002005 ‘ ‘
‘1 *1 i 0.3011005
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5.502005 0 U
110:0.3 l ' fia=fl
5:41 £9:\
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23520.10 —— — I SECYION M
7 3.30:0.10 A 4
SPH6611LR5H71 73 13' 5900 Reel 105 . 10‘
Carrier Tape 105 . 10*
Cover Tape 10‘ 710‘"
A1pna characterA
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‘12345678'
Umqve Job 1
D1men5lons ave In rnI11IrneIeIs unless oIneIWIse specmed
Vacuum mckup onIy In Ine wok area IndIcaIea In MecnanIcaI SpeoIvIcaIIons
Tape BK 1221 Der EVAJ‘EI
LabeIs appIIed dwecfiy to IeeI and exIeInEI package
snev 1I1e Twe1ve (12) rnonxns when devlces are smred In Ine facIorvrsu pphed, unopened
3010. 70% R H
IronmenIaI condmons 0f
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
PACKAGING & MARKING DETAIL
Model Number
Suffix
Reel Diameter
Quantity Per
Reel
Component
Surface Resistance (ohms)
‘( knowles
25"C
Trma zsnc to Peak 4»?
Average Ramprup rate (TW (0 Ta)
CFC/second max.
n O
Preheat
. Temperature Min (T sum)
- Temperature Max ([st
. Trme (TsMIN to T sm) (ls)
150°C
ZOD’C
60-180 seconds
Based on \PC/JEDEC 175m 020 Revrsran c
AH temperatures refer to topsrde of the package.
measured on the package body surtace
Time mainhamed above:
The actual veflow prams used shou‘d be Optlmtzed based
on the veflow requuements of aH components, board
- Témpsramre (TL) 217'0 desrgn, solder paste tormularran and veflo
- Tlme (It) 50459 5960"“ used Detarts of recommended and
manufactunng processe found In AN25 SMT
Peak Temperature (Ta) 260°C Manutaetunng our s tor srsanrcw Mrcrecnenes
Trme within 5-0 at actual Peak Temperature (ta) 2040 seconds
Ramprdown rate (1r to Team)
B‘Clsecond max
Trme 25°C In Peak Temperature
B minules max
mm
(At MSL (morsture sensrtwttv \eve‘) mass!
(5) Maxtmum ct 3 veflow cyctes rs recommended
(c) tn order to rnrnrrnrze device damage
- Do not heard wash er ctean arter the veflcw process
Do not rnsert any object m port hate of device at any trrne
Do not every over 30 rest at arr pressure Into the pan hete
Do not pull a vacuum over port hate of the rmerophone
Do not crush board wrth or wrthcut satvents aflev the reflow process
Do not dwectlv expose [o ultrasanrc pvocessmg, wetdrng, or deanmg
Do not appty a vacuum when vepackmg rnrc seated bags a[ a rate taster
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
RECOMMENDED REFLOW PROFILE
Profile Feature
Pb-Free
Time 25°C to Peak
Ramp-down
Ramp-
up
TSMIN
TSMAX
TL
TP
t
L
tP
tS Preheat
Time
25°C
‘( knowles
Meets the requirements of the Euerean RDHS drrectlve ZONES/EC as amended
Meets the requirements or the industry standard lEC stzwzmzooa for halogenated suhstances and Knowles Green Materials Standards Policy section on Halogeanree
Product is Beryiilum Free according to lirnits speciried on the Knowles Hazardous Material List (HSL for Products)
Ozone depleting substances are not used in the product or the processes used to make the product including compounds listed in Annex A, B, and c of the “Montreal
Protocol on Substances Thar Deplete the Ozone Layer
Thermal Shack 100 cycies of airaair thermal shock (mm VAO‘C to +125°C with 15 minute soaks (IEC 68724)
High Temperature Storage 1-105’6 environment for 1,000 hours (IEC 68-2-2 Test Ea)
Low Temperature Storage 40°C environment (or 1,000 hours (IEC 68-2-1 Test Aa)
High Temperature Bias +105‘C environment whlle under bias for 1,000 hours (IEC 68722 Test Ba)
Low Temperature Bias 740°C environment whlle under bias (or 1.000 hours (IEC 68721 Test Aa)
Temperature/Humidity Bias +85°CI85% R.H. environment while under bias (or 1,000 hours (JESDZZaAiDiAaB)
12 minutes in each X, Y, Z axis 1mm 20 to 2,000 Hz wlth peak acceleration of 20 6 (MIL 883E,
“mm" Method 2007.2.A)
ESDVHBM a discharges at 22w direct contact to IIO pins (MIL 0335, Method 3015])
ESDaLlD/GND 3 discharges at 28W direct contact to lid when unit is grounded (IEC 51000472)
ESDVMM 3 discharges at 2200V direct contact to ID pins (ESD STM5.2)
Reflow 5 retiew cycles with peak temperature of +260°c
Mechanical Shock 3 pulses or 10,000 G in each or the x, v, and 2 directions (IEC 687 est Ea)
\lL‘,’ ;
Microphones meet all acoustic and electrical specifications before and after reliability testlngr except sensitivrty Whl
Arter 3 reflect cycles, the sensmvlty or the microphones shall not deiriate more than i dB rrorn its initial vaiue
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
MATERIALS STATEMENT
RELIABILITY SPECIFICATIONS
Test
Description
‘( knowles
A lmtial Release #ECR71771865 8/9/17
B Update dalasheel format 7/16/13
mmrmanon contained hevem \s sub/em m change withom muse u may be used bva party a[ men own «are
habmw m connect/on Wm us use Tm: pub/Icauon .5 no( m be taken as a hoense m aperaxe under any emu
otguaranlee ov assume any
Know/es covpaauon Phone 1/630) 25075100
I151 Maplewood Drwe Fax-1 (630) 2500575
10 llasce, Hllnows 60143 sa‘es@know\es com
' knowles
HIGH SNR SUPPORT BOTTOM PORT
SISONIC™ MICROPHONE
SPECIFICATION REVISIONS
Revision
Specification Changes
Date