Chip Quik Inc. 的 RASW.020 .4OZ 规格书

Test TD-004 or other requ ments as stated Copper Mirror Corrosion Quantitative Halides Electrochemical Migration 85% RH @168 Hours Visual IPc-TM-ssoé 2.6.15 IPC-TM-650: 2.3.28.1 IPC-TM-650: 2.6.14.1 IPC-TM-650: 3.4.2.5 Coalition (EICC) www.chigguikJmm L: No breakthrough M: Slight corrosion L: <0.05% l:=""><1 decade="" drop="" (no-clean)="" clear="" and="" free="" from="" precipitation="">
Datasheet revision 1.0 www.chipquik.com
Solder Wire Sn63/Pb37 Rosin Activated with 2.0% Flux Core .4oz Tube
Product Highlights
RA (Rosin Activated)
2.0% Flux Core
A stronger activated flux for hard to solder surfaces
Specifications
Alloy: Sn63/Pb37
Wire Diameter: 0.020” (0.5mm)
Flux Type: Rosin Activated
Flux Classification: ROM0
Melting Point: 183°C (361°F)
Packaging: .4oz tube
Test Results
Test J-STD-004 or other
requirements as stated
Test Requirement Result
Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrou
g
h
Corrosion IPC-TM-650: 2.6.15 M: Sli
g
ht corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.05%
Electrochemical Mi
g
ration IPC-TM-650: 2.6.14.1 L: <1 decade drop
(
No-clean
)
Surface Insulation Resistance 85°C,
85% RH
@
168 Hours
IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean)
Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship
Coalition
(
EICC
)
Compliant
REACH Compliance Articles 33 and 67 of Regulation (EC)
No 1907/2006
Contains Lead (Pb) CAS# 7439-92-1
No other SVHC presen
t
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: No
1 © 1994-2018 Chip Quik® Inc.
R
RA
AS
SW
W.
.0
02
20
0
.
.4
4O
O
Z