Rohm Semiconductor 的 WSOF5 Taping Spec 规格书

Molding Resin Die Bonding Wire Lead / / / \ Die Attach Die Pad
Package Information : WSOF5
　　　　
　　　　　 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
1.　Package Information
　　　　　　　　　　　　　　　　　　　　
　　Package Name WSOF5
　　 　　Type 　　　SOP
　　 　　Pin Count 　　　5
　　 　　Outline Dimension
Drowing No. 　　　EX129-5001
　　 　　Package Weight [g] 　　　0.0028
　　 　　Lead Finish 　　　Pure Tin
　　 　　MSL Level 　　　Level3
　 　 　 　 　 　 　 　 　 　
　 　
　 　
　　　
　　　 　　　　　　　　　　　　　　　　　　
　 　 　　 　 　 　 　 　 　 　 　 　
　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　
　　 　　　　　　　　　　　　 　　　　　　　　　
2.　Package Structure
　　　　 　　　　　　　　　　 　　　　　　　　　
　 　 　
　　　　
　　　　
　　　　
　　　　
　　　　
　 　
　
　　　
　 　
　　　
　 　 　　
　　　　　
　　　
　 　
　 　
　　 　　　　　　　
　　 　　　　　　　
　 　 　　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　 　　 　　　　　　　　　　　　　　　　　　
　　　　　　　　　　　　　　　　　　　　　　　　　 　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Package Information Reel Hg 1 DuadramAssvgnmentsVor PW 1 Onentanan m Tape E2 PIN1 ‘5 placed «a the top lefl corner TR PW! Is p‘aced to the lap "gm corner TL PW! vs placed wme \owerlefl E1 PM ‘5 p‘aced tome lower ngm Pee‘back 16510 180’ Pee‘back speed 300i10mm/mvn 3L 35 Direction 0! feed Pocket Quadranls —> TSZDZZO1-WSG5-1-2
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.　Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation
Packing Form Tape&Reel
Packing Quantity [pcs] 3,000
PIN 1 Orientation TR
3.2 Use material
　Item Material
Embossed carrier tape PS
Cover tape PET+PE
Reel PS
Desiccant Silicagel
Envelope Aluminum-laminated
Unit box Cardboard
　Shipping box Cardboard
3.3 Leader specification
No component pockets are160 mm or more.
3.4 Trailer specification
No component pockets are 40 mm or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig. 2 Test method
3.6 Missing Ics
(1) No consecutive dropouts.
(2) A maximun 0.1 % of specified number of products in each packing may be missing.
　　　　　　　　　　　 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　 　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Tape Dimension (unitmm) Tape Tolerance 1.83 1.83 $1.5 (470.5 1.75 3.50 0.75 4.00 4.00 2.00 0.25 8.00 $0.1 $0.1 +0.1I-0 10.1 10.1 10.05 10.1 10,1 10.1 10.1 10.05 20.3
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.7.2 Reel Dimension
(unit:mm)
　　　　　 Reel Dimension 　　　　　 Reel Tolerance 　　　
　A　180 　　　　　 +0/-1.5 　　　
B 60 -1.0/-0
C 13 ±0.2
D 21 ±0.8
E 2 ±0.5
W1 9 +1.0/-0
　W2 　11.4 　　　　　 ±1.0 　　　
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Unlt box Label (Unit mm) Ree‘ 185 Desiccant 58 185 Alummurn-Iarninated envelope Product No. Oul going inspeclion stamp BX1234XXX7XX ( Quami‘y\1HIIIIIIHIIHIIHIIIIIIIWWI ‘Z‘UODpcs 0124 ASHUF IIIIIII ll“! K YAMAD BX1234XXX xx ( ) Lol number MND 124 D23 pus MM: 124 024 pcs we wmmpwes /_ Inlemal producx code Markmg lot number Pb Free Mark
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
3.8 Packing Method
2reel(s) or less per unit box
3.9 Packing Style
4unit boxes or less per shipping box
(unit:mm)
Shipping Box Dimension
X 190
Y 255
　Z　　193
3.10 Label Specification
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
4.　Footprint dimensions
(unit:mm)
In actual design, please optimize in accordance with the situation of your board design
and soldering condition.
The lead toe and lead side fillet may not be achieved because of non-lead packages.
The exposed central pad in the center of the package doesn't require electrical connection
to the PCB. The central pad isn't shown in this land pattern, because the quality when connecting
it is not guaranteed.
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Package Information Producmn day Production 0! week code year code Praduchan week code Praducuan code TSZDZZO1-WSOF5-1-2
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
5.　Marking Specification
6.　Storage conditions
6.1 Storage environment
Recommended storage conditions
　　　　　　　　　 Min. 　Max. 　 　 Unit
　Temperature 5 30 °C
　Humidity 40 　70 　 　 % RH
6.2 Storage period
　　　　　　　　　Min. 　Max. 　 　 Unit
　Storage period - 　1　 　 year
6.3 Specified storage period until soldering
　　　　　　　　　 Min. 　Max. 　 　 Unit
　Acceptable time - 　168 　 　 hour
The above value is a time from opening the moisture-proof packaging until the soldering.
Cases where it is necessary to perform the drying process is the following.
Case 1 : in excess of the above-mentioned "Acceptable time"
Case 2 : it has passed more than a year not open
Recommended the dry process conditions
　　　　　　　　　　　　　　　　 Temperature [°C] 　 　 Time [hour] 　
Reel(Note1) 60 　48
Other Heat-proof container 　100 　　　 24 　
(Note1) When carrying out the dry process in a "Reel" state, the peelback strength will change.
Please refer to the following values:
　　　　　　　　　　　　 Min. Max. 　　　 Unit
　Peelback strength 0.2 0.9 　　　 N
The drying process is the impact on the solderability because the oxidation of the terminal portion
will occur. Therefore, specify the maximum times of the dry processing as follows:
Recommended execution count of the dry process
　　　　　　　　　 Min. 　 　 Max. 　Unit
　Execution count - 　 　 2　times
　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Package suflace temperature 260 CMAX Preheafiw remperazure , 130"c~190"c Preheamng zone . 120m MAX Soldering zempemure 220"c~230"c Soldering temperature Somerm zone , 60sec MAx 1~4“ C/sec
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
7.　Soldering conditions
7.1 Recommended temperature profile for reflow
7.2 For wave soldering
The wave soldering method is not supported.
7.3 For solder iron
Rework by soldering iron is not allowed or it may cause mold crack and terminal open.
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Package Information (Nm recommended > (recommended> C> FIeX‘ble mm mountmg board outer lead dxrecllon board bending dwrecuon TSZDZZO1-WSCF5-1-2
WSOF5 　　 　　 　　 　　　　　　　　　　　　　　　　 Package Information
7.4 Caution for solder mounting
7.4.1 For mounting on flexible film
Mounting on flexible film, film bend may occur lack of lead from package,
usage of support board and under fill is recommended.
7.4.2 For Mounting long and narrow board
Mounting on long and narrow board, bending stress may occur a luck of
lead from package, bending board direction and outer lead direction is
recommended as drawing (vertically layout) and under fill usage is recommended.
8.　Appearance inspection criteria for foreign material, void and etc.
This products are made from clear resin.
This products are susceptive damage from foreign material and void in production process.
In case of the foreign material, void and etc. do not affect IC character, this damage are no object.
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
ROHm SEMICONDUCTOR
R1102
A
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© 201 ROHM Co., Ltd. All rights reserved.
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
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equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
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Please use the Products in accordance with any applicable environmental laws and regulations,
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