Samtec Inc. 的 HDTF-3-xx-x-RA-xx-yyy Drawing 规格书

WAFER A WAFER s O D H i F1 E E C] C 7]* 5, <7 ”a”="" 4,="" max="" h="" 1="" «7="" bo[,356]="" +="" l.50[.059]="" (tall="" length’="" lru.zas[.uz.s]="" lz="" 13[,477]="" %="" 9.70[.3sz]="" 2.5.0="" 102]="" m="" 2="" 0="" ®="" 2.30[.u9l]="" m:="" emu="" ,-="" 0,4[02]="" 10°="" 13="" 9[.55]="" *="" l-iz="" 9l1="" l]="" a="" *1="" ,64[.065]="" [from="" top="" of="" reno]="" hdtfvra="" pcb="" td="" ‘2="" of="" column="" a="" e="" on="" hdimvvt]="" 0.40[0m]="" (typ11%="" teeeeeeeefiv="" 37xx7x7ra="" xxixxx="" w="" w="" 73="" w="" '04="" wafers="" lc.="" stan="" w="" cwe="" gol="" w="" "b“sfaces="" x="" 150="" :ch="" w="" taele="" 1="" no="" of="" m="" n="" n="" _="" '="" .,="" columns="" "="" b="" c="" m="" 72="" [0="" 28]="" 3="" 540="" [o="" 213]="" ‘15="" 10="" a="" l0="" 421="" 5="" a="" oo="" [o="" 354]="" “a="" 1a="" 4="" lo="" 571="" 7="" 12="" 60="" [0="" a96]="" @123="">
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
PROPRIETARY NOTE
**
.X:
0.25[.010] 1
.XX:
0.13[.005]
.XXX:
-
DECIMALS ANGLES
TOLERANCES ARE:
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS.
DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES]
DO NOT
SCALE FROM
THIS PRINT
-LC: STANDARD
-HS: HIGH SPEED
WAFERS
-04
-06
-08
No. OF COLUMNS
-3
PAIRS PER COLUMN
IMPEDANCE
-100: 100 Ω
-085: 85 Ω
-S: 30µ" SELECTIVE GOLD
IN CONTACT AREA,
MATTE TIN ON TAIL
PLATING
ORIENTATION
-RA: RIGHT ANGLE
HDTF-3-XX-X-RA-XX-XXX
"A"
MAX
0.68 .027
(FROM
C
L
OF HDTF-RA
COMPLIANT TO EDGE OF
HDTM-VT MODULE)
WAFER A
WAFER B
WAFER B
WAFER A
12.8 .50
26.0 1.02
0.4 .02
2.9 .11
0.65 .026
9.80 .386
1.50 .059
(TAIL LENGTH)
0
2.30 .091
13.9 .55
9.70 .382
12.13 .477
1.64 .065
(FROM TOP OF
HDTF-RA PCB TO
C
L
OF COLUMN A
ON HDTM-VT)
-Z-
"B" SPACES
X
1.80
="C"
0.0 .00
(FROM
C
L
OF HDTF-RA COMPLIANT
TO HDTM-VT COMPLIANT)
1.80 .071
'B'
'B'
'C'
'C'
'D'
-Y-
0.40 .016
(TYP)
SIGNAL 1A
FIG 1
(HDTF-3-04-X-RA-XX-XXX
SHOWN)
SHEET OF
MATERIAL:
XCede® 3 PAIR HD RA ASSEMBLY
BY:
HDTF-3-XX-X-RA-XX-XXX
DWG. NO.
DESCRIPTION:
DO NOT SCALE DRAWING
KNOWLDEN
11/10/2016
2
1
SHEET SCALE: 2:1
F:\DWG\MISC\MKTG\HDTF-3-XX-X-RA-XX-XXX-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322
NOTES:
1. TRAYS TO BE STANDARD PACKAGING.
2. CONTACT SAMTEC FOR CONNECTOR PRESS FIT INSTRUCTIONS AND REQUIRED FIXTURES.
INSULATOR: LCP
CONTACT: CU ALLOY
REVISION C
H E' a ‘ , (A *4 g a? [3/ V\ :3 3 L 2] 5*: a :\@\l§ 7‘ E i] :71? Zl‘llfill! w w SEC'HON 'B'V'B' SECT‘ON ‘C'V'C‘ SCALE 3: 1 SCALE 3: 1 VVVVVVVVVVVVV Eta:
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
PROPRIETARY NOTE
**
0
1.40 .055
2.50 .098
3.60 .142
5.00 .197
6.10 .240
7.20 .283
8.60 .339
9.70 .382
SECTION 'B'-'B'
SCALE 3 : 1
(WAFER A)
(HS OR LC OPTIONS)
A WAFER
SYMBOL
0
0.20 .008
1.30 .051
2.40 .094
3.80 .150
4.90 .193
6.00 .236
7.40 .291
8.50 .335
1.20 .047
2.30 .091
SECTION 'C'-'C'
SCALE 3 : 1
(WAFER B)
(HS OR LC OPTIONS)
B WAFER
SYMBOL
0.56 .022
0.48 .019
(FIRST & LAST COLUMNS)
DETAIL 'D'
SCALE 6 : 1
SHEET OF
XCede® 3 PAIR HD RA ASSEMBLY
BY:
HDTF-3-XX-X-RA-XX-XXX
DWG. NO.
DESCRIPTION:
DO NOT SCALE DRAWING
KNOWLDEN
11/10/2016
2
2
SHEET SCALE: 2:1
REVISION C
F:\DWG\MISC\MKTG\HDTF-3-XX-X-RA-XX-XXX-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322